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Microbonds' Connection Technology Raises $7 Million In Funding.


TORONTO -- Microbonds Inc., the pioneer of new connection technologies for micro-chips, today announced that it has completed an internal round of financing in the amount of $7,000,000 (CDN (Content Delivery Network) A system of distributed content on a large intranet or the public Internet in which copies of content are replicated and cached throughout the network. ) led by Whitecastle Equity Partners.

Microbonds' X-Wire(TM) Technology offers the semiconductor industry powerful and reliable solutions for electronic interconnect problems that occur when advances in microchip technologies Microchip Technology (NASDAQ: MCHP) is a manufacturer of microcontroller, memory and analog semiconductors, founded in 1989 when  exceed the capabilities of existing assembly and packaging interconnect technologies (like bare wire and bump-based interconnects).

Whitecastle partner Elmer Kim said, "We were the first investor in Microbonds and have confidence that the technologies represent an essential solution which is necessary for the industry to achieve their product performance and cost goals going forward. Microbonds has assembled a strong technical and management team who have consistently demonstrated the resolve, commitment and ingenuity required to make the company and its technologies successful."

Microbonds CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  Craig Geier added, "With the completion of this financing, our people are now well positioned to capitalize on Cap´i`tal`ize on`   

v. t. 1. To turn (an opportunity) to one's advantage; to take advantage of (a situation); to profit from; as, to capitalize on an opponent's mistakes s>.
 the strong industry interest we have received to date. We will now accelerate our capabilities in manufacturing and research and development, both internally and with our supply chain partners, to ensure that we are aligned for the long term with the needs and directions of our customers. Whitecastle has been a steadfast supporter of the company since the beginning and we are fortunate to have such a strong partner to help us as we build the company."

About X-Wire Technology

The X-Wire Technology has been developed as a total interconnect system that can be quickly integrated into the existing dominant manufacturing infrastructure with minimal cost and disruption. X-Wire Technology consists of a proprietary insulated in·su·late  
tr.v. in·su·lat·ed, in·su·lat·ing, in·su·lates
1. To cause to be in a detached or isolated position. See Synonyms at isolate.

2.
 coating applied to bare gold bonding wires (X-Wire), the assembly processes and procedures required to utilize insulated bond wire within the existing Wire Bonding Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.

The wire is generally made up of one of the following:
  • Gold
  • Aluminum
  • Copper
 industry infrastructure (X-Process(TM)), and a number of special packaging designs enabled by X-Wire (marketed as X-Pax(TM)).

This qualified technology enables bonding wires to touch without causing an electrical short, facilitating the design of a wide array of the highest performance-to-cost microchip (1) Another term for a microminiaturized integrated circuit (a "chip").

(2) To insert an RFID tag beneath the skin of an animal. It is expected that some day, humans will be microchipped.
 packages in the industry. For example, designers have Using X-Wire overcomes many of the physical and economic limitations inherent when using bare bond wire the flexibility to cross wires too bump based options, providing a reliable solution to many of the more pressing interconnect bottlenecks The interconnect bottleneck -- the point where microchips reach their capacity -- is expected sometime around 2010.[1]

Improved performance of computer systems has been achieved, in large part, by downscaling the Integrated Circuit (IC) minimum feature size.
. With X-Wire, customers can achieve new geometries through area array and multi-row wire bonding; reduce substrate layers through direct to ball bonding Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication. , as well as a number of other new designs that can decrease the size of the package, increase the electrical performance, and reduce the overall cost of the package.

About Whitecastle Equity Partners

Whitecastle Equity Partners (www.whitecapvp.com) is a Toronto based investment fund focused on providing capital for growth and buy-outs and investing in people. We believe that investing capital in good businesses and partnering with talented entrepreneurs who share our values will lead to thriving and successful industry leaders. We value integrity, hard work, teamwork and camaraderie. At Whitecastle, our history is of economic success but our legacy is of integrity.

About Microbonds

Microbonds, Inc. is a pioneer in the development of unique microchip interconnect solutions for use in the design and assembly of microelectronic devices. The company's X-Wire Technology enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. Founded in 1999 by IBM-trained engineers, the company's approach is proven through testing with major IC companies. Microbonds is a privately held company privately held company

A firm whose shares are held within a relatively small circle of owners and are not traded publicly.
 funded by a leading Canadian VC, Whitecastle Equity Partners and a number of private global angel investors An individual who invests his or her own money in a private company, which is typically a startup. An angel investor is not an employee or member of a bank, venture capital firm or other financial institution that normally makes such investments. . For more information, see www.microbonds.com

Microbonds, X-Wire Technology, X-Wire, X-Process and X-Pax are trademarks of Microbonds, Inc. All other trademarks and registered trademarks are the property of their respective owners.
COPYRIGHT 2005 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2005, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:Jul 20, 2005
Words:625
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