Microsemi Announces New Line of GaAs Photodetectors for 850nm Fiber Optic Applications.

Business Editors & High-Tech Writers

SANTA ANA, Calif.--(BUSINESS WIRE)--Sept. 11, 2000

Microsemi Corp. (Nasdaq:MSCC):

-- Optimized for fiber optic applications with high coupling efficiency to
multi-mode fibers

-- Complete line for 1.4 - 8.75 GHz applications

-- Company also introduces complimentary "FemtoFarad" Photodiode ESD protection
device

Microsemi Corp. (Nasdaq:MSCC), today announced its first line of Gallium Arsenide photodetectors for fiber optic applications. The MXP3000 series, offered by the company's Santa Ana facility, are designed specifically for fiber optic transceiver modules and hybrids in the 850nm spectral range.

The five devices offered feature excellent dark current ratings of 1-3 nA, and a breakdown voltage of 20 Volts with the bandwidth options for 1.4 GHz (active area of 250 mm(2)), 1.75 GHz (active area of 200 mm(2)), 5 GHz (active area of 100 mm(2)), 7 GHz (active area of 60 mm(2)), and 8.75 GHz (active area of 30 mm(2)).

The MXP3000 series of photodiodes will initially be offered in die form for manufacturers of photodiode modules, supervisory pump laser circuits, and combination PIN Photodiode-transimpedance amplifier hybrids.

"We continue to remain on track with our product development of Gallium Arsenide products," stated Lane Jorgensen, vice president and general manager of the Optical Devices business unit. "This line of GaAs photodetectors and our InGaAs/InP detectors in development will assist us in making a strong entry into the terrestrial-based short haul fiber optic market.

"We are taking our experience in long haul WDM applications coupled with our experienced staff of optoelectronic and III-V compound process engineers to develop leading-edge products for the rapidly growing optical networking market."

Microsemi simultaneously released a new line of ultra-low capacitance "femtofarad" polymer transient protection products designed to protect high-speed fiber optic photo detectors and mobile phone power amplifiers from the damaging effects of ESD.

The bi-directional TVSF0805 (single channel device) and the TVSF1206 (4 channel array) with their ultra-small footprint (similar to 0805 and 1206 chip capacitors) and ultra-low leakage (less than a nanoamp) feature the optimal specifications for a fiber optic systems designer.

The most attractive feature of this new series is its extremely low capacitance ratings of less than a picofarad, otherwise known as femtofarad. These hyper-fast specifications make these devices literally invisible in the circuit. The devices are compliant to specification IEC 1000-4-2 for ESD protection.

"Traditionally manufacturers used packaged photodiodes; however, more and more we are seeing an increasing demand for bare die as companies manufacture photodiodes combined with transimpedance amplifiers," stated Mick McKeighan, vice president and general manager of the Transient Protection Business unit.

"Aligning the fibers to these detectors is labor intensive and can potentially induce ESD spikes, which can have a damaging effect on the photodiodes -- our new `femtofarad' protection devices are almost invisible to the customers' high-speed fiber optic transceiver modules, yet provide the necessary protection to protect modules that could cost over a thousand dollars," McKeighan added.

Both products are currently available for prototype sampling and can be purchased from the company's online store at http://www.microsemi.com.

Future Developments

Microsemi recently announced a plan to expand its wafer fab facilities to provide for additional gallium arsenide capacity in addition to its external foundries. Microsemi's gallium arsenide roadmap has now produced the MXP3000 Series of photodetectors for optical networking and the MWS11 Series of InGaP HBT General Purpose Gainblocks for mobile phone, base station and cable modem applications.

From an advanced packaging standpoint, the company plans on offering the MXP3000 series of GaAs Photodiodes in its developmental Optomite package, which combines the benefits of a high-speed ceramic package with the advantages of a low-cost plastic package.

The company is also developing a version of its popular Powermite package called the Gigamite for DC-6GHz applications, which will be available fall of 2000. Microsemi plans on using this advanced packaging technology for RF InGaP HBT gainblocks, GaAs Photodiodes and InGaAs/InP Photodiodes.

About Microsemi

Microsemi is a leading designer, manufacturer and marketer of analog, mixed-signal and discrete semiconductors. The company's semiconductors manage and regulate power, protect against transient voltage spikes and transmit, receive and amplify signals.

Microsemi products include individual components as well as complete circuit solutions that enhance customer designs by providing battery optimization, reducing size or protecting circuits. Markets the company serves include mobile connectivity, computer/peripherals, telecommunications, medical, industrial/commercial, space/satellite and military.

More information may be obtained by contacting the company directly or by visiting its Web site at http://www.microsemi.com.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in the news release that are not entirely historical and factual in nature are forward-looking statements. For instance, all statements of belief and expectations are forward-looking statements. Forward-looking statements are inherently subject to risks and uncertainties, some of which cannot be predicted or quantified. Potential risks and uncertainties include, but are not limited to, such factors as the difficulties regarding the making of estimates and projections, hiring and retention of qualified technical personnel in a competitive labor market, rapidly changing technology and product obsolescence, the ability to realize cost savings or productivity gains, the ability to improve capacity utilization, potential cost increases, the strength and competitive pricing environment of the marketplace, demand for and acceptance of the company's products, the results of planned development, marketing and promotional campaigns, changes in demand for products, difficulties of foreseeing future demand, effects of limited visibility of future sales, potential non-realization of expected orders or non-realization of backlog, business and economic conditions or adverse changes in current industry conditions, customer order preferences, and fluctuations in market prices of the company's stock, difficulties in implementing company strategies, environmental matters, litigation, difficulties protecting proprietary rights, and inventory obsolescence. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties and risks identified in the company's most recent Form 10-K and subsequent Forms 10-Q, and the final prospectus on Form S-3 filed on June 1, 2000 by the company with the Securities and Exchange Commission. The company does not undertake to supplement or correct any information in this release that is or becomes incorrect.

Note to Editors: Forward reader inquiries to Microsemi Marketing Communications, 11861 Western Ave., Garden Grove, Calif. 92841-2119.

Investor Inquiries: David R. Sonksen, Microsemi Corp., Santa Ana, Calif. 714/979-8220; or Sean Collins or William F. Coffin, Coffin Communications, Sherman Oaks, Calif. 818/789-0100.