Microsemi Launches Line of Thermo-Electric Controller ICs for Optical Transponder and Broadband Base Station Applications.

Business Editors & High-Tech Writers

IRVINE, Calif.--(BUSINESS WIRE)--April 18, 2001

-- Based on successful "near zero-dissipation" Class D technology

-- System-Engineered approach provides a drop-in tuning solution

-- No heat sink required for efficient regulator

Microsemi Corp. (Nasdaq:MSCC) announced today that it has introduced the first in a series of power management products targeted at providing system-engineered solutions to the optical transponder market.

First in line is the LX1810, a Pulse Width Modulated (PWM) switching regulator designed to control Peltier (Thermo-Electric Cooler) elements used to cool lasers and RF power amplifiers in optical transponders and broadband base stations. Called ThermalMAX(TM), the new switching regulator technology is based on Microsemi's proven Class D audio amplifier controller circuits.

The LX1810 is a full-bridge, Thermo-Electric Cooler (TEC) controller designed specifically for high performance opto-electronic and broadband RF products that require precise temperature control.

The new Microsemi products tune or stabilize sensitive optical and RF power amplifier components in such applications as frequency tunable fiber optic lasers, photo detectors, wave-guides, and other dense wavelength division multiplexing (DWDM) components. Other applications include cooling broadband microwave transistors in next-generation 3G base stations.

Commenting on Microsemi's latest product introduction, Jim Peterson, CEO and president stated: "This is yet another example of how we successfully re-position intellectual property by understanding what an end market requires from our core competencies. We get asked again and again how Microsemi can handle its seemingly vast array of end markets.

"It's really quite simple -- we mine for new markets that need a technical solution like one we've already proven. In this case, we found that our Class D audio ICs can be enhanced and modified to meet the critical cooling needs of optical transponder designers. We don't create markets, we just expand the possibilities for end customers by solving their problems."

The LX1810 uses highly efficient (>90%) pulse width modulation (PWM) technology, allowing the controller to be mounted nearer the TEC, without adding heat to the system. The LX1810 operates on a single voltage supply, greatly simplifying supply requirements, with an operating frequency that is high enough to eliminate detrimental thermal stresses to the TEC.

The output ripple factor of the system can be maintained well below 10%, thus not affecting the performance of delta T control. Utilizing a full-bridge topology, the LX1810 can be used for both heating and cooling operations.

The LX1810, when used in conjunction with a temperature sense device, accurately regulates TEC current levels allowing tighter constant temperature control. By integrating FET drivers into its standard 28-pin SSOP package, Microsemi created a fully functional TEC controller that requires minimal board space.

"When you couple this new regulator with our recent announcement that Microsemi has begun shipping InGaAs/InP detectors, you begin to get a clear picture of how we intend to provide complete subsystem circuit functions for next generation optical and broadband networks," stated Manuel Lynch, vice president of marketing and business development.

"We intend to enhance our position in undersea DWDM applications by adding more products there, while at the same time entering new terrestrial markets that need drop-in modular solutions."

The LX1810 is available for immediate sampling and production orders. The company also offers the LXE1810, which is a full function evaluation board that can plug directly into a Peltier element and temperature sensing device. The LXE1810 is available for immediate purchase on the company's Web store for $75 per kit. The LX1810 stand-alone IC is available for immediate sampling.

Future Product Developments

Microsemi is expanding its optical transponder products with InGaP HBT 10gb/sec Transimpedance Amplifiers (TIAs) which it expects to release in the summer of 2001. It also is developing a hermetic flip chip InGaAs/InP detector for 40gb/sec OC768 systems. On the thermo-electric controller front, the company also plans to develop products that meet the needs of next-generation blue laser optical storage applications.

About Microsemi

Microsemi is a leading designer, manufacturer and marketer of analog, mixed-signal and discrete semiconductors. The company's semiconductors manage and regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi products include individual components as well as complete circuit solutions that enhance customer designs by providing battery optimization, reducing size or protecting circuits. Markets the company serves include mobile connectivity, computer/peripherals, telecommunications, medical, industrial/commercial, space/satellite and military.

More information may be obtained by contacting the company directly or by visiting its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, hiring and retention of qualified technical personnel in a competitive labor market, rapidly changing technology and product obsolescence, the ability to realize cost savings or productivity gains, the ability to improve capacity utilization, potential cost increases, the strength and competitive pricing environment of the marketplace, demand for and acceptance of the company's products, the results of planned development, marketing and promotional campaigns, changes in demand for products, difficulties of foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, business and economic conditions or adverse changes in current industry conditions, customer order preferences, and fluctuations in market prices of the company's stock, difficulties in implementing company strategies, environmental matters, litigation, difficulties protecting proprietary rights, and inventory obsolescence. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties and risks identified in the company's most recent Form 10-K and the final prospectus on Form S-3 filed on June 1, 2000 by the company with the Securities and Exchange Commission. The company does not undertake to supplement or correct any information in this release that is or becomes incorrect.

Investor Inquiries: David R. Sonksen, Microsemi Corp., Irvine, Calif., 949/221-7100.