Browse Printed circuit boards topic

Methods subtopic

Articles 1-15 out of 15 article(s) Title Author Type Date Words Tackling the copper wrap plate requirement: wrap plating improves reliability of via structures, but conventional techniques increase surface copper thickness, limiting HDI and other fine-line designs. Sidhu, Rajwant Jul 1, 2009 2230 Dielectric performance in lead-free assembly: new test methods offer powerful tools to help understand circuit board failures and the role of materials in PCB reliability. Reid, Paul Mar 1, 2009 3194 Asymtek's Fiducials-on-the-Fly Technology Locates Fiducials on Printed Circuit Boards Five Times Faster than Standard Stop-and-Capture Method. Jan 16, 2009 566 Solve design problems with signal integrity optimization: optimization routines save time by using automated methods to determine if performance goals are met. Zabinski, Pat; Buhrow, Ben; Gilbert, Barry; Daniel, Erik Apr 1, 2008 2084 Improving circuit design using IC package/PCB co-design techniques: dynamic new co-design strategies will give the PCB designer the flexibility to re-map legacy package pinouts. Hart, Martin Feb 1, 2008 1422 The implementation of via-in-pad interconnects to increase PBC circuit density: filled via-in-pad processes are a way to achieve an intermediate density increase for a minimal additional cost. Safdar, Ishtiaq; Ahmed, Faisal Cover story Oct 1, 2007 1547 New Methodology to 'Evolutionize' Circuit Board Manufacture and Assembly. Aug 1, 2007 589 Manufacturing techniques to decrease high-speed Digital Signal distortion: backdrilling is a cost effective strategy to reduce detrimental signal distortions cased by PTH via stub structures. Stepinski, Alex Feb 1, 2007 2192 Endicott Interconnect: filling the gap: an investigation of blind and thru via fill techniques for semiconductor package and printed circuit board applications. Nargi-Toth, Kathy Jan 1, 2007 2496 Distributed autorouting of printed circuit boards: it's true--there is strength in numbers. Learn how to take advantage of multiple CPUs when routing large PCBs. Pfeil, Charles Jul 1, 2006 1693 Vitesse Launches Signal Integrity and Ethernet Switching Seminars for Design Engineers; Technical Sessions Provide Best Practice Tools and Techniques for Designing High Speed Communication Systems. May 10, 2006 819 Imprint patterning: a practical approach to fabrication: this microreplication technique can replace photolithography and laser drilling, with little investment in training or equipment. Davidson, Craig Cover story May 1, 2006 2084 Drilling to the source of voids: even optimized plating can't compensate for poor hole formation or desmearing processes. (The Plating Rack). Carano, Michael Brief Article Jun 1, 2003 897 Handle with care: want better boards? Treat your films better. (Better Phototooling). Jarvis, Jeff Jun 1, 2003 847 So far, so close: understanding return current in a differential pair. (No Myths Allowed). Bogatin, Eric Brief Article Jun 1, 2003 727