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Latest MSD spec rev covers non-IC parts.

BANNOCKBURN, IL - The latest moisture-sensitive device standard now covers handling, packing and shipping of non-IC electronic components.

J-STD-033C, Handling, Packing, Shipping and Use of Moisture/Re flow and/or Process Sensitive Components, provides guidance for certain electronic components that, to date, had not been covered. Those include parts classified per J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

The C revision also contains a correction made to the desiccant desiccant /des·ic·cant/ (des´i-kant)
1. promoting dryness.

2. an agent that promotes dryness.


des·ic·cant
n.
 calculation and an allowance for less use of desiccant for MSL See multiple single-level. 2 parts, if desired. J-STD-033C also includes diagrams of recommended, not recommended, and acceptable MBB MBB Men's Basketball
MBB Master Black Belt (Six Sigma)
MBB Messerschmitt-Bölkow-Blohm
MBB Medical Biochemistry and Biophysics (Karolinska Institutet, Stockholm, Sweden)
MBB Make Before Break
 air evacuation.

The new standard was developed by IPC and JEDEC. It provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow-sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. - CD

EDITED BY MIKE BUETOW
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Title Annotation:AROUND THE WORLD
Author:Buetow, Mike
Publication:Printed Circuit Design & Fab
Date:Mar 1, 2012
Words:154
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