Enthone Inc. has begun construction on a plating applications laboratory here, with a operations scheduled to begin in September. The site will evaluate and validation Enthone processes prior to beta-site field testing, conduct training and process capability demonstrations, identify and implement processing methodologies, and perform collaborative plating work with key customers. The state-of-the-art applications laboratory will house multiple, high performance plating lines including lines for PCB fabrication final finishes, oxide replacement alternatives and metallization processes. The lab will be managed by Robert Collin, applications and technology manager.
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|Publication:||Printed Circuit Design & Manufacture|
|Date:||Sep 1, 2007|
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