Leading Semiconductor Packaging Manufacturer Chooses Veeco Optical Profilers; Veeco Receives Multi-Unit Order for $1.7M.WOODBURY, N.Y. -- Veeco Instruments Inc. (Nasdaq: VECO VECO Vernier Engine Cut Off ) today announced that a leading semiconductor packaging manufacturer has chosen its Wyko(R) SP3250(TM) Optical Profiler to be used for defect inspection and in-line performance monitoring. The SP3250 provides 3D measurements of bumps or panels on flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done substrates. The customer, a leading semiconductor packaging manufacturer, placed a multi-unit order totaling $1.7 million. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Jeannine Sargent, Executive Vice President, Veeco Metrology, "The SP3250 offers unparalleled quality control for the measurement of critical dimensions in advanced semiconductor packaging applications. The increasing complexity and decreasing size of flip chips used for cell phones and graphic applications are driving very challenging metrology requirements. Our SP3250 offers a unique solution that addresses difficult measurements on circuitry and insulator layers within semiconductor packages." According to Gartner Dataquest, the outsourced chip packaging market will grow at a compound annual growth rate of approximately 12% from $18 billion in 2006 to $28 billion in 2010. Ms. Sargent added, "We see high-end semiconductor packaging as an important extended market opportunity for Veeco, which reaches beyond back end bump inspection to other forms of packaging such as organic light emitting diode See LED. panels and printed electronics." According to David Rossi, Vice President of Marketing, Veeco Metrology, "Our instrument provides unparalleled measurement capability and performance, ensuring high yield process control and maximum profitability for flip chip substrate manufacturers. We believe that the growth of the flip chip market, and the increased adoption of flip chip packaging and its close relative, chip scale packaging (hardware) Chip Scale Packaging - (CSP) A type of surface mount integrated circuit packaging that provides pre-speed-sorted, pre-tested and pre-packaged die without requiring special testing. An example is Motorola's Micro SMT packaging. for logic, memory and cell phone chipsets, will continue to drive manufacturing capacity expansion through 2009." The SP3250 is a gauge-capable system that provides dual-mode 3D measurement of bumps or panels for defect inspection and in-line performance monitoring. The instrument is suitable for both 400mm and 600mm panels. Automation, fast image processing, and a simple operator interface enable production-speed data acquisition with minimal operator-to-operator variability. The SP3250 controls bump processes by measuring bump position, height, diameter, X/Y position, volume, and three-point/regression coplanarity In geometry, a set of points in space is coplanar if the points all lie in the same geometric plane. For example, three points are always coplanar; but four points in space are usually not coplanar. . About Veeco Veeco Instruments Inc. provides solutions for nanoscale applications in the worldwide data storage, semiconductor, HB-LED/wireless, and scientific research markets. Our Metrology products are used to measure at the nanoscale and our Process Equipment tools help create nanoscale devices. Veeco's manufacturing and engineering facilities are located in New York New York, state, United States New York, Middle Atlantic state of the United States. It is bordered by Vermont, Massachusetts, Connecticut, and the Atlantic Ocean (E), New Jersey and Pennsylvania (S), Lakes Erie and Ontario and the Canadian province of , New Jersey, California, Colorado, Arizona and Minnesota. Global sales and service offices are located throughout the United States, Europe, Japan and Asia Pacific. Additional information on Veeco can be found at http://www.veeco.com/. To the extent that this news release discusses expectations about market conditions, market acceptance and future sales of Veeco's products, Veeco's future financial performance, future disclosures, or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the challenges of volatility in end market conditions and the cyclical nature of the data storage, semiconductor, HB-LED/wireless and scientific research markets, risks associated with integrating acquired businesses and the acceptance of new products by individual customers and by the marketplace and other factors discussed in the Business Description and Management's Discussion and Analysis Management's discussion and analysis (MD&A) A report from management to shareholders that accompanies the firm's financial statements in the annual report. It explains the period's financial results and enables management to discuss topics that may not be apparent in the financial sections of Veeco's Annual Report on Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. for the year ended December 31, 2005, subsequent Quarterly Reports on Form 10-Q Form 10-Q See 10-Q. and current reports on Form 8-K Form 8-K The form required by the SEC when a publicly held company incurs any event that might affect its financial situation or the share value of its stock. Form 8-K See 8-K. . Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements. |
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