|
| |
Articles
1-100 out of 100 article(s)
| Title |
Author |
Type |
Date |
Words |
| Fujitsu increasingly outsources production of NB PCs to Taiwanese makers. |
|
|
Nov 16, 2009 |
321 |
| Emax announces the grand prize winner of the Hummer Promotion. |
|
Awards list |
Jun 15, 2009 |
488 |
| Electronics maker has global ambitions for its product lines: company also diversifying in alternative energy market. |
Tiersten, Sylvia |
Company overview |
Sep 22, 2008 |
756 |
| SANYO and EEG commemorate World Environment Day 2008. |
|
|
Jun 16, 2008 |
566 |
| Motivated workforce is the key: entrepreneurs grapple with list of challenges. |
Madler, Mark R. |
|
Aug 6, 2007 |
592 |
| Miraco Inc. |
|
Brief article |
Apr 13, 2007 |
79 |
| Last things first: embracing a product life-cycle framework can deliver technical and environmental leadership to the electronics industry. |
Atanus, Richard |
|
Oct 1, 2006 |
1531 |
| Arma Design Arkansas Research & Development Center. |
Finnie, Carolyn |
Brief article |
Aug 7, 2006 |
280 |
| Welcoming workplaces: in 2005 a record number of Fortune 500 companies are offering protections to gay and lesbian workers and their spouses. Here are 10 shining examples of the best employers. |
Kuhr, Fred |
|
Oct 11, 2005 |
2754 |
| Strategic partners a major factor in Trimble success. |
|
|
Oct 1, 2005 |
332 |
| AI in control: artificial intelligence, expert systems, fuzzy logic, neural nets, and rules-based algorithms for factory control. Although the buzz is quieted, all of it is still around. You just don't notice it. |
Gould, Lawrence S. |
|
Jul 1, 2005 |
1596 |
| LG looks to San Diego for tech direction, style pointers: deal means limited roaming for Leap Wireless subscribers. |
Graves, Brad |
Brief Article |
Mar 21, 2005 |
188 |
| The structural linkages between TQM, product quality performance, and business performance: preliminary empirical study in electronics companies. |
Agus, Arawati |
|
Jan 1, 2005 |
5163 |
| Sonitrol, Inc. |
|
Brief Article |
Jul 1, 2004 |
30 |
| APEI drills into power electronics market. |
Wood, Jeffrey |
|
Apr 12, 2004 |
632 |
| IASCA deal. |
|
Brief Article |
Feb 1, 2004 |
55 |
| Multek's Variation Reduction Initiative, Part 2: the second half of how Multek implemented its statistical-based defect elimination and cycle-time reduction program. |
Perez-Wilson, Mario |
|
Nov 1, 2003 |
2558 |
| Pinnacle Electronic Systems Inc. |
|
Company Profile |
Oct 1, 2003 |
297 |
| Product and component traceability: a complete traceability system will minimize the cost of product recalls and help eliminate them in the future. |
Nelson, John |
|
Sep 1, 2003 |
1956 |
| Depaneling: a study in yield and productivity: saw systems can provide a low stress and fast alternative to hand breaking methods. |
Duck, Allen |
|
Sep 1, 2003 |
1869 |
| Understanding selective pallet soldering residue: proper heating can eliminate flux concerns. |
Munson, Terry |
|
Sep 1, 2003 |
624 |
| Push or pull? |
Hamburg, Lisa |
|
Sep 1, 2003 |
643 |
| IPC Annual Meeting keynote: avoiding commoditization. |
|
|
Sep 1, 2003 |
184 |
| Study: CEM market grew 1% last year. |
|
Brief Article |
Sep 1, 2003 |
299 |
| Omron establishes control equipment company in Shanghai. |
|
Brief Article |
Sep 1, 2003 |
120 |
| Avoiding the resistance panic button: troubleshooting resistance measurement discrepancies. |
Brandt, Michael T. |
|
Sep 1, 2003 |
570 |
| Integrated passives technology and economics: the latest from the recent NEMI roadmap. |
Dougherty, Joseph P. |
|
Sep 1, 2003 |
2542 |
| The latest in underfill for advanced chip assembly: is a low-cost, surface-mount-compatible process possible? |
Baldwin, Daniel F. |
|
Sep 1, 2003 |
1755 |
| Gould now Nikko Materials unit. |
|
Brief Article |
Sep 1, 2003 |
116 |
| The price is right. |
Hamburg, Lisa |
|
Aug 1, 2003 |
599 |
| Web sites worth mentioning. |
|
Brief Article |
Aug 1, 2003 |
221 |
| Surveys and guides. |
|
Brief Article |
Aug 1, 2003 |
73 |
| Feinfocus, Palomar collaborate. |
|
Brief Article |
Aug 1, 2003 |
155 |
| Construction completed on Omron's Keihanna Technology Innovation Center. |
|
Brief Article |
Aug 1, 2003 |
116 |
| Beware the jabberwocky: Phil answers some questions that have recently come his way. |
Zarrow, Phil |
|
Aug 1, 2003 |
964 |
| Rework and repair. |
|
|
Aug 1, 2003 |
825 |
| Exploring the nanoworld: nanotechnology is one ET that is too small to ignore. |
Gilleo, Ken |
|
Aug 1, 2003 |
859 |
| Rework with lead-free solders: temperature differences between eutectic and lead-free solders mandate tighter processes, better profiles and precise rework systems. |
Wood, Paul |
|
Aug 1, 2003 |
2125 |
| Next-generation laser rework: some applications for high-density and lead-free manufacturing process are explored. |
Wang, Paul P.E. |
|
Aug 1, 2003 |
2361 |
| 20/20 foresight: detecting bridges before they occur. |
Pham-Van-Diep, Gerald C. |
|
Aug 1, 2003 |
2301 |
| Don't overlook the details: how to stop micro-etch disintegration and deal with global standards. |
Hymes, Les |
|
Aug 1, 2003 |
670 |
| Odd form assembly challenges: improve productivity by increasing an application's MTBA and decreasing the MTTR. |
Earley, Stan |
|
Aug 1, 2003 |
476 |
| Misery loves company? |
Hamburg, Lisa |
|
Jul 1, 2003 |
886 |
| U.S. demand for EMI/RFI shielding options to Exceed $600 million by 2008. |
|
|
Jul 1, 2003 |
392 |
| IPC PCQ[R.sup.2] test laboratory established in Hong Kong. |
|
Brief Article |
Jul 1, 2003 |
149 |
| Are embedded passives ready for prime time? Key players and innovations shape the future of embedded components. |
Vardaman, E. Jan |
|
Jul 1, 2003 |
984 |
| Selecting the optimal test strategy: how to find the right balance among all the choices--ICT, AOI and AXI. |
Oresjo, Stig |
|
Jul 1, 2003 |
1679 |
| Creating a more flexible manufacturing line: one company changed successfully from producing a few high-volume products to greater quantities of more diverse products. |
Kindness, Ken |
|
Jul 1, 2003 |
1187 |
| Quality Systems Integrated Corporation. |
|
Brief Article |
Jul 1, 2003 |
61 |
| Recon.Inc. |
|
Brief Article |
Jul 1, 2003 |
130 |
| Desperate times ... |
Hamburg, Lisa |
|
Mar 1, 2003 |
700 |
| Murrietta Circuits. |
|
Brief Article |
Mar 1, 2003 |
56 |
| BP Microsystems. |
|
Brief Article |
Mar 1, 2003 |
38 |
| Finding BGA opens in production: a new method using AXI compares reflowed BGA ball sizes to detect open solder joints. |
Leinbach, Glen |
|
Mar 1, 2003 |
1512 |
| Don't give me what I ask for: give me what I need: a guide to creating accurate RFQs. |
Gordon, Pamela |
|
Mar 1, 2003 |
942 |
| "Tool time" in rework: expect the unexpected: common tools can be put to good use during rework. |
Ferry, Jeff |
|
Mar 1, 2003 |
783 |
| Screen printing: welcome to our newest series--Ten Timely Tips! Bimonthly, we'll provide you with 10 technology tips on a certain process aspect culled from suggestions received from readers. |
|
|
Feb 1, 2003 |
872 |
| No cleaning required? Use of a no-clean flux requires a well-controlled clean process. |
Hymes, Les |
|
Feb 1, 2003 |
605 |
| Machine vision challenges: the key to success: flexibility with illumination and lens choice. |
Boulanger, Richard |
|
Feb 1, 2003 |
449 |
| Visualizing and predicting solder paste flow--in real time: a unique method eliminates errors associated with typical post-print measurement systems. |
Andres, Frank |
|
Feb 1, 2003 |
2159 |
| A mass measurement system for screen printing: several experiments have proven mass measurement's viability for monitoring the printing process. |
Lieske, Richard |
|
Feb 1, 2003 |
2403 |
| Solving a BGA footprint mismatch: daughter card to the rescue. |
Ferry, Jeff |
|
Feb 1, 2003 |
662 |
| Newark opens warehouse, offers online ordering. |
Hamburg, Lisa |
Brief Article |
Jan 1, 2003 |
136 |
| Cookson banks on semiconductor packaging. |
Hamburg, Lisa |
Company Profile |
Jan 1, 2003 |
401 |
| Nam Tai Electronics expands, invests. |
|
Brief Article |
Jan 1, 2003 |
222 |
| When is a standard not a standard? Not all standards are equal. |
Crawford, Jack |
|
Oct 1, 2002 |
934 |
| Searching for the perfect BOM: a NEMI team comprised of OEMs and EMS providers offers recommendations for improving bills of materials. |
McElroy, Jim |
|
Oct 1, 2002 |
2336 |
| Linking the factory office to the factory floor: the correct documentation control system can increase productivity and quality while reducing costs. |
Spera, Jason |
|
Oct 1, 2002 |
1718 |
| CSP and flip chip assembly using tacky flux: a recent research project found how placement accuracy of CSPs and flip chips is affected by the component pitch and board layout. |
Emmen, Hans |
|
Oct 1, 2002 |
1770 |
| Computer-aided production planning: a new, free software program enables supervisors to quickly and accurately calculate production line requirements. |
Senawaitis, Anthony J. |
|
Oct 1, 2002 |
409 |
| Coating removal methods: normally, removing a large QFF from a board would be easy, but what do you do with thick, clear, rubbery coatings? |
Ferry, Jeff |
|
Oct 1, 2002 |
832 |
| Living large: building big, bad backpanels: how are these monsters produced? Phil explains the processes and the equipment. |
Zarrow, Phil |
|
Oct 1, 2002 |
797 |
| The devil's in the details: tombstoning revisited: you've checked the oven, the oven profiles, the solder paste and the nitrogen levels--why are you still encountering tombstoning? |
Hymes, Les |
|
Oct 1, 2002 |
687 |
| MLF assembly challenges: high-yield MLF assembly is possible with proper process controls. |
Westby, George |
|
Oct 1, 2002 |
722 |
| All that's old is new again. |
Hamburg, Lisa |
|
Sep 1, 2002 |
761 |
| Vitronics Soltec opens China sales office. |
Shedd, John |
Brief Article |
Sep 1, 2002 |
119 |
| The end of an era: manufacturing research and development appears to be a lost art--one that needs to be rediscovered. |
Vardaman, E. Jan |
|
Sep 1, 2002 |
700 |
| Die skewing: due to the continued growth of flip-chip technology in next-generation products, avoiding die skew is essential. |
Lewis, Brian |
|
Sep 1, 2002 |
672 |
| Component removal and attachment issues: this month, Les clarifies readers' assumptions concerning underfill material in rework and repair and reflow soldering. |
Hymes, Les |
|
Sep 1, 2002 |
680 |
| All solder pastes are not created equal: several in-house tests will reveal if you are using the right solder paste for your application. |
Zarrow, Phil |
|
Sep 1, 2002 |
1819 |
| Making selective soldering work for you: dip or drag? Which process to choose depends entirely on your product. |
Diepstraten, Gerjan |
|
Sep 1, 2002 |
2372 |
| Hand soldering in the 21st century: state-of-the-art hand soldering systems offer improved temperature control, increased process speeds and repeatable process control. |
Huerta, Leo |
|
Sep 1, 2002 |
2212 |
| Making the most of ESD standards: standards can be important and effective tools in any static control program--use them properly. |
Brandt, Michael T. |
|
Sep 1, 2002 |
660 |
| High activity solder paste. |
|
Brief Article |
Sep 1, 2002 |
94 |
| Label printer. |
|
|
Sep 1, 2002 |
60 |
| Well, it sure didn't feel mild. |
Hamburg, Lisa |
|
Jul 1, 2002 |
596 |
| EMS symposiums. |
|
|
Jul 1, 2002 |
249 |
| Solectron expands services in China. |
Shedd, John |
Brief Article |
Jul 1, 2002 |
143 |
| Is it clean? Why do you want to know? Part I: do you sometimes battle with your customers over cleanliness? |
Hymes, Les |
|
Jul 1, 2002 |
672 |
| Area array rework--size does matter! Out with the old manual rework practices. CSPs and flip chips require new automated techniques. |
Naugler, Don |
|
Jul 1, 2002 |
2608 |
| Screening for errors: what's to blame? Stencil printer verification procedures allow production problems to be quickly isolated and corrected. |
O'Hanlon, Michael |
|
Jul 1, 2002 |
1850 |
| Legend and markings repair: boards with damaged legends or markings aren't necessarily destined for the scrap bin--three IPC-approved methods can help. |
Ferry, Jeff |
|
Jul 1, 2002 |
679 |
| Managing your ESD program: implementing an ESD control program is important, and the results can make a tremendous difference in a facility's success. |
Brandt, Michael T. |
|
Mar 1, 2002 |
685 |
| New no-lead solder pastes and reflow techniques: a new study evaluated the performance of SnAgBi and SnAgCu alloys with bare copper and immersion tin pad finishes. |
Heller, David |
|
Mar 1, 2002 |
957 |
| Optimizing printer-based solder paste inspection: a 2-D inspection system combined with SPC can improve PCB quality and increase profitability. |
O'Neal, Dennis |
|
Mar 1, 2002 |
2089 |
| Through-hole rework of thermal dissipating assemblies: step-by-step instructions are given for a new method of reworking expensive through-hole heat sink assemblies. |
Wachter, Ronald |
|
Mar 1, 2002 |
1388 |
| Improving the Flash value stream with new technologies: inline systems provide just-in-time programming of Flash memory devices, improving production line throughput and increasing yields. |
Boone, D. Judd |
|
Mar 1, 2002 |
2311 |
| Used equipment vs. new asking the right questions: depending on your company's needs, used assembly equipment can often be a better buy than brand new equipment. |
O'Neil, Steve |
|
Mar 1, 2002 |
1970 |
| The unkindest cut of all: performing etch cuts in external and internal connections can be simple or extremely complex. |
Ferry, Jeff |
|
Mar 1, 2002 |
788 |
| Managing quick-turns: the prototype assembly stage doesn't have to riddle a project with delays. |
Hackathorn, Mark |
|
Mar 1, 2002 |
766 |
|
