Mindspeed(R) Transimpedance Amplifier Boosts Sensitivity, Reduces Cost of Deploying Fiber to the Home.

Best-in-Class Sensitivity Enables Lower-Cost Receiver, Cuts Test Costs for Gigabit Passive Optical Networks (GPONs)

NEWPORT BEACH, Calif. -- Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that it will demonstrate a new 2.5 gigabits-per-second (Gb/s) transimpedance amplifier (TIA) offering best-in-class sensitivity of -29dBm at the Fiber Optics Expo in Tokyo, January 24-26, 2007.

Mindspeed's M02024 TIA is designed to cut costs and extend the performance margin in fiber-to-the-home (FTTH) optical network unit and terminal (ONU/ONT) receiver applications. The ITU-T G.984.2 Class B+ standard specifies a link budget of 28dB. Mindspeed's M02024 can help optical module manufacturers to meet the standard with a lower-cost receiver.

"We're excited to demonstrate the benefits of our new M02024 TIA, which enables our GPON customers to use low-cost positive-intrinsic-negative (PIN) photodiodes instead of traditional avalanche photodiodes (APDs)," said Hasnain Bajwa, vice president of marketing at Mindspeed. "Typically APDs, along with all the custom circuitry they require, cost more than 10 times PIN photodiodes. The extraordinary savings in ONU/ONT bill of material costs will help pave the way for GPON deployments worldwide."

The M02024's higher sensitivity provides additional production margin enabling customers to increase yield by eliminating sensitivity testing in the manufacturing line. In addition, the device incorporates an on-chip filter that eliminates the need for an external capacitor on the photodiode cathode, further reducing the overall cost of ownership. The device also includes automatic gain control (AGC) that provides dynamic range of more than 35dB, and is fabricated in sub-micron complementary oxide semiconductor (CMOS) process for high performance. Other features include a typical bandwidth of 1.8 Ghz, error free operation with input signals of +6dBm for loopback tests, and an input power monitor that provides exceptional accuracy across the full input power range.

Sampling now, the M02024 TIA is scheduled to enter volume production in the second calendar quarter of 2007. Mindspeed will demonstrate the M02024's performance, along with other Mindspeed PMD devices, at booth # 2-47 at the Fiber Optics Expo in Tokyo, January 24-26, 2007.

About Mindspeed Technologies[R]

Mindspeed Technologies, Inc. designs, develops and sells semiconductor networking solutions for communications applications in enterprise, access, metropolitan and wide area networks.

The company's three key product families include high-performance analog transmission and switching solutions, multiservice access products designed to support voice and data services across wireline and wireless networks, and WAN communications solutions including T/E carrier physical-layer and link-layer devices, as well as ATM/MPLS network processors.

Mindspeed's products are used in a wide variety of network infrastructure equipment including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers and digital loop carrier equipment.

To learn more, visit us at www.mindspeed.com.

Safe Harbor Statement

This press release contains statements relating to Mindspeed, and our future results, including certain projections and business trends, that are "forward-looking statements" as defined in the Private Securities Litigation Reform Act of 1995. Actual results, and actual events that occur, may differ materially from those projected as a result of certain risks and uncertainties. These risks and uncertainties include, but are not limited to: market demand for our new and existing products and our ability to increase our revenues; our ability to maintain operating expenses within anticipated levels; our ability to reduce our cash consumption; availability and terms of capital needed for our business; constraints in the supply of wafers and other product components from our third-party manufacturers; the ability to attract and retain qualified personnel; successful development and introduction of new products; obtaining design wins and developing revenues from them; pricing pressures and other competitive factors; order and shipment uncertainty; fluctuations in manufacturing yields; product defects; and intellectual property infringement claims by others and the ability to protect our intellectual property, as well as other risks and uncertainties, including those detailed from time to time in our Securities and Exchange Commission filings.