Laird Technologies Targets Network Switching-Mode Power Supplies with Low-Cost T-gard(TM) Film-Based Insulators.

CLEVELAND -- Laird Technologies Thermal Product business unit (formerly known as Thermagon), a leading supplier of thermal management solutions, today introduced the T-gard(TM) 5000--a thermally conductive, low-cost, film-based electronic insulator for switching-mode power supply (SMPS) devices used in telecommunication and computer networking products. T-gard 5000 is available for volume distribution immediately.

For Laird Technologies Thermal Products, a unit of Laird Technologies, the innovative T-gard 5000 strengthens the company's success in the established market for thermally conductive insulator materials. Based on Laird Technologies' expertise in high-volume manufacturing, T-gard 5000 offers SMPS manufacturers a solution that is both superior to fiberglass insulation in dielectric strength and consistency as well as less expensive than competing film-based products.

"Laird Technologies' manufacturing scale and our industry-recognized leadership in thermal interface materials positions us to quickly and efficiently enter a new market with an economical and superior alternative to other technologies," said Michael Dreyer, vice president and general manager of Laird Technologies Thermal Products. "Furthermore, Laird's acquisition of Thermagon in 2004 provided us with materials and technology advantages unrivaled in the industry."

Thermally conductive insulators used on discrete electronic power components require a material that is able to both insulate electrically and conduct heat at the same time. Moreover, the material must provide mounting stability during SMPS manufacturing and assembly to prevent cut-through damage, which leads to electrical shorts.

"We saw the need for a lower-cost alternative to the insulators used in the 800-plus watt networking system power supplies, so we leveraged our extensive compound performance experience to develop an insulator with exceptional thermal performance and dielectric strength," noted Robert Kranz, global product manager for Laird Technologies Thermal Products. "We believe our polyimide film-based solution is a far superior alternative to traditional fiberglass-based insulators."

T-gard 5000 is a ceramic-filled silicone conformal coating on a high-temperature polyimide film, providing higher electronic insulating and thermal conductivity qualities than fiberglass-based insulators. This more flexible film-based insulator, while thinner and less expensive than fiberglass, offers superior cut-through resistance.

More information about T-gard 5000 and a companion product, the high-durability film-based insulator, T-gard 3000, is available at http://www.lairdtech.com/pages/products/T-gard-5000.asp. T-gard 5000 is priced from 1.5 to 4.5 cents per TO-220 part, depending on purchase quantity.

About Laird Technologies Thermal Products

Laird Technologies Thermal Products, a division of Laird Technologies, is the leading supplier of high-performance gap filler thermal interface materials (TIM), and a growing provider of high-and-low performance thermally conductive greases, insulators, phase-change materials and insulated metal printed circuit boards. Formed in 2002 with Laird Technologies' decision to build a strong presence in the market for thermal management products and solutions, the division was built on the strategic acquisitions of Thermagon Inc. in 2004, and Orcus Inc., Warth International in 2003. Leveraging Laird Technologies' global presence, the Thermal Products unit has manufacturing, sales and technical support operations in the United States, Taiwan, South and East China and the United Kingdom, as well as sales and technical support operations in Japan, Korea and Singapore. Laird Technologies Thermal Products division is based in Cleveland, Ohio.

About Laird Technologies

Laird Technologies is the world's leading designer and manufacturer of electromagnetic interference (EMI) shielding materials, thermal interface products, and wireless antenna solutions for the telecommunications, data-communications, computer, general electronics, network equipment, aerospace, defense, automotive and medical equipment industries.

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