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Mosaid Announces HDRAM Embedded Memory Technology Has Been Ported to the TSMC's 0.35mm Logic Process.


OTTAWA--(BUSINESS WIRE)--Feb. 25, 1997-- MOSAID Technologies(TSE See Tokyo Stock Exchange.

TSE

1. See Tokyo Stock Exchange (TSE).

2. See Toronto Stock Exchange (TSE).
 MSD. ) MOSAID Technologies Incorporated (TSE:MSD) today announced that the Company has implemented High-Density Random Access Memory, (HDRAM) embedded memory macrocell technology, in the Taiwan Semiconductor Manufacturing Company (TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd
TSMC Taiwan Semiconductor Manufacturing Corporation
TSMC Traffic Systems Management Center
TSMC Toll Station Management Controller
TSMC Transportation Supply Maintenance Command
TSMC Technical Services Manager Code
) 0.35mm ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor.  process technology. The HDRAM macrocell is now available for licensing.

HDRAM is MOSAID's trade name for a proprietary embedded DRAM implementation in standard single polysilicon CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes.  logic processes. HDRAM offers three times the density of embedded SRAM See static RAM.

SRAM - static random-access memory
 (Static Random Access) in the same logic process, allowing unprecedented amounts of memory to be integrated with ASIC logic for higher levels of functionality and performance, and significant cost reduction of existing products. A proprietary p-channel HDRAM 1T memory cell occupies as little as 12mm2 in 0.35mm ASIC process technologies.

A 256k HDRAM macrocell with a general purpose 32-bit interface has been manufactured as a test chip in TSMC's 0.35mm process to characterize and qualify the technology. An HDRAM capacity of 256k represents the optimum tradeoff of performance and density for a 0.35mm process. By combining several macrocells on the same chip, very high bandwidth applications can be achieved by operating a number of macrocells in parallel using the maximum speed of the 66 MHz synchronous interface.

"This macrocell has been designed into the TSMC process technology in order to provide it to the broadest possible range of customers given that TSMC is the largest semiconductor foundry in the world." said George J. J. Cwynar, President and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  of MOSAID. MOSAID provides engineering support to develop custom macrocell configurations or port HDRAM to other processes.

MOSAID also provides test and product engineering support to qualify HDRAM for the licensee's process and achieve full integration into the back end manufacturing flow. The HDRAM macrocell includes redundant rows and columns to replace defective memory locations for improved yield. In order to ensure that the macrocell fits within the manufacturing environment of the ASIC manufacturer, electrically blown fuses are employed to program the redundant rows or columns. HDRAM is also compatible with 3rd party BIST and BISR solutions.

A full datasheet for the general purpose 256k HDRAM macrocell and Verilog(TM)/VHDL models are now available from MOSAID and our distributors. Datasheets, HDL (Hardware Description Language) A language used to describe the functions of an electronic circuit for documentation, simulation or logic synthesis (or all three). Although many proprietary HDLs have been developed, Verilog and VHDL are the major standards.  models, and floorplans for custom configurations or ports to other processes can be delivered within 2 weeks of customer request. This information permits the HDRAM licensee to proceed with the ASIC chip design, including floorplanning, simulation, and place and route. The final, fully verified GDSII GDSII Graphic Design System II  database is delivered within 3 months.

Founded in Ottawa, Ontario, in 1975, MOSAID Technologies, Inc. operates through two divisions. MOSAID's Semiconductor Division designs advanced memory chips for standard memory and application-specific memory (ASM) requirements, while MOSAID's Systems Division designs, manufactures, markets and supports engineering test systems for memory chips. MOSAID has completed multiple designs from the 4k DRAM generation to the 64Mb generation. Listed on the Toronto Stock Exchange Toronto Stock Exchange (TSE)

Canada's largest stock exchange, trading approximately 1,200 company stocks and 33 options.
 under the symbol "MSD," MOSAID is headquartered in Canada with facilities in Carp, (near Ottawa) Ontario; Santa Clara, Calif.; and Tokyo, Japan. Further information about the company is available on the World Wide Web at http://www.mosaid.com.

CONTACT: MOSAID Technologies Incorporated

Sue Rutherford, ABC ABC
 in full American Broadcasting Co.

Major U.S. television network. It began when the expanding national radio network NBC split into the separate Red and Blue networks in 1928.
, 613/ 836-3134
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Copyright 1997, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Feb 25, 1997
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