Members of SiLKnet Alliance Convene for First Low-K Integration Summit; Conference Highlights Latest Data on SiLK Resin, Expanded Alliance Membership.

Business Editors/High-Tech Writers

MIDLAND, Mich.--(BUSINESS WIRE)--Dec. 5, 2001

The introduction of streamlined low-k integration schemes moved one step closer to reality last week as members of the SiLKnet Alliance(SM) data network convened for the first time in a high-level technology symposium sponsored by The Dow Chemical Company. The Summit for SiLKnet Alliance brought together the industry's top program managers, scientists and engineers to focus on speeding development of complementary products and processes that support SiLK(TM) semiconductor dielectric resin, the leading low-k material for the 130nm technology node and beyond.

"The Summit for SiLKnet Alliance opened with great enthusiasm for our common end goal -- that is, to support our customers' advanced back-end-of-line interconnect needs with low-k integration product and process solutions," said Greg Bauer, development director for SiLKnet Alliance. "With blanket and patterned SiLK wafers soon available to member companies, our activities are moving into high gear. The Summit presented an ideal opportunity to ensure all members have the tools and data they need for rapid development of a variety of compatible SiLK processes and related technologies."

The three-day Summit provided Alliance member companies with the latest data on SiLK and porous SiLK resins from Dow, as well as information about the industry's first production-ready spin-on etch stop material, to be marketed under the trademark ENSEMBLE(TM) ES dielectric solutions.

In a separate announcement during the Summit, the SiLKnet Alliance welcomed five additional materials and equipment suppliers as members. ATMI MLS Photo/Etch Solutions, Axcelis Technologies Inc., Bayer, General Chemical Corp. and the SEZ Group have signed letters of intent to join SiLKnet Alliance, expanding membership to 15 companies.

According to Bauer, the Summit event also offered participants training to support CMP, etch, metrology, clean and coat/cure process module focus areas. "With early information about SiLK resins and related technologies, member companies will be able to accelerate their own product development programs and ultimately ease the adoption of SiLK dielectrics for chipmakers," Bauer noted.

More than 40 program managers, scientists and engineers representing Alliance member companies, leading chipmakers and consortia participated in the Summit for SiLKnet Alliance, held Nov. 28-30 in Phoenix, Ariz. Future Summit meetings and joint presentations at key seminars and conferences are planned for 2002.

The SiLKnet Alliance is the first and broadest low-k collaboration of its kind, and its formation earlier this year marked an important milestone in the industry's adoption of low-k materials. Under the Alliance, member companies work in parallel to streamline fab processes and launch new products that simplify integration of SiLK dielectric resins.

Founding alliance members include Arch Chemicals Inc., Ashland Specialty Chemical Company, Dainippon Screen Mfg. Co. Ltd., The Dow Chemical Company, EKC Technology Inc., Ferro Electronic Materials, Planar Solutions LLC, Supercritical Systems Inc., Tokyo Electron Limited and Verteq Inc. Membership is non-exclusive and open to all suppliers providing solutions in the low-k area. More information about SiLKnet Alliance is available at the Alliance's Web site (www.silknetalliance.com).

About SiLK Semiconductor Dielectric Resin and Related Products

SiLK resins are a family of spin-on, low-k ILD materials that allow semiconductor manufacturers to increase the speed and performance of their chips by enabling denser circuitry. First generation SiLK resin products offer k=2.6 for both copper damascene and aluminum/tungsten processing. Dow also offers a clear path to next-generation chip technologies with porous SiLK resin (k=2.0), which is being developed for 100nm chip designs, as well as the industry's first production-ready spin-on etch stop material, to be marketed under the trademark ENSEMBLE ES dielectric solutions.

About Dow -- Advanced Electronic Materials

Dow's Advanced Electronic Materials business provides a variety of materials and technologies to support customer innovation in the electronics industry. Dow is a leading science and technology company that provides innovative chemical, plastic and agricultural products and services to many essential consumer markets. With annual sales of approximately $30 billion, Dow serves customers in more than 170 countries and a wide range of markets that are vital to human progress, including food, transportation, health and medicine, personal and home care, and building and construction, among others. Committed to the principles of sustainable development, Dow and its 50,000 employees seek to balance economic, environmental and social responsibilities. Additional information on SiLK semiconductor dielectric resins from Dow is available at the Web site www.silk.dow.com. Or, contact Dow's Customer Information Group at 800/441-4369. Reference E#1-316G1 to expedite your inquiry.

(TM) Trademark of The Dow Chemical Company (SM) Service Mark of The Dow Chemical Company

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