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Articles
1-100 out of 100 article(s)
| Title |
Author |
Type |
Date |
Words |
| IPC Annual Meeting keynote: avoiding commoditization. |
|
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Sep 1, 2003 |
184 |
| Unstable economy challenges fiber optic electronic components industry. |
|
Brief Article |
Sep 1, 2003 |
238 |
| Study: CEM market grew 1% last year. |
|
Brief Article |
Sep 1, 2003 |
299 |
| Integrated passives technology and economics: the latest from the recent NEMI roadmap. |
Dougherty, Joseph P. |
|
Sep 1, 2003 |
2542 |
| The latest in underfill for advanced chip assembly: is a low-cost, surface-mount-compatible process possible? |
Baldwin, Daniel F. |
|
Sep 1, 2003 |
1755 |
| Product and component traceability: a complete traceability system will minimize the cost of product recalls and help eliminate them in the future. |
Nelson, John |
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Sep 1, 2003 |
1956 |
| Depaneling: a study in yield and productivity: saw systems can provide a low stress and fast alternative to hand breaking methods. |
Duck, Allen |
|
Sep 1, 2003 |
1869 |
| Understanding selective pallet soldering residue: proper heating can eliminate flux concerns. |
Munson, Terry |
|
Sep 1, 2003 |
624 |
| Push or pull? |
Hamburg, Lisa |
|
Sep 1, 2003 |
643 |
| The price is right. |
Hamburg, Lisa |
|
Aug 1, 2003 |
599 |
| Web sites worth mentioning. |
|
Brief Article |
Aug 1, 2003 |
221 |
| Surveys and guides. |
|
Brief Article |
Aug 1, 2003 |
73 |
| Feinfocus, Palomar collaborate. |
|
Brief Article |
Aug 1, 2003 |
155 |
| Military/aerospace offers "unique hurdles, timely opportunities" for EMS. |
|
Brief Article |
Aug 1, 2003 |
227 |
| Beware the jabberwocky: Phil answers some questions that have recently come his way. |
Zarrow, Phil |
|
Aug 1, 2003 |
964 |
| Rework and repair. |
|
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Aug 1, 2003 |
825 |
| Exploring the nanoworld: nanotechnology is one ET that is too small to ignore. |
Gilleo, Ken |
|
Aug 1, 2003 |
859 |
| Rework with lead-free solders: temperature differences between eutectic and lead-free solders mandate tighter processes, better profiles and precise rework systems. |
Wood, Paul |
|
Aug 1, 2003 |
2125 |
| Next-generation laser rework: some applications for high-density and lead-free manufacturing process are explored. |
Wang, Paul P.E. |
|
Aug 1, 2003 |
2361 |
| 20/20 foresight: detecting bridges before they occur. |
Pham-Van-Diep, Gerald C. |
|
Aug 1, 2003 |
2301 |
| Don't overlook the details: how to stop micro-etch disintegration and deal with global standards. |
Hymes, Les |
|
Aug 1, 2003 |
670 |
| Odd form assembly challenges: improve productivity by increasing an application's MTBA and decreasing the MTTR. |
Earley, Stan |
|
Aug 1, 2003 |
476 |
| U.S. demand for EMI/RFI shielding options to Exceed $600 million by 2008. |
|
|
Jul 1, 2003 |
392 |
| Are embedded passives ready for prime time? Key players and innovations shape the future of embedded components. |
Vardaman, E. Jan |
|
Jul 1, 2003 |
984 |
| Selecting the optimal test strategy: how to find the right balance among all the choices--ICT, AOI and AXI. |
Oresjo, Stig |
|
Jul 1, 2003 |
1679 |
| Creating a more flexible manufacturing line: one company changed successfully from producing a few high-volume products to greater quantities of more diverse products. |
Kindness, Ken |
|
Jul 1, 2003 |
1187 |
| Misery loves company? |
Hamburg, Lisa |
|
Jul 1, 2003 |
886 |
| Same old, same old. |
Hamburg, Lisa |
|
Jun 1, 2003 |
697 |
| Asymtek marks 20 years in PCB assembly industry. |
|
Brief Article |
Jun 1, 2003 |
139 |
| News and resources for PCB industry professionals. |
|
Brief Article |
Jun 1, 2003 |
75 |
| Bringing it all together at UIC's grand opening at Shekou, China. |
Luthra, Mukul |
|
Jun 1, 2003 |
1221 |
| Plastic fantastic: conductive epoxies boldly go where no solder has gone before. |
Zarrow, Phil |
|
Jun 1, 2003 |
1021 |
| Dry solder joints and assembly cleanliness: Les defines solderability and troubleshoots cleaning process problems. |
Hymes, Les |
|
Jun 1, 2003 |
688 |
| The road ahead for board assembly: several process and equipment developments are needed to keep North America in pace with the changing nature of electronics manufacturing. |
Chen, Alex |
|
Jun 1, 2003 |
1729 |
| The persistent problem of tombstoning: understanding this phenomenon and how to prevent it. |
Trip, Harry |
|
Jun 1, 2003 |
1746 |
| Defense electronics outsourcing: EMS companies should think twice before entering the defense market. |
Gordon, Pamela J. |
|
Jun 1, 2003 |
680 |
| Calculating the total costs of offshore outsourcing: is your product suited for offshore manufacturing? |
Mucha, Susan |
|
Jun 1, 2003 |
1168 |
| Scares. |
Hamburg, Lisa |
|
May 1, 2003 |
736 |
| Solderability and traceability: les addresses surface finish concerns and component identity tracking. |
Hymes, Les |
|
May 1, 2003 |
690 |
| Investigating 0201 printing issues and stencil design: experimental results on printer settings, stencil design and stencil technology for 0201s. |
Yi, Sammy |
|
May 1, 2003 |
2505 |
| The most important integrated passive R&D projects:a top five list. |
Ulrich, Richard |
|
May 1, 2003 |
2594 |
| Elementary, my dear rework technician: uncovering the mysteries of 2-D x-ray inspection. |
Ferry, Jeff |
|
May 1, 2003 |
718 |
| Solder paste handling: welcome to our newest series--Ten Timely Tips! Bimonthly, we'll provide you with 10 technology tips on a certain process aspect culled from the best suggestions received from readers. |
|
|
Apr 1, 2003 |
767 |
| Reducing solder voids with copper-filled microvias: a study seeks to find out the frequency, location and size of voids with and without copper-filled vias. |
Nishu, Keisuke |
|
Apr 1, 2003 |
1912 |
| Validating press-fit connector installation: a winning combination: press-fit technology and installation by PC-controlled servo-electric presses. |
Mitchell, Jack |
|
Apr 1, 2003 |
2127 |
| Automating 0201 rework: automation and conductive heating are essential for effective rework of tiny 0201s--and beyond. |
Czaplicki, Brian |
|
Apr 1, 2003 |
1169 |
| Through-hole automation challenges: new applications push the boundaries of mature technologies. |
Giangrieco, John |
|
Apr 1, 2003 |
485 |
| Waste not, want not: simplify BGA rework by reusing leftover solder. |
Ferry, Jeff |
|
Apr 1, 2003 |
711 |
| Desperate times ... |
Hamburg, Lisa |
|
Mar 1, 2003 |
700 |
| IPC announces Electronics Assembly Scholarship Fund. |
|
|
Mar 1, 2003 |
297 |
| Finding BGA opens in production: a new method using AXI compares reflowed BGA ball sizes to detect open solder joints. |
Leinbach, Glen |
|
Mar 1, 2003 |
1512 |
| Don't give me what I ask for: give me what I need: a guide to creating accurate RFQs. |
Gordon, Pamela |
|
Mar 1, 2003 |
942 |
| "Tool time" in rework: expect the unexpected: common tools can be put to good use during rework. |
Ferry, Jeff |
|
Mar 1, 2003 |
783 |
| Solving a BGA footprint mismatch: daughter card to the rescue. |
Ferry, Jeff |
|
Feb 1, 2003 |
662 |
| A mass measurement system for screen printing: several experiments have proven mass measurement's viability for monitoring the printing process. |
Lieske, Richard |
|
Feb 1, 2003 |
2403 |
| Screen printing: welcome to our newest series--Ten Timely Tips! Bimonthly, we'll provide you with 10 technology tips on a certain process aspect culled from suggestions received from readers. |
|
|
Feb 1, 2003 |
872 |
| No cleaning required? Use of a no-clean flux requires a well-controlled clean process. |
Hymes, Les |
|
Feb 1, 2003 |
605 |
| Machine vision challenges: the key to success: flexibility with illumination and lens choice. |
Boulanger, Richard |
|
Feb 1, 2003 |
449 |
| Visualizing and predicting solder paste flow--in real time: a unique method eliminates errors associated with typical post-print measurement systems. |
Andres, Frank |
|
Feb 1, 2003 |
2159 |
| Be forewarned. |
Hamburg, Lisa |
|
Nov 1, 2002 |
563 |
| Kapton[R] tape: the duct tape of the electronics industry. |
Yates, Phil |
|
Nov 1, 2002 |
305 |
| SMTA. |
|
|
Nov 1, 2002 |
85 |
| Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year. |
Vardaman, E. Jan |
|
Nov 1, 2002 |
963 |
| Don't give me any static: resources and tips to help you avoid ESD problems. |
Hymes, Les |
|
Nov 1, 2002 |
660 |
| Flip chip processing factors: implementing flip-chip process capability is not a simple task. Find out how to make the process less painful. |
Beddingfield, S. Craig |
|
Nov 1, 2002 |
696 |
| Who's afraid of lead-free rework? The rules of rework change when dealing with lead-free assemblies. |
Ferry, Jeff |
|
Nov 1, 2002 |
655 |
| The right tool for the job: determining the right-sized EMS provider for your high-mix, low-volume work. |
Bilbrough, Bob |
|
Nov 1, 2002 |
2360 |
| Managing the OEM/EMS relationship: EMS companies must be dedicated to the fundamental traits originally attracting OEMs to the outsourcing business model. |
MaGee, Marvin |
|
Nov 1, 2002 |
1744 |
| Managing the EMS value chain: to succeed in today's marketplace, EMS providers should focus on their core competencies, partner relationships and continuous improvement. |
Fargo, Mike |
|
Nov 1, 2002 |
1224 |
| Real-time data collection and analysis: enterprise productivity software can be used to address numerous data collection and analysis problems faced by electronics manufacturers. |
Spera, Jason |
|
Nov 1, 2002 |
1414 |
| From the shop floor to the top floor: a new data exchange method provides real-time, accurate data from the factory floor to a company's top decisionmakers. |
Motherway, Michael |
Brief Article |
Nov 1, 2002 |
1435 |
| Hand soldering--the cause of the failure? Hand-soldered, no-dean flux residues may create electrical leakage failures. |
Munson, Terry |
|
Nov 1, 2002 |
613 |
| Living large: building big, bad backpanels: how are these monsters produced? Phil explains the processes and the equipment. |
Zarrow, Phil |
|
Oct 1, 2002 |
797 |
| The devil's in the details: tombstoning revisited: you've checked the oven, the oven profiles, the solder paste and the nitrogen levels--why are you still encountering tombstoning? |
Hymes, Les |
|
Oct 1, 2002 |
687 |
| Searching for the perfect BOM: a NEMI team comprised of OEMs and EMS providers offers recommendations for improving bills of materials. |
McElroy, Jim |
|
Oct 1, 2002 |
2336 |
| Linking the factory office to the factory floor: the correct documentation control system can increase productivity and quality while reducing costs. |
Spera, Jason |
|
Oct 1, 2002 |
1718 |
| CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the component pitch and board layout. |
Emmen, Hans |
|
Oct 1, 2002 |
1770 |
| Computer-aided production planning: a new, free software program enables supervisors to quickly and accurately calculate production line requirements. |
Senawaitis, Anthony J. |
|
Oct 1, 2002 |
409 |
| Coating removal methods: normally, removing a large QFF from a board would be easy, but what do you do with thick, clear, rubbery coatings? |
Ferry, Jeff |
|
Oct 1, 2002 |
832 |
| Mexico versus China. |
Murray, Jerry |
|
Oct 1, 2002 |
506 |
| All that's old is new again. |
Hamburg, Lisa |
|
Sep 1, 2002 |
761 |
| The end of an era: manufacturing research and development appears to be a lost art--one that needs to be rediscovered. |
Vardaman, E. Jan |
|
Sep 1, 2002 |
700 |
| Die skewing: due to the continued growth of flip-chip technology in next-generation products, avoiding die skew is essential. |
Lewis, Brian |
|
Sep 1, 2002 |
672 |
| Component removal and attachment issues: this month, Les clarifies readers' assumptions concerning underfill material in rework and repair and reflow soldering. |
Hymes, Les |
|
Sep 1, 2002 |
680 |
| High activity solder paste. |
|
Brief Article |
Sep 1, 2002 |
94 |
| Well, it sure didn't feel mild. |
Hamburg, Lisa |
|
Jul 1, 2002 |
596 |
| Is it clean? Why do you want to know? Part I: do you sometimes battle with your customers over cleanliness? |
Hymes, Les |
|
Jul 1, 2002 |
672 |
| Screening for errors: what's to blame? Stencil printer verification procedures allow production problems to be quickly isolated and corrected. |
O'Hanlon, Michael |
|
Jul 1, 2002 |
1850 |
| Legend and markings repair: boards with damaged legends or markings aren't necessarily destined for the scrap bin--three IPC-approved methods can help. |
Ferry, Jeff |
|
Jul 1, 2002 |
679 |
| Recycling batch screen and stencil cleaner wastewater: closed-loop recycling offers an efficient, cost-effective alternative to evaporation. |
Volpe, Jack |
|
Jun 1, 2002 |
2926 |
| Like Gulliver in Lilliput: reworking tiny components: rework of 0402 and 0201 chip components is not impossible. |
Ferry, Jeff |
|
Jun 1, 2002 |
649 |
| Dross "Grabber" separates good solder from dross. |
|
|
Jun 1, 2002 |
684 |
| Managing your ESD program: implementing an ESD control program is important, and the results can make a tremendous difference in a facility's success. |
Brandt, Michael T. |
|
Mar 1, 2002 |
685 |
| New no-lead solder pastes and reflow techniques: a new study evaluated the performance of SnAgBi and SnAgCu alloys with bare copper and immersion tin pad finishes. |
Heller, David |
|
Mar 1, 2002 |
957 |
| Optimizing printer-based solder paste inspection: a 2-D inspection system combined with SPC can improve PCB quality and increase profitability. |
O'Neal, Dennis |
|
Mar 1, 2002 |
2089 |
| Through-hole rework of thermal dissipating assemblies: step-by-step instructions are given for a new method of reworking expensive through-hole heat sink assemblies. |
Wachter, Ronald |
|
Mar 1, 2002 |
1388 |
| Improving the Flash value stream with new technologies: inline systems provide just-in-time programming of Flash memory devices, improving production line throughput and increasing yields. |
Boone, D. Judd |
|
Mar 1, 2002 |
2311 |
| Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new equipment. |
O'Neil, Steve |
|
Mar 1, 2002 |
1970 |
| The unkindest cut of all: performing etch cuts in external and internal connections can be simple or extremely complex. |
Ferry, Jeff |
|
Mar 1, 2002 |
788 |
| Managing quick-turns: the prototype assembly stage doesn't have to riddle a project with delays. |
Hackathorn, Mark |
|
Mar 1, 2002 |
766 |
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