Microcircuit Technology Increases Its Utilization of Orbotech's Advanced Solutions for IC Substrate Production; Additional Multi-Million Dollar Order for Laser Direct Imaging and AOI Systems.
With this order, Microcircuit will now utilize a total of six Orbotech Paragon LDI systems and eight InFinex systems for the production of advanced IC substrates, making it the largest user of these solutions in Singapore.
Microcircuit is a technology solution provider that supports the semiconductor substrate technology roadmap with a commitment to delivering products with the highest quality and reliability. Ms. Jennifer Ho, Senior Manager of Engineering of Microcircuit, explained: "The Paragon LDI systems allows us to take the next step in state-of-the-art technology. Together with the InFinex AOI systems, we have the advanced production tools from Orbotech to achieve the higher yields and flexibility necessary for successfully manufacturing our full range of complex products."
Mr. Richard Klapholz, President of Orbotech Pacific Ltd., added: "Microcircuit is a major user of our leading solutions for advanced PCB production. We are very pleased that our systems and support have proven their value as key elements in Microcircuit's production strategy for IC substrates and that the company has once again chosen Orbotech to further expand its high-end technology manufacturing capabilities."
About Microcircuit Technology (2002) Pte Ltd.
Microcircuit Technology (2002) Pte Ltd. is a pioneer in advanced interconnect substrate manufacturing in the Southeast Asia region - Singapore. MicroCircuit provides quick-turn solutions for semiconductor substrates and high-end Chip-on-Board (COB) boards, from package design to completion of substrate fabrication. The manufacturer is a subsidiary of AEM-Evertech Holdings (www.aem-evertech.com). For more information, visit www.mct2002.com.
About Orbotech Ltd.
Orbotech is a world leader in providing yield-enhancing, production support solutions for specialized applications in the supply chain of the electronics industry, principally for printed circuit boards (PCBs) and flat panel displays (FPDs). The Company designs, develops, manufactures, markets and services automated optical inspection (AOI) systems for bare and assembled PCBs and for FPDs, and imaging solutions for PCB production. The Company's innovative AOI, imaging and computer-aided manufacturing (CAM) technologies enable customers to achieve the increased yields and throughput essential to remaining at the forefront of electronics production. Through its subsidiary, Orbograph Ltd., the Company also develops and markets automatic check reading software to banks and other financial institutions. Of Orbotech's employees, more than one quarter are scientists and engineers, who integrate their multi-disciplinary knowledge, talents and skills to develop and provide sophisticated solutions and technologies designed to meet customers' long-term needs. Orbotech maintains its headquarters and its primary research, development and manufacturing facilities in Israel, and more than 35 offices worldwide. The Company's extensive network of marketing, sales and customer support teams throughout North America, Europe, the Pacific Rim, China and Japan deliver its knowledge and expertise directly to customers the world over. For more information visit www.orbotech.com.
Except for historical information, the matters discussed in this press release are forward-looking statements that are subject to certain risks and uncertainties which could cause the actual results to differ materially from those projected, including industry trends, the timing and strength of product and service offerings, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis and other risks detailed from time to time in the Company's SEC reports. The Company assumes no obligation to update the information in this press release.
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|Date:||Sep 5, 2006|
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