Mitsubishi Electric Offers 2-Gbyte Registered DIMMs for High-End Servers and Workstations, and 512-Mbyte PC2700 SO-DIMMs for Notebook Computers.Business Editors/High-Tech Writers SUNNYVALE, Calif.--(BUSINESS WIRE)--Oct. 30, 2001 The Electronic Device Group of Mitsubishi Electric Mitsubishi Electric Corporation (三菱電機株式会社 & Electronics USA, Inc., today announced DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory (1) and SDR See software defined radio. (2) synchronous DRAM Synchronous DRAM - Synchronous Dynamic Random Access Memory (SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. ) based DIMM (Dual In-Line Memory Module) A printed circuit board that holds memory chips and plugs into a DIMM socket on the motherboard. See memory module. DIMM - Dual In-Line Memory Module (3) families as large as 2 Gbytes for main memory applications in high-end servers and workstations, and PC2700 SO-DIMM See SODIMM. SO-DIMM - Small Outline DIMM (4) families as large as 512 Mbytes for main memory uses in notebook computers. The high-density module families use Mitsubishi Electric's discrete 512- or 256-Mbit DDR or SDR SDRAMs, which are manufactured in a leading-edge 0.15-um CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. process technology. Using the 256-Mbit device in an innovative sTSOP(5) package, Mitsubishi Electric can offer cost-effective 512-Mbyte SO-DIMMs for notebook computers without requiring that DRAM packages be stacked. DDR SDRAM See DDR. modules with up to a PC2700 speed grade will be built with DDR SDRAM chips that have up to a DDR333 speed grade, depending on the configuration. PC2700 DDR SDRAM modules support a 2.7-Gbyte-per-second data transfer rate. SDR SDRAM modules will be available in the PC133 speed grade. "Moving to the 0.15-um CMOS process technology enables Mitsubishi Electric to offer several types of high-density DDR and SDR SDRAM module families sought by customers who make high-end servers and workstations," said Sudeep Sharma, associate vice president of memory marketing at Mitsubishi Electric & Electronics USA, Inc. "For example, customers who develop servers for Internet Web hosting or make workstations for high-end electrical and mechanical CAD applications must have the highest-density DRAMs available for their products." "Our process technology and packaging expertise help to drive Mitsubishi Electric's second-generation 256-Mbit DDR and SDR SDRAM chips into our extremely small sTSOP packaging," adds Sharma. "These factors converge to make our exceptionally fast PC2700 high-density SO-DIMMs available, with no DRAM stacking required, to customers who build high-end notebook PCs. In summary, Mitsubishi Electric's transition to the 0.15-um technology gives customers dramatically expanded module options to consider for their high-end system designs." Mitsubishi Electric uses 32 or 36 DRAM chips to make its 2-Gbyte and 1-Gbyte registered DIMMs, depending on whether the modules use 512- or 256-Mbit devices. The 512-Mbyte SO-DIMMs use 16 256-Mbit DRAM chips. Availability and Pricing Samples of 2-Gbyte registered DIMMs will be available in December 2001, with volume production scheduled for the first quarter of 2002. Samples of 1-Gbyte registered DIMMs and 512-Mbyte SO-DIMMs will be available in November 2001, with volume production scheduled for the first quarter of 2002. Sample pricing for the MH56S72VJN, a 2-Gbyte SDR SDRAM-based registered DIMM built using 512-Mbit devices in TSOP (Thin Small Outline Package) A very thin, plastic, rectangular surface mount chip package with gull-wing pins on its two short sides. TSOPs are about a third as thick as SOJ chips. See gull-wing lead, SOP, SOJ and chip package. II packages, is $3,700 each. Complete families of registered DIMMs and SO-DIMMs will be available. Here are the product numbers for a few leading-edge modules: -- MH56D72KLN -- 2-Gbyte DDR SDRAM-based registered DIMM, built using 512-Mbit devices in TSOP II packages. -- MH28D72ALTG -- 1-Gbyte DDR SDRAM-based registered DIMM, built using 256-Mbit devices in sTSOP packages. -- MH64S64APFH -- 512-Mbyte SDR SDRAM-based SO-DIMM, using 256-Mbit devices in sTSOP packages. Definitions: (1) DDR -- Double Data Rate (2) SDR -- Single Data Rate (3) DIMM -- Dual In-line Memory Module See DIMM. (storage) Dual In-line Memory Module - Small circuit boards carrying memory integrated circuits, with signal and power pins on both sides of the board, in contrast to single-in-line memory modules (SIMM). (4) SO-DIMM -- Small Outline DIMM (storage) Small Outline DIMM - (SO-DIMM) A smaller kind of DIMM with 72 pins (supporting 32-bit transfers) or 144 pins (64-bit transfers). Regular DIMMs have 168 pins and support 64-bit transfers. (5) sTSOP-- small TSOP (Thin Small Outline Package) About Mitsubishi Electric & Electronics USA, Inc. Mitsubishi Electric Corporation is one of the world's top-10 DRAM suppliers and aggressively develops advanced DRAMs, such as DDR and SDR SDRAMs, RDRAM (Rambus DRAM) Pronounced "r-d-ram." A dynamic RAM chip technology from Rambus, Inc., Los Altos, CA (www.rambus.com). Rambus licensed its memory designs to semiconductor companies, which manufactured the chips. (R), and other emerging industry-standard DRAM types to support current and future customer requirements. Mitsubishi Electric is the first company to successfully integrate the process technologies of DRAM and processor logic with its highly acclaimed eRAM(TM) system integration technology, and has shipped embedded DRAM products in high volume for longer than any other supplier. eRAM is Mitsubishi Electric's brand name for its silicon process technology, products, and systems expertise that integrate memory and system-level core functions on the same integrated circuit to enable unprecedented overall system performance. A top-tier semiconductor supplier, Mitsubishi Electric markets memory products and an extensive range of other semiconductors in North America through the Electronic Device Group of Mitsubishi Electric & Electronics USA, Inc. Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/. Trademark Information eRAM is a trademark of Mitsubishi Electric & Electronics USA, Inc. RDRAM is a registered trademark of Rambus Inc. All other companies and products referenced herein are trademarks or registered trademarks of their respective holders. Keywords Mitsubishi, DDR, SDRAM, Synchronous DRAM, DRAM, PC2700, PC2100, PC1600, DDR333, PC133, DIMM, SO-DIMM, sTSOP. |
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