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More Moore Develops Innovative Microscope Technology Capable of Viewing Features as Small as 20 Nanometers.


VELDHOVEN, the Netherlands -- More Moore, a research project funded by the European Commission to promote the development of Extreme Ultra Violet Lithography (EUVL EUVL Extreme-Ultraviolet Lithography ) in Europe, announces a significant breakthrough by three of the participants in the project, instruments manufacturer Focus GmbH and two German universities, Bielefeld and Mainz.

Working together, these More Moore participants have created a photoemission Photoemission

The ejection of electrons from a solid (or less commonly, a liquid) by incident electromagnetic radiation. Photoemission is also called the external photoelectric effect.
 electron microscope capable of measuring features as small as 20 nanometers (nm), without destroying the sample. Recently they identified defects of 50 nm buried under the multilayer coating of a mask blank.

A typical application for EUVL is "mask blank inspection" and this requires keeping the sample intact during inspection. Until now, this was not possible. Common methods such as scanning electron microscopy cannot identify defects hidden beneath the multilayer coating of the EUVL mask blank. This is therefore an important step for EUV EUV Extreme Ultraviolet
EUV Exclusive Use Vehicle
EUV Extreme Ultra Violet
 technology. Masks are an important part of the infrastructure, required for the successful introduction of EUVL technology.

The Commission has funded More Moore in the amount of EUR EUR

In currencies, this is the abbreviation for the Euro.

Notes:
The currency market, also known as the Foreign Exchange market, is the largest financial market in the world, with a daily average volume of over US $1 trillion.
 23.25 million for 36-months, ending late 2006. The aim of the project, led by ASML ASML Abstract State Machine Language
ASML Anisotropic Shielded Microstrip Line
 from the Netherlands, is to resolve technical problems of EUVL so the technology can timely be introduced for volume production.

EUVL will be the next generation technology used by the semiconductor industry to manufacture integrated circuits, with ever-smaller features. Smaller features - starting at 32 nm instead of the 65 nm common today -- allow chipmakers to fit more transistors on each chip or make more complex chips. Transition to EUVL technology will enable the continuation of increased number of transistors per square mm consistent with Moore's law, which predicts the computing power of semiconductors should double roughly every two years.

Microchips are produced with optical lithography by projecting light through a transparent (UV) or reflecting (EUV) mask onto the surface of a silicon wafer that is covered by a photosensitive A material that changes when exposed to light. See photoelectric.  layer. The small structures on the mask are etched onto the silicon, creating the features of the semiconductor.

"We are proud that More Moore could contribute so significantly to the advancement of EUVL technology and are thankful for the EU support that makes this possible," says Rob Hartman, ASML's Director Strategic Technology Program and leader of the More Moore project.

"The European funding is an excellent support of our R&D activities and we are pleased that we could achieve such an important result," says Michael Merkel, Managing Director of FOCUS.

About More Moore

The More Moore project involves large and small companies from around Europe, including ASML, Phystex, Zeiss, AMTC AMTC Applied Media Technologies Corporation
AMTC Aerospace Manufacturing Technology Centre (Canada)
AMTC American Modeling and Talent Convention
AMTC Army Missile Test Center (White Sands Missile Range, NM) 
, Philips EUV, XTREME technologies, FOCUS, SIGMA-C, AZ Electronic Materials, Schott Lithotec, Philips, XENOCS, Sagem Defense Securite, Imagine Optic, EPPRA and Media Lario. Academic and research institutions participating in More Moore include IMEC, CEA CEA carcinoembryonic antigen.

CEA
abbr.
carcinoembryonic antigen


CEA (Carcinoembryonic antigen) 
 Leti, CNRS CNRS Centre National de la Recherche Scientifique (National Center for Scientific Research, France)
CNRS Centro Nacional de Referencia Para El Sida (Argentinean National Reference Center for Aids) 
, TNO, FOM Rijnhuizen, Fraunhofer Institute, ISAN and IPM RAS (Russian Institutes of Science), ENEA ENEA Ente per le Nuove Tecnologie l'Energia e l'Ambiente (Italian National Board for New Technology, Energy and the Environment)
ENEA European Neuroendocrine Association
ENEA European Nuclear Energy Agency
ENEA European Nursing Education Association
, ELETTRA, and NCSR NCSR National Center for Scientific Research
NCSR National Centre for Social Research (UK; formerly Social and Community Planning Research)
NCSR National Compound Semiconductor Roadmap
 as well as universities of Bielefeld, Mainz, Delft and Birmingham. All members are highly specialised in the key areas of EUVL and work under the coordination of ASML, the leading producer of lithography equipment used for semiconductor manufacture. For more information on the consortium, please visit our website: https://www.euvlitho.net/MoreMoore.

About FOCUS GmbH

FOCUS GmbH, established in 1990 and based near Wiesbaden, Germany, is a developer and producer of scientific instruments for nanotechnology and nanoanalytics. All Focus devices fulfil the highest demands in versatility and sustainability and represent the most recent scientific and technical knowledge in the field of electron optics and surface science. FOCUS routinely conducts joint projects together with research institutes and universities to develop dedicated scientific instrumentation. For more information please see www.focus-gmbh.com.
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Publication:Business Wire
Date:Sep 6, 2006
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