Lam Introduces EndPoint Plus Endpoint Detection Solution.

FREMONT, Calif.--(BUSINESS WIRE)--March 20, 1996--Lam Research Corporation (NASDAQ: LRCX), the world's leading supplier of etch equipment used to manufacture semiconductor chips, announced today that it has introduced EndPoint Plus (EPP), an etch endpoint detection solution developed for Lam's oxide, metal, and polysilicon etch systems.

EPP allows chipmakers to integrate this sophisticated real-time etch endpoint detection feature into Lam's etch systems to ensure highly accurate and repeatable performance during the semiconductor production process.

The etch endpoint occurs when a desired amount of material has been removed from the wafer surface. Accurate detection of the endpoint is a critical requirement in advanced semiconductor production etch processing. In today's complex, high-density integrated circuit designs, the exposed etch surface area often represents less that one percent of the total wafer surface. The smaller the exposed etch surface area, the weaker the signal that is generated to identify the etch endpoint.

According to Peter Sullivan, Lam's director of customer support, the low signal-to-noise ratio associated with applications involving small exposed etch surface areas has forced chipmakers to employ undesirable timed etch and overetch schemes to compensate for the limitations of existing endpoint detection systems. "Current techniques are unable to ensure accurate and repeatable endpoint detection where challenging etch requirements are involved. We designed EPP to address these critical issues and also offer greater process control and flexibility," stated Sullivan.

Lam's EPP technique uses a complex set of proprietary and patented software-based algorithms to enhance endpoint signal sensitivity, accuracy, and repeatability. When the etch endpoint signal has been detected, EPP sends a signal to the etch tool to discontinue the etch process. The algorithms also compensate effectively for the weakening of the endpoint signal during extended production runs.

Lam's EPP is currently running in oxide etch applications at numerous customer sites. EPP is available as either a retrofit or upgrade option on Lam's Advanced Capability Rainbow 4520 and 4520XL oxide etch systems. In the fourth quarter of Lam's current fiscal year, EPP will also become available on the Rainbow 4420 and 4420XL polysilicon etch systems, as well as on the Transformer Coupled Plasma (TCP) 9600SE metal etch system.

Subsequent implementations will be made available for the TCP 9400SE polysilicon/polycide etch system, AutoEtch systems, and on modules for Lam's Advanced Capability Alliance cluster tool platform.

The EPP feature comes with a 486-based computer, monitor, keyboard, 500 megabyte hard drive, 1.44MB floppy drive, color monitor, communications interface, and cables. EPP operates independently from the etch system controller, and can be run in either a simulation mode, in which it allows for off-line optimization of endpoint parameters, or in a production mode, in which it operates in real-time and is transparent to the operator.

Lam will demonstrate the EndPoint Plus feature at its booth No. 1537 at the SEMICON/Europa trade show and conference to be held March 27-29, 1996 in Geneva, Switzerland.

Lam Research Corporation is a leading supplier of wafer processing equipment to the worldwide semiconductor industry. The company's broad product offerings are focused on etch and deposition, two of the most vital steps in the fabrication of current and future integrated circuits. Founded in 1980, Lam is headquartered in Fremont, Calif., and maintains customer support centers throughout the United States, Europe, Japan and the Asia/Pacific region to support its global customer base. The company's common stock trades on the Nasdaq Stock Market under the symbol LRCX. Lam's World Wide Web address is: http://www.lamrc.com

CONTACT: Lam Research Corp.

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