Merix Hong Kong Acquires Buried Capacitance(TM) License.

FOREST GROVE, Ore. -- Merix Corporation (Nasdaq:MERX) today announced that its Hong Kong operation has been granted a license to manufacture products using the Buried Capacitance(TM) technology from HSCI. Buried Capacitance(TM) technology is a thin laminate material used in many high-speed designs to improve electrical performance.

Dan Olson, CEO of Merix Asia, stated, "Merix Corporation seeks to support the technology products of our customers. We believe our ability to support our customers from our Merix Hong Kong facility has been enhanced by obtaining this license and this furthers our goal of providing a seamless global manufacturing footprint allowing the transition of technology product to a lower cost region." Olson also commented, "The extension of the Buried Capacitance(TM) license to our Hong Kong location will allow us to further serve, from Asia, the needs of customers who require these advanced capacitive materials for their high-speed designs."

Merix now has three manufacturing facilities that are Buried Capacitance(TM) licensed. Merix can continue to offer quick-turn prototypes from San Jose through ramp and volume at Oregon and now, additionally, from Hong Kong, utilizing the Buried Capacitance(TM) technology.

Merix is a leading manufacturer of technologically advanced, multilayer, rigid printed circuit boards for use in sophisticated electronic equipment. Merix provides high-performance materials, quick-turn prototype, pre-production and volume board production to its customers. Principal markets served by Merix include data communications and wireless telecommunications, high-end computing, and test and measurement end markets in the electronics industry. Additional corporate information is available at www.merix.com.