Mitsubishi Electric and Kyocera Introduce World's Smallest Triple-Band Compatible E-GSM/DCS/PCS Transmitter Module.Business Editors and High Tech Writers SUNNYVALE, Calif.--(BUSINESS WIRE)--Sept. 30, 2002 With 0.1-cc Package Size, New Device Also Improves Power Amplifier Efficiency The Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc., today announced that its parent, Mitsubishi Electric Corporation, and the Electronic Component Group of Kyocera Corporation have introduced the world's smallest triple-band compatible E-GSM(1)/DCS(2)/PCS(3) transmitter module for cellular phone applications. The second product in a highly integrated transmitter module family jointly developed by the two companies, the device occupies only 0.1 cubic centimeter -- a 50 percent size reduction from the family's first product, introduced in July 2001. It also improves the effective power-amplifier efficiency by 5 to 8 percent, compared to a conventional power amplifier module solution. "The newest transmitter module from Mitsubishi Electric and Kyocera achieves a higher level of integration than ever before, combining three bands in a module that is 50 percent smaller," said Bryon Gutow, senior product marketing manager for microwave and RF products at Mitsubishi Electric & Electronics USA, Inc. "The triple-band transmitter coverage enables cellular phone designs to be leveraged across several markets, thereby reducing development costs. In addition, the space savings enabled by the transmitter module's dramatically reduced package size permits customers to integrate more advanced components into next-generation cellular phones, so they can deliver more powerful and sophisticated functionality." The new transmitter module attains its remarkably small size primarily through design improvements that enable an 83 percent size reduction of the RF section area, compared to traditional discrete circuitry. The transmitter module integrates an antenna switch module, RF power amplifier An RF power amplifier is a type of electronic amplifier used to convert a low-power radio-frequency signal into a larger signal of significant power, typically for driving the antenna of a transmitter. , and RF output power monitor coupler in the same unit, along with an EN61000-compliant electrostatic discharge (ESD (1) (Electronic Software Distribution) Distributing new software and upgrades via the network rather than individual installations on each machine. See ESL. ) protection circuit. The module features Mitsubishi Electric's new high efficiency InGaP(4) HBT(5) MMIC (Monolithic Microwave IC) An integrated circuit used in high-frequency applications such as mobile phones. Also known as "monolithic microwave/millimeter-wave IC," MMICs combine transistors and passive devices (resistors, capacitors, etc. (6) design and manufacturing technologies and Kyocera's high Q-factor LTCC LTCC Lake Tahoe Community College LTCC Low Temperature Cofired Ceramic LTCC Long Term Consumer Care, Inc. LTCC London Traffic Control Centre (UK) LTCC Long Term Care Consultation LTCC London Terminal Control Centre (7) substrate and low-loss antenna switch technologies. The module achieves power efficiency improvements on the antenna terminal of the module by combining the high-efficiency InGaP HBT MMIC, power amplifier, and low-loss antenna switch module together and optimizing the design of the antenna switch circuit and matching circuit. The power efficiency at the antenna is 43 percent for E-GSM applications and 36 percent for DCS/PCS applications. At the power amplifier, this is equivalent to a power efficiency of 60 percent for E-GSM applications and 56 percent for DCS/PCS applications. The module's high integration makes designing an external impedance-matching circuit unnecessary, thereby shortening design cycle time, saving engineering resources, and reducing product development costs. Availability and Pricing Mitsubishi Electric and Kyocera will sample the E-GSM/DCS/PCS triple-band transmitter module in October 2002, with volume production scheduled for June 2003. Mitsubishi Electric will sell the product under the part number BA01303 for $8.50 each in sample quantities. Definitions: (1) E-GSM = Enhanced-Global System for Mobile Communication (2) DCS = Digital Cellular System (3) PCS = Personal Communication Service (4) InGaP = Indium Gallium Phosphide Indium gallium phosphide (InGaP) is a semiconductor composed of indium, gallium and phosphorus. It is used in high-power and high-frequency electronics because of its superior electron velocity with respect to the more common semiconductors silicon and gallium arsenide. (5) HBT = Hetero-junction Bipolar Transistor (6) MMIC = Microwave Monolithic Integrated Circuit The common form of chip design, in which the base material (substrate) contains the pathways as well as the active elements that take part in its operation. (7) LTCC = Low Temperature Co-fired Ceramic About Kyocera Corporation Kyocera Corporation, the parent and global headquarters of the Kyocera Group, was founded in 1959 as a producer of advanced ceramics. By combining these engineered materials with metals and plastics, and integrating them with other technologies, Kyocera has become a leading supplier of telecommunications equipment, semiconductor packages, electronic components, cameras, laser printers, copiers, solar energy systems and industrial ceramics. During the year ended March 31, 2002, Kyocera Corp.'s consolidated net sales totaled 1,034,574 million JPY JPY In currencies, this is the abbreviation for the Japanese Yen. Notes: The currency market, also known as the Foreign Exchange market, is the largest financial market in the world, with a daily average volume of over US $1 trillion. (US$ 7.78 billion) with net income of 31,953 million JPY (US$ 240.25 million). Additional information on the Kyocera Group is available at: http://global.kyocera.com. About Mitsubishi Electric & Electronics USA, Inc. Mitsubishi Electric Corporation manufactures a diverse range of microwave and RF semiconductors for linear, low-noise, and high-power communications applications, including satellite and terrestrial transmitters and receivers, mobile radios, cellular phones, and subscriber units. The company produces gallium-arsenide (GaAs) FETs, modules, and MMICs using HBT, PHEMT See FET. , MESFET See FET. , HEMT See FET. , and HFET HFET Highway Fuel Economy Test HFET Heterostructure Field-Effect Transistor HFET Human Factors Engineering Testing HFET Heilmann-Feynman Electrostatic Theorem technologies. The company also produces silicon RF power transistors and modules using MOS and LDMOS LDMOS Laterally Diffused Metal Oxide Semiconductor LDMOS Lateral DMOS LDMOS Lightly-Doped Drain Metal-Oxide Semiconductor LDMOS Lateral Diffusion Mosfet technologies for the industrial and consumer markets. Mitsubishi Electric markets its microwave and RF semiconductors in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc. Mitsubishi Electric Corporation and its North American affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including DRAM, flash, SRAM See static RAM. SRAM - static random-access memory , ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. , ASSP (Application Specific Standard Part) An ASIC chip that is designed as a generic device for a particular market. Whereas an ASIC is typically used only by its creator, ASSPs are used by many different companies in the design of their products. See ASIC. , MCU, microwave/RF, and optoelectronic devices. Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/. Keywords: Mitsubishi, InGaP HBT, MMIC, E-GSM, DCS, PCS, transmitter, microwave. |
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