Mindspeed(R) Announces PWE3 Solution for Wireless Backhaul.

NEWPORT BEACH, Calif. -- Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced an Internet Protocol (IP)-based backhaul transport solution for wireless service providers based on its TSP3 family of network processors and PortMaker([R])III software suite with pseudo-wire emulation edge to edge (PWE3). PWE3 and PortMakerIII enable the implementation of an IP-based backhaul network for third-generation W-CDMA, UMTS, and WiMax services.

"The wireless market represents a significant opportunity for Mindspeed products designed to process and transport voice and data between legacy circuit-switched and next generation packet-based networks," said Taqi Mohiuddin, director of marketing for Mindspeed. "Our TSP3 processing solution with PWE3 integrated into base station equipment enables service providers to utilize low-cost packet access networks as a full-service backhaul alternative to traditional time-division multiplexing (TDM) for both voice and data wireless services."

Mindspeed's TSP3 and PortMakerIII solution with PWE3 also enables service providers to seamlessly interconnect their existing ATM backbone networks with new Ethernet backhaul networks and a converged IP/MPLS core.

Mindspeed's high-performance TSP3 network processors are designed specifically for wireless backhaul, access and enterprise applications requiring programmable traffic management and Layer-2 protocol interworking. The TSP3 family provides wire-speed performance by combining a networking-optimized, customized microprocessor with powerful hardware engines. TSP3 applications deliver quality of service (QoS) and network domain adaptation for managing and interworking packet and/or cell streams. PortMakerIII supports PWE3 based on recently released Internet Engineering Task Force (IETF) request for comments (RFCs) and emerging draft standards.

PortMakerIII firmware provides proven, reliable, and fully supported binary applications for the TSP3 family of devices. The PortMakerIII packet traffic management application is one of a suite of off-the-shelf applications for the TSP3 hardware platform. It provides up to 2.5 Gbps throughput, fine-grained hierarchical traffic management on up to 256K packet streams, ultra-accurate token bucket shaping, multi-protocol classification and a rich set of value-added features. The TSP3 family of network processors consists of ranging in speed from 155M through 2.5G.

The PortMakerIII application is available now as a standard off the shelf firmware package and provided with the TSP3 M27480, M27481, M27482, and M27483 devices.

About Mindspeed Technologies[R]

Mindspeed Technologies, Inc. designs, develops and sells semiconductor networking solutions for communications applications in enterprise, access, metropolitan and wide area networks.

The company's three key product families include high-performance analog transmission and switching solutions, multiservice access products designed to support voice and data services across wireline and wireless networks, and WAN communications solutions including T/E carrier physical-layer and link-layer devices, as well as ATM/MPLS network processors.

Mindspeed's products are used in a wide variety of network infrastructure equipment including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers and digital loop carrier equipment.

To learn more, visit us at www.mindspeed.com.

Safe Harbor Statement

This press release contains statements relating to Mindspeed, and our future results, including certain projections and business trends, that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results, and actual events that occur, may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: market demand for our new and existing products and our ability to increase our revenues; our ability to maintain operating expenses within anticipated levels; our ability to reduce our cash consumption; availability and terms of capital needed for our business; constraints in the supply of wafers and other product components from our third-party manufacturers; the ability to attract and retain qualified personnel; successful development and introduction of new products; obtaining design wins and developing revenues from them; pricing pressures and other competitive factors; order and shipment uncertainty; fluctuations in manufacturing yields; product defects; and intellectual property infringement claims by others and the ability to protect our intellectual property, as well as other risks and uncertainties, including those detailed from time to time in our Securities and Exchange Commission filings.