Microelectronic Packaging Advances Technology Capabilities, Announces New Contracts With High Technology Companies.

TEMPE, Ariz.--(BUSINESS WIRE)--Sept. 15, 1998--

Thermotrex and Fermi Lab Contracts Coincide with Hiring of New

Technology Executive, Expanded Design Team

and Move to a Larger Modernized Facility

Microelectronic Packaging Inc. (MPI) today announced major technology initiatives with the hiring of a new technology executive to facilitate the company's recent move to a larger, more modern facility.

The announcement comes upon the recent signing of design and assembly contracts with Thermotrex and Fermi National Accelerator Laboratory.

Pete H. Hudson, vice president of technology, joins MPI from Hughes Technology Center. His responsibilities at MPI will include managing new product and manufacturing process development, new product design, testing services, and test development engineering. Hudson will also oversee the company's reduction of product cost by redesign initiative, manufacturing and process engineering and new equipment development. He will directly undertake the management of information services for manufacturing resources planning at MPI.

"With Hudson's vast knowledge and experience in advanced packaging, he will add significant resources and advancement of MPI's offering of interconnect packaging solutions," said Andrew K. Wrobel, MPI's president and chief executive officer. "MPI's success is based on its people and our ability to continue to provide unique packaging solutions to our customers. As vice president of technology, Hudson and his new team can help ensure MPI's success by advancing our technology solutions for the benefit of our customers in the electronic systems industry."

Joining Pete is Craig Iwami, manager of process engineering (formerly with Hughes Technology), Gail Massoll, senior process engineer (formerly with Raytheon), Mark Loutzenheiser, process engineer (formerly with Intel), and Roland Short, process engineer (formerly with Unisys). The new technical staff complements the product engineering staff led by Don Hayashagawa, test and design manager, who has been with the company for more than 10 years.

In keeping up with the ever-evolving market demands, MPI has also recently moved its headquarters, effectively doubling its manufacturing and design area from its previous location. The company's new 25,000 square-foot headquarters and manufacturing facility is devoted to manufacturing, engineering and design laboratories. The new facility will allow MPI to facilitate a quicker turnaround for its customers, as well as provide state-of-the-art manufacturing processes. The new location gives MPI the tools to competitively market itself as a leading supplier of high-density packaging interconnect solutions and position itself for future growth in next generation technology packaging.

Enhancing MPI's advanced technology capabilities, the company also announces a new capability in Ball Grid Array (BGA) technology based upon a license from Motorola. The company is actively discussing BGA with several interested companies. Contracts with Thermotrex in San Diego, Calif., and Fermi National Accelerator Laboratory in Batavia, Ill., are the first to be announced since the re-focus of the company.

"MPI's business is entirely customer driven and our solutions are completely customized, so the timely development of complex contract negotiations is essential to the company's success," said Wrobel. "The Fermi Labs and Thermotrex contracts are important steps in MPI's ongoing success as we continue to expand our growing client base by providing superior solutions for custom microelectronics applications."

The Fermi Labs contract consists of MPI working with the Fermi National Accelerator Laboratory to assist in the development of the next generation of accelerator particle impact sensor electronics. One of the new sensors is a Visible Light Photon Counter (VLPC) used to detect and classify particle interactions. The final multi-chip module assembly will be a 10 layer board containing the 5 ASIC die and about 75 passive components in a 3.5- by 1.5-inch area.

"We initially selected MPI before the new technology team was in place and we really notice a new 'can do' attitude with the addition of the new people as we partner with MPI to assist in the development of our next generation accelerator particle impact sensor electronics," said Michael Matulik, engineer at Fermi National Accelerator Laboratories.

"MPI impressed us with their innovative thinking and willingness to take on our very challenging design requirements that also required cost effective commercial processes," said Dr. Randall Olsen, Thermotrex senior staff scientist. "They have been responsive and flexible even as the inevitable need for modifications emerged during prototype design," added Dr. Olsen.

Microelectronic Packaging Inc. (MPI) is a high-density packaging interconnect solutions company providing design services, manufacturing and testing capabilities. MPI satisfies the requirements of integrated circuits (ICs) and electronic systems manufacturers. Headquartered in San Diego, with on-site manufacturing facilities, the company develops, manufactures, markets and sells multi-chip modules to customers in the semiconductor, communications, automatic test equipment (ATE) and electronics-related industries.

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