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Legacy Electronics gets 3-D memory module patent.


Legacy Electronics (San Clemente San Clemente (săn klĭmĕn`tē), city (1990 pop. 41,100), Orange co., S Calif., on the Pacific coast; inc. 1928. Camp Pendleton, a large U.S. marine base, adjoins the city, which is chiefly residential. , CA, www.legacyelectronics.com), a manufacturer, designer and tester of high-speed high-speed
adj.
1. Operated or designed for operation at high speed: a high-speed food processor.

2. Taking place at high speed: a high-speed chase.

3.
, high-density high-den·si·ty
adj.
Having a high concentration: high-density urban areas. 
 memory modules, printed circuit boards and other computer products, has announced that it was granted U.S. Patent Number 6,545,868 B1 by the U.S. Patent and Trademark Office as of April 8, 2003. The patent covers new three-dimensional three-di·men·sion·al
adj.
1. Of, relating to, having, or existing in three dimensions.

2. Having or appearing to have extension in depth.

3.
 multi-chip memory modules incorporating Legacy's earlier patented Canopy printed circuit board subassembly sub·as·sem·bly  
n. pl. sub·as·sem·blies
An assembled unit forming a component to be incorporated into a larger assembly.


 and process technology (patent no. 6,313,998 B1, November 2001).

The inventors of this module type and holders of the patent are chief technical officer Kenneth Kledzik and president Jason Engle, both of San Clemente, CA.

"This new patent further protects our intellectual property in this area of memory module design," said Engle. "To designers it means a greater variety of mixed technologies can now be used with Canopy, a three-dimensional process that permits a variety of space-limited memory design applications. The process was created in 2001 in part to help reduce thermal failures associated with stacked-chip technologies."
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Title Annotation:Industry News
Publication:Circuits Assembly
Article Type:Brief Article
Geographic Code:1USA
Date:Aug 1, 2003
Words:168
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