Mitsubishi Electric Launches 16-Mbit Low-Power SRAM in Ultra-Small Package.Business Editors/High-Tech Writers SUNNYVALE, Calif.--(BUSINESS WIRE)--Nov. 20, 2002 The Electronic Device Group of Mitsubishi Electric Mitsubishi Electric Corporation (三菱電機株式会社 & Electronics USA, Inc., a leading Low-Power SRAM See static RAM. SRAM - static random-access memory (LPSRAM) supplier, announced a new ultra-small, cost-effective 16-megabit (Mbit) LPSRAM that fits into a 48-ball FBGA FBGA Fine-Pitch Ball Grid Array FBGA Fine Pitch Bga FBGA Fine Line Bga (1) chip-scale package with a 7.5-mm by 8.5-mm footprint. Ideal for cellular handsets and other space-constrained applications, the new device achieves the 16-Mbit density by stacking two 8-Mbit LPSRAM die into one package. "As our customers migrate to the 16-Mbit density, they have two requirements: keep the package size small and keep the cost-per-bit down," said Tad Keeley, senior product marketing manager for SRAMs at Mitsubishi Electric & Electronics USA, Inc. "By leveraging our leading-edge packaging technology, we have produced a 16-Mbit LPSRAM in the smallest package available in the industry. We also reduced costs by leveraging our current LPSRAM process technology and have passed this benefit on to our customers." The new 16-Mbit LPSRAM is both forward and backward compatible with Mitsubishi Electric's 4- to 32-Mbit LPSRAM family, allowing easy migration to higher or lower density SRAMs that use the same FBGA package. The new 16-Mbit LPSRAM is also available in a 52-pin uTSOP(2) package with a 10.49-mm by 10.79-mm footprint. Manufactured in 0.18-um CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. process technology, Mitsubishi Electric's 16-Mbit LPSRAM requires a single, 2.7-3.6 volt power supply and provides a standby current of 1 uA at 3.0 volts (typical). The LPSRAM provides access times as fast as 70 nanoseconds and operates throughout an industrial temperature range (-40 to +85 degrees Celsius) for increased durability. Availability and Pricing Samples of the FBGA (M5M5J167WG) and uTSOP (M5M5J167KT) package versions of Mitsubishi Electric's 16-Mbit LPSRAM are available now, with volume production scheduled for January 2003. Sample pricing is $20 each. Definitions (1) FBGA = Fine-Pitch Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (2) uTSOP = Micro Thin Small Outline Package About Mitsubishi Electric & Electronics USA, Inc. Mitsubishi Electric Corporation is one of the leaders in providing high-speed and low-power SRAM products in small package sizes, and is known throughout the industry as a market-driven memory supplier to its OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and customer base. The company typically supports low-power SRAM products over many process generations and has supported the 256-Kbit product since 1985. Mitsubishi Electric also combines its low-power SRAMs with its DINOR BGO BGO Bismuth Germanate BGO Baguio City (Philippines) BGO Blinding Glimpse of the Obvious BGO Bergen, Norway - Flesland (Airport Code) BGO Blue and Gold Officer (United States Naval Academy) flash memory in its leading-edge MCP (1) See Microsoft certification. (2) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). packaging technology for cellular handset applications. Mitsubishi Electric Corporation and its North American North American named after North America. North American blastomycosis see North American blastomycosis. North American cattle tick see boophilusannulatus. affiliate, Mitsubishi Electric & Electronics USA, Inc., are world-class suppliers of semiconductors and electronic products for communications, industrial, Internet-enabled, automotive, and visual applications. Mitsubishi Electric combines its systems-level expertise and high-level silicon process technologies to provide chip, chipset, and system-on-chip solutions. The company is ranked among the top-tier worldwide semiconductor suppliers and offers an extensive range of semiconductor and computer system components for the North American marketplace, including microcontroller, ASSP (Application Specific Standard Part) An ASIC chip that is designed as a generic device for a particular market. Whereas an ASIC is typically used only by its creator, ASSPs are used by many different companies in the design of their products. See ASIC. , ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor. , flash, SRAM, DRAM, optoelectronic, and microwave/RF devices. Additional information on the Mitsubishi Electric Semiconductor Group is available at http://www.mitsubishichips.com/. Trademark Information Mitsubishi and the Mitsubishi logo are registered trademarks of Mitsubishi Electric Corporation in the USA, Japan, and other countries. All other companies and products referenced herein are trademarks or registered trademarks of their respective holders. Keywords Mitsubishi, SRAM, Low-Power SRAM, LPSRAM, FBGA, Cellular, Wireless, Mobile. |
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