Metal matrix composite.AISiC (aluminum silicon carbide) is a metal matrix composite Metal matrix composite A material in which a continuous metallic phase (the matrix) is combined with another phase (the reinforcement) that constitutes a few percent to around 50% of the material's total volume. suited as a thermal management material for IGBT IGBT Insulated Gate Bipolar Transistor IGBT Integrated Gate Bipolar Transistor base plates. The IGBT base plates are reportedly lightweight and offer high strength. The isotropic coefficient of thermal expansion coefficient of thermal expansion, n See expansion, thermal coefficient. can be adjusted for specific applications by modifying the AISiC's metal to particulate ratio to match the CTE (Coefficient of Thermal Expansion) The difference between the way two materials expand when heat is applied. This is very critical when chips are mounted to printed circuit boards, because the silicon chip expands at a different rate than the plastic board. of the die or substrate. The AISiC near net-shape fabrication process produces the composite material and fabricates the product geometry, allowing for the design of base plates with a dome profile. WHO: Ceramics Process Systems WEB: www.alsic.com [ILLUSTRATION OMITTED] |
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