Lam introduces TCP(TM) 9600SE metal etch system.

FREMONT, Calif.--(BUSINESS WIRE)--April 3, 1995--Lam Research Corporation (NASDAQ:LRCX) announced today that it has introduced the Transformer Coupled Plasma(TM) (TCP) 9600SE system, a significantly enhanced version of its TCP 9600 metal etch system.

The new system combines the advanced process-enabling capabilities of the TCP 9600 system with features that offer strong manufacturing performance during challenging metal etch applications.

According to Tom Yep, vice president of Lam's metal etch business unit, the TCP 9600SE system extends the benefits of Lam's TCP 9600 system by delivering production performance on par with the system's technical capabilities. "By focusing on manufacturing issues, we were able to improve key process variables which affect a chipmaker's bottom line, including throughput, particle control, etch rate uniformity, and cost-of-ownership."

Due to the increasing number of metal layers used in IC manufacturing, metal etch is one of the fastest growing etch market sectors -- projected to reach $560 million by 1997, according to VLSI Research Inc. Lam's TCP 9600 system, currently the leading tool for sub-half-micron production and pilot line metal etch applications, has already achieved wide acceptance in this market.

In beta site tests, the TCP 9600SE system dramatically improved oxide and photoresist etch rate uniformity from 40 to 15 percent at 3 sigma. Customers also experienced improved yield plus a three-fold increase in mean time between cleans (MTBC). In addition, the new system shortened the overall recipe time and even eliminated recipe steps.

These manufacturing gains were provided by a number of new design features. A bottom-actuated clamp and an improved fixed-gap chamber relocate the majority of the particle-generating hardware below the wafer plane. In addition, a new particle reduction kit reduces by-product redeposition, decreases particles during wafer transfer, and enhances control of the pressure regulating devices. The combined result of these particle control features is a reduction of particle densities to less than 0.07 P/cm-squared for 0.2-micron particles.

In addition, chamber-equalized closed-loop helium control shortens equalization time, reduces declamping time, and eliminates the risk of particles backstreaming into the chamber. A hinged DSQ stripper reduces cleaning time by allowing easy access to chamber components during maintenance. The TCP 9600SE system's plasma source has also been enhanced with new chamber ceramics and a larger TCP coil, resulting in more uniform ion density distribution in the plasma and improved oxide and photoresist etch rate uniformities.

Lam reports strong customer interest in the TCP 9600SE system. "Due to its dramatic advantages, we expect sales of the TCP 9600SE system to contribute significantly to increased metal etch market share for Lam," noted Dennis Key, Lam's vice president of worldwide sales and field operations. "Currently, there are 10 TCP 9600SE field evaluation units in either pilot or production lines." Volume shipments of the TCP 9600SE system began in March.

The TCP product line is the fastest ramping product series in Lam's history, with an installed base of more than 200 systems since the first TCP product's introduction in October 1992. Sales for the entire line of TCP products in the first quarter of CY 1995 have doubled over TCP sales in the first quarter of CY 1994. Sales of the TCP product line now represent one third of all new etch orders.

Retrofit kits are available to upgrade Lam's current installed base of TCP 9600 metal etch systems.

Lam Research Corporation is a leading supplier of wafer processing equipment to the worldwide semiconductor industry. The company's broad product offerings are focused on etch and deposition, two of the most vital steps in the fabrication of current and future integrated circuits. Founded in 1980, Lam is headquartered in Fremont, and maintains customer support centers throughout the United States, Europe, Japan, and Asia/Pacific to support its global customer base. The company's common stock trades on The Nasdaq Stock Market under the symbol LRCX.

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Note to Editors: The TCP 9600SE system utilizes Lam's patented Transformer Coupled Plasma technology, consisting of a high-density, planar plasma source capable of generating uniform plasma at low pressure. Independent control over ion density and ion energy enables process optimization with low damage and high selectivities.

CONTACT: Lam Research Corporation, Fremont

Karen McLennan, 510/659-6692

or

MCA 

Andrea Mace, 415/968-8900