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MIPI Alliance Releases Serial Interface Standard for Display Panels in Mobile Phones.


PISCATAWAY, N.J. -- Mobile industry to converge onto MIPI MIPI Mobile Industry Processor Interface
MIPI Music Industry Privacy Investigations
 Display Serial Interface (DSI (Dynamic Systems Initiative) An umbrella term for a suite of Microsoft products that help manage the Windows environment in large enterprises. DSI was introduced in 2003. ) Specification, improving interoperability and reducing cost of display sub-systems in mobile devices

The Mobile Industry Processor Interface (MIPI) Alliance today announced the release of its Display Serial Interface (DSI) Specification. Implementations of this industry standard will reduce pin count, power consumption and system costs while expanding display panel interoperability in mobile devices. The MIPI Alliance Board has also approved a Display Command Set (DCS (1) See also DSC.

(2) Digital Cross-connect System) A network switching and grooming device used by telecom carriers. See digital cross-connect.
) Specification.

Motivated by the fragmentation wrought by incompatible proprietary interfaces, the MIPI Alliance brings together more than 90 leading companies in pursuit of open standards Specifications for hardware and software that are developed by a standards organization or a consortium involved in supporting a standard. Available to the public for developing compliant products, open standards imply "open systems;" that an existing component in a system can be replaced  to converge interfaces inside mobile terminals. DSI and DCS are the latest in a series of MIPI Standards published or planned by the MIPI Alliance to achieve this goal.

Optimized Technical Solution

DSI is based upon MIPI's D-PHY physical layer specification, a robust, high-speed, low-power, scalable serial interconnect. This SLVS-based physical layer enables data rates as high as 1 Gbps per differential pair Differential pair is a pair of conductors with special characteristics, used for differential signaling.

Examples of the differential pair include:
  • twisted-pair cables, shielded and unshielded
 of wires, while generating very little noise, remaining highly robust to external interference, and achieving best-in-class power consumption.

Building upon the core D-PHY technology, DSI adds features to meet the diverse needs of display subsystems in today's rapidly-evolving mobile devices: a variety of low-power modes, bi-directional communication, native support for 16, 18 and 24-bit pixels, the ability to drive up to four display panels from a single interface, and support for both "smart" (buffered) and "video mode" (unbuffered) display panels at resolutions up to XGA (EXtended Graphics Array) A screen resolution of 1,024x768 pixels. The term stems from IBM's XGA display standard introduced in 1990, which extended VGA to 132-column text and interlaced 1,024x768x256 resolution. XGA-2 later added non-interlaced 1,024x768x64K. .

"This standard brings important benefits to a wide range of mobile systems, from simple low-end devices to highly complex smartphones to larger handheld platforms," said Dick Lawrence, chair of MIPI's Display Working Group. "The mobile industry has been waiting for an open standard to converge upon, and DSI provides the compelling technology to drive that transition."

DCS, the other newly approved display specification, is an application-layer specification for smart display panels.

Broad Industry Support

DSI and DCS were developed through the collaborative efforts of leading handset manufacturers, display manufacturers and semiconductor vendors in the mobile industry.

"Nearly every important supplier or user of this technology played a role in its development," said Tom Vial, Chairman of the Board, MIPI Alliance, Inc. "Given those highly collaborative origins, we're very optimistic that those same companies will soon implement and deploy DSI in their products, leading the industry toward a single preferred solution for display interfaces."

MIPI Alliance Gains Momentum

DSI and DCS represent the third major specification release from MIPI in recent months, complementing MIPI's camera serial interface (CSI-2) and physical layer (D-PHY) specifications released late last year. Later in 2006, two additional MIPI Standards are expected to be finalized, one targeting general-purpose use cases for relatively low-bandwidth peripherals and another targeting high-bandwidth peripherals.

About The MIPI Alliance

The Mobile Industry Processor Interface (MIPI) Alliance is a collaboration of mobile industry leaders with the objective to define and promote open standards for interfaces to mobile application processors. Through these open standards, the MIPI Alliance intends to speed deployment of new services to mobile users by establishing specifications for standard hardware and software interfaces to mobile application processors and encouraging the adoption of those standards throughout the industry value chain. The MIPI Alliance is intended to complement existing standards bodies Following are some of the standards bodies defined in this database. For Windows users of CDE, look up Lessons/Review/Associations. For Web users of CDE's online HTML version, review the Lessons list at the bottom of the definition.

Organization Covers ANSI U.S.
 with a focus on microprocessors, peripherals and software interfaces.

About MIPI Specifications

MIPI Specifications are currently available only to MIPI Alliance member companies. Interested companies are welcome to join the MIPI Alliance. Membership includes limited royalty-free intellectual property rights and obligations. For more information on membership in the MIPI Alliance, visit www.mipi.org.

About MIPI Members

More than 90 member companies participate in the MIPI Alliance, including nearly every leading supplier of mobile phones, applications processors, baseband modems, display panels, camera sensors, and audio and power peripherals. A complete list of member companies can be found at www.mipi.org.

Member Support for DSI and DCS

Member testimonials, including quotes from ATI (ATI Technologies Inc., Markham Ontario, http://ati.amd.com) A leading manufacturer of graphics chips and display adapters. Founded in 1985 by K. Y. Ho, Benny Lau and Lee Lau, ATI chips and boards are widely used by OEMs. , Broadcom, Freescale Semiconductor Freescale Semiconductor, Inc. is an American semiconductor manufacturer. It was created by the divestiture of the Semiconductor Products Sector of Motorola in 2004. Freescale focuses their integrated circuit products on the automotive, embedded and communications markets. , Infineon Technologies For the raceway, see .

Infineon Technologies AG (ISIN: DE0006231004, FWB: IFX, NYSE: IFX) was founded in April 1999 when the semiconductor operations of parent company, Siemens AG, were spun off to form a separate legal entity.
, Nokia, Renesas Technology Renesas Technology Corporation (ルネサス テクノロジ| , Philips Semiconductor, Samsung Electronics Samsung Electronics (SEC, Hangul:삼성전자; KSE: 005930, KSE: 005935, LSE: SMSN, LSE: SMSD) is a South Korean multinational corporation and the world's largest and leading electronics and information technology company. , Solomon Systech, STMicroelectronics and Texas Instruments See TI.

(company) Texas Instruments - (TI) A US electronics company.

A TI engineer, Jack Kilby invented the integrated circuit in 1958. Three TI employees left the company in 1982 to start Compaq.
 Inc., are available at: http://www.mipi.org/docs/mipi-testimonials-display.pdf

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Copyright 2006, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Publication:Business Wire
Date:May 23, 2006
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