Mitsubishi Electronics Unveils New 3D-RAM5 -- Industry's First Silicon to Provide Kilobit Memory Bus for Unprecedented 3D Graphics Rendering.SUNNYVALE, Calif.--(BUSINESS WIRE)--July 26, 1999--
New Architecture Offers 40 Mbits of Graphics Memory, Plus Hardware
Accelerator, Linked by a 1024-bit 9-Gbyte Per Second Bus
Mitsubishi Electronics America's Electronic Device Group today announced the 3D-RAM See dynamic RAM. 5 (M2V M2V Mpeg 2 Video (file extension) 40092DWG) integrated frame buffer memory architecture, the industry's first silicon combining DRAM and logic with a 1024-bit internal bus for 3D graphics. 3D-RAM5 is designed in Mitsubishi's 0.25m HyperDRAM(tm) process technology and integrates four times the density of the fourth-generation 3DRAM (3DRAM4) into a package that is only 3.2 percent larger. As result, 3DRAM5 supports high-resolution, large-screen displays with 75 percent fewer chips for high-end 3D graphics applications, such as digital content creation The development of newsworthy, educational and entertainment material for distribution over the Internet or other electronic media. See DAMS. -- in its preferred 16:9 high-definition television (HDTV (High Definition TV) A set of digital television (DTV) standards that offer the highest resolution and sharpest picture. Although some HDTV sets are available in standard (rather square) screen sizes, the overwhelming majority of sets are wide screen, which eliminates ) format -- and mechanical computer aided design (application) Computer Aided Design - (CAD) The part of CAE concerning the drawing or physical layout steps of engineering design. Often found in the phrase "CAD/CAM" for ".. manufacturing". (MCAD MCAD Microsoft Certified Application Developer
MCAD Mechanical Computer Aided Design
MCAD Medium-Chain Acyl-CoA Dehydrogenase (inherited metabolic disease)
MCAD Minneapolis College of Art and Design ).
Moving hardware acceleration for raster operations, blending, and stencil modes from a separate graphics controller to the memory chip while at the same time widening the memory bus to a full kilobit enables unprecedented 3D pixel rendering speed while minimizing power consumption. Thanks to its memory bus width and to a 14 percent increase in the chip's clock rate, the bus delivers a 9 Gbyte per second data rate. A typical application uses at least four pieces of 3D-RAM5 per system, resulting in an unmatchable 36Gbyte per second minimum aggregate data bandwidth from the frame buffer DRAM.
"Mitsubishi's revolutionary technique in 3DRAM5 of putting four 3D-RAM4 chips into the space of one reduces by half the cost-per-bit of the previous 3DRAM generation," said Steve Forman, product manager for application-specific memories at Mitsubishi Electronics America. "By dramatically lowering chip count, Mitsubishi has also sharply reduced the number of I/O pins that load the rendering controller as well as the required board size. As a result, customers benefit from sharply reduced power, heat, and noise in the 3D graphics accelerator subsystem."
The 3DRAM5 architecture allows each M2V40092DWG chip to incorporate 40 Mbits of embedded DRAM in four interleaved banks (accessed via a 1024-bit wide memory bus), plus a dedicated hardware accelerator and an SRAM See static RAM.
SRAM - static random-access memory pixel buffer. The new chips support all of the blending and stencil modes for industry-standard application programming interfaces (APIs) such as OpenGL(R) specification 1.2 and its optional imaging extensions, and Microsoft's DirectX(R) 7.0.
3D-RAM Architectural Details
The 3DRAM5 architecture provides four banks of synchronous DRAM, 8 Kbits of on-chip triple-ported SRAM cache, and an on-chip arithmetic logic unit See ALU. (ALU (Arithmetic Logic Unit) The high-speed CPU circuit that does calculating and comparing. Numbers are transferred from memory into the ALU for calculation, and the results are sent back into memory. Alphanumeric data are sent from memory into the ALU for comparing. ). The fully OpenGL compliant ALU eliminates the need for read-modify-write (RMW) operations between the rendering controller and the frame buffer. The result is a true "write-only" interface for all the blending, depth check, stencil (as described in the OpenGL specification), and 256 raster operations for Microsoft Windows(R) 95 and 98 device-independent bitmapped display drivers.
Integrating DRAM and logic together on the same die, the original 3DRAM was one of the first products to incorporate Mitsubishi's acclaimed eRAM(tm) technology.
Eight major global customers are now using the original 3D-RAM technology in their products, including Sun Microsystems, IBM, Real3D, and Evans & Sutherland. Several PC OEMs have chosen this technology for their personal workstation family of products, including Compaq, Hewlett-Packard, Siemens, and Gateway.
Packaging and Availability
The 3D-RAM5 (M2V40092DWG) is available in a 256pin plastic ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation).
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (PBGA PBGA Plastic Ball Grid Array ) package that occupies a 17mm x 17mm footprint, and is functionally and electrically backward compatible to previous 3D-RAM generations. Samples are now available, with volume production scheduled to begin in the fourth quarter of 1999.
About Mitsubishi Electric and Mitsubishi Electronics America
Mitsubishi Electric Corporation pioneered the integration of DRAM, SRAM and logic on the same piece of silicon with its successful 3DRAM and Cache DRAM (CDRAM (Cached DRAM) A high-speed DRAM memory chip developed by Mitsubishi that includes a small SRAM cache. ) advanced graphics memory architectures and is the only company to successfully integrate memory -- especially DRAM -- processor and other core logic functions in the same piece of silicon with its highly acclaimed eRAM(tm) technology. Mitsubishi markets its graphics memories and 3D graphics products in North America through the Electronic Device Group of Mitsubishi Electronics America Inc.
Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electronics America Inc., are world-class suppliers of semiconductors and electronic products for computers, communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including embedded DRAM/flash/SRAM, ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. , ASSP (Application Specific Standard Part) An ASIC chip that is designed as a generic device for a particular market. Whereas an ASIC is typically used only by its creator, ASSPs are used by many different companies in the design of their products. See ASIC. , MCU, discrete memory, graphics, microwave/RF, optoelectronic, storage, and flat-panel display products.
Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com.
eRAM and HyperDRAM are trademarks of Mitsubishi Electronics America Inc. DirectX and Windows are registered trademarks of Microsoft Corporation. OpenGL is a registered trademark of Silicon Graphics, Inc.
3D-RAM, embedded DRAM, synchronous DRAM, SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. , eRAM, HyperDRAM, wide data bus, DRAM, frame buffer memory, application specific memory, graphics accelerator memory, frame buffer, 3Dgraphics, 3D, graphics.