Kopin Ships 500,000th HBT Transistor Wafer; Chips from Kopin's Precision-Grown Wafers Used in Billions of Cell Phones Worldwide.
"Shipping 500,000 HBT transistor wafers is a phenomenal accomplishment, especially given the rigorous performance requirements that our product must consistently meet," said Dr. John C. C. Fan, Kopin's president and chief executive officer. "Kopin was the first company to commercialize volume production of GaAs HBT wafers in 1996, and we have led the market in innovation and volume production ever since. Because our vertical transistor technology was so new in 1996, no one could have imagined that we would ship 500,000 HBT wafers, generate several hundred million dollars of revenue for Kopin and help create billions of dollars of revenue for our power amplifier customers. Today we have the most advanced HBT technologies and high-volume production facilities in the world. We are shipping transistor wafers to support the production of millions of cellular handsets each and every day. We are also working on the next generation of transistors that will further leverage our technologies by incorporating new materials into novel transistor designs. These, in turn, will enable higher levels of circuit performance and integration. By offering a powerful combination of advanced custom transistor development and high-precision volume manufacturing to our partners, we provide a full solution for their transistor design and production requirements."
The critical layers formed in Kopin's vertical transistors are only about 50 nanometers thick. Kopin's tight control of these layer thicknesses within one or two atomic layers consistently enables its customers to achieve unsurpassed circuit yields, thereby greatly improving production efficiency and lowering costs. Kopin's design teams continually work with customers to fashion new transistor types, further drive circuit performance, integrate new functions on power amplifier circuits, and more quickly bring new products to market.
"We developed and executed our HBT strategy in a very disciplined manner in order to achieve this 500,000 HBT wafer shipment milestone," said Matt Micci, Kopin's vice president of HBT sales and marketing. "Through our dedicated efforts, we have earned a worldwide merchant market share of more than 80 percent. Now, we are introducing new solutions to address the growing volume opportunities for power amplifiers in 3G, Wi-Fi and WiMAX markets. We believe GaAs-based HBTs will be the ideal transistors for these emerging wireless standards, and we are excited about the opportunities for our HBT products."
Kopin is a leading developer and manufacturer of digital imaging and telecommunications technologies that enhance the delivery and presentation of video, voice and data. The company has combined advanced AMLCD and integrated circuit technology to produce its CyberDisplay(R) family of award-winning ultra-small, high-density imaging devices for camcorders, digital cameras, personal video eyewear, and thermal weapon sights in consumer and military systems. Telecommunication providers are using Kopin's heterojunction bipolar transistor (HBT) wafers in cellular phones, Wi-Fi, VoIP and high-speed Internet data transmission. For more information, please visit Kopin's Web site at www.kopin.com.
Statements in this news release about Kopin's 500,000th HBT wafer shipment that are not historical in nature may be considered "forward-looking" statements under the "Safe Harbor" provisions of the Private Securities Litigation Reform Act of 1995. These statements involve a number of risks and uncertainties that could materially affect future results. These risk factors include, but are not limited to: the potential for changes in demand for wireless devices and wireless handsets; the potential for competing technologies that offer superior performance or can be offered at a lower cost than GaAs HBT products; Kopin's ability to precisely control HBT wafer growth for superior circuit yield by its customer; Kopin's ability to develop and manufacture advanced HBT products; Kopin's ability to sustain its market share in HBT wafers; general economic and business conditions; changes in business conditions within the wireless component industry; availability of third-party components; and other risk factors and cautionary statements listed in Kopin's periodic reports and registration statements filed with the Securities and Exchange Commission. These filings include Kopin's Annual Report on Form 10-K for the year ended December 31, 2003, and Quarterly Report on Form 10-Q for the quarter ended September 25, 2004.
Kopin - The NanoSemiconductor Company(TM)
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|Date:||Mar 10, 2005|
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