Microsemi Receives Orders for Broadband Semiconductors in Two of Its Patented Near-Microscopic Packages; Swedish Telecommunications Manufacturer Sees Performance Benefits.

Business Editors & High-Tech Writers

SANTA ANA, Calif.--(BUSINESS WIRE)--April 5, 2000

Microsemi Corp. (Nasdaq:MSCC) today announced that its Microwave Division has received production-level orders for varactor tuning diodes utilizing its Enhanced Performance Surface Mount (EPSM) and its Micro-Miniature Microwave Surface Mount (MMSM) RF packaging technologies from a leading Swedish telecommunications manufacturer.

These devices are targeted for next-generation, higher-frequency telecommunication networks and they are seen as integral to the 3rd Generation mobile communication infrastructure.

"Recent orders confirm that our Enhanced Performance Surface Mount (EPSM(TM)) packages do exactly what their name suggests: improve performance," said John Caruso, general manager of the Microwave Division of Microsemi. "In this application we're helping our customer avoid capacitance-related performance problems that base station products will encounter at today's higher frequencies," he said.

Microsemi's tuning varactors and PIN diodes, in their patented EPSM and MMSM packages, are believed to be among the first such surface-mount devices able to reach the 2-10 GHz frequencies used in wireless base stations and in equipment used to test broadband components.

Because the new package is designed for automated tape-and-reel assembly, customers can lower their manufacturing costs dramatically as compared with conventional wire-bonded devices in costly metal packages.

Caruso explained: "High-frequency devices require low parasitic capacitance. The amount of parasitic capacitance tends to mirror package size. Using our proprietary manufacturing techniques, we can produce finished Microsemi flip-chip devices that are so small (0.020 x 0.040 x 0.015 inches) you need a magnifying glass to see them. Their small size reduces capacitance to acceptable levels. Traditional plastic packaging has less acceptable capacitance characteristics for today's higher frequency broadband applications," he said.

Microsemi's new broadband semiconductors are currently believed to be among the smallest in the industry. The company has indicated plans to release even smaller devices by the end of the calendar year using this packaging technology.

While the new Microsemi Microwave devices are optimized for personal communications systems (PCS) bands at 1.9-2.4 GHz, they also are usable through the entire X band (up to 12.6 GHz) that's used in applications such as radar and microwave towers. Microsemi indicated that most of its extensive line of microwave semiconductors can be packaged using their advanced Monolithic Microwave Surface Mount technology.

Manuel Lynch, Microsemi's Worldwide Marketing Director said, "All our divisions are applying Microsemi's advanced packaging technology to add value for our customers, as with these new broadband semiconductors. It's a key element in our strategy to serve the high-growth, high-volume telecommunications market, including mobile phone and wireless personal computing."

About Microsemi

Microsemi Corp. is a global supplier of power management, power conditioning, transient suppression and RF/Microwave semiconductor solutions. It serves the satellite, telecommunications, computer and peripherals, industrial/commercial, medical and military/aerospace markets with commercial and high reliability analog integrated circuits and power and signal discrete semiconductors.

More information may be obtained by contacting the company directly or on its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, hiring and retention of qualified technical personnel in a competitive labor market, rapidly changing technology and product obsolescence, the ability to realize cost savings or productivity gains, potential cost increases, the strength and competitive pricing environment of the marketplace, demand for and acceptance of the company's products, the results of planned development, marketing and promotional campaigns, changes in demand for products, difficulties of foreseeing future demand, potential non-realization of backlog, business and economic conditions such as the current industry conditions, customer order preferences, and fluctuations in market prices of the company's stock, difficulties in implementing company strategies, environmental matters, litigation, difficulties protecting proprietary rights, and inventory obsolescence. In addition to these factors and any other factors mentioned elsewhere in this news release, you should refer as well to the factors, uncertainties and risks identified in the company's most recent Form 10-K and subsequent Forms 10-Q filed by the company with the Securities and Exchange Commission.

Editors Note: Please forward reader inquiries to Microsemi Marketing Communications, 11861 Western Ave., Garden Grove, Calif. 92841-2119.

Investor inquiries: David R. Sonksen, Microsemi Corp., Santa Ana, Calif., 714/979-8220; or Sean Collins or William F. Coffin, Coffin Communications, Sherman Oaks, Calif., 818/789-0100