Kopin Ships 500,000th HBT Transistor Wafer; Chips from Kopin's Precision-Grown Wafers Used in Billions of Cell Phones Worldwide.
TAUNTON, Mass. -- Kopin(R) Corp. (Nasdaq: KOPN), the world's leading provider of GaAs Heterojunction Bipolar Transistor The heterojunction bipolar transistor (HBT) is an improvement of the bipolar junction transistor (BJT) that can handle signals of very high frequencies up to several hundred GHz. It is common in modern ultrafast circuits, mostly radio-frequency (RF) systems. (HBT HBT Heterojunction Bipolar Transistor
HBT HyCult Biotechnology (Uden, The Netherlands)
HBT Hanbury-Brown-Twiss (interferometer)
HBT Herring Bone Twill
HBT Heflex Bioengineering Test ) wafers wafers
compressed roughage in flat plates useful for feeding to animals in transit. , today announced that it has attained a major industry milestone with the shipment of its 500,000th HBT wafer. These high-performance transistors form the basis of advanced power amplifier Power amplifier
The final stage in multistage amplifiers, such as audio amplifiers and radio transmitters, designed to deliver appreciable power to the load. circuits that have been inserted into billions of advanced cell phones and wireless LANs A local area network that transmits over the air typically in the 2.4 GHz or 5 GHz unlicensed frequency band. It does not require line of sight between sender and receiver. Wireless base stations (access points) are wired to an Ethernet network and transmit a radio frequency over an area as well as high-speed circuits for fiber optic networks. Kopin HBTs generate clearer, high-frequency signals, consume less power and thus enable longer talk time than other types of transistors.
"Shipping 500,000 HBT transistor wafers is a phenomenal accomplishment, especially given the rigorous performance requirements that our product must consistently meet," said Dr. John C. C. Fan, Kopin's president and chief executive officer. "Kopin was the first company to commercialize volume production of GaAs HBT wafers in 1996, and we have led the market in innovation and volume production ever since. Because our vertical transistor technology was so new in 1996, no one could have imagined that we would ship 500,000 HBT wafers, generate several hundred million dollars of revenue for Kopin and help create billions of dollars of revenue for our power amplifier customers. Today we have the most advanced HBT technologies and high-volume production facilities in the world. We are shipping transistor wafers to support the production of millions of cellular handsets each and every day. We are also working on the next generation of transistors that will further leverage our technologies by incorporating new materials into novel transistor designs. These, in turn, will enable higher levels of circuit performance and integration. By offering a powerful combination of advanced custom transistor development and high-precision volume manufacturing to our partners, we provide a full solution for their transistor design and production requirements."
The critical layers formed in Kopin's vertical transistors are only about 50 nanometers thick. Kopin's tight control of these layer thicknesses within one or two atomic layers consistently enables its customers to achieve unsurpassed circuit yields, thereby greatly improving production efficiency and lowering costs. Kopin's design teams continually work with customers to fashion new transistor types, further drive circuit performance, integrate new functions on power amplifier circuits, and more quickly bring new products to market.
"We developed and executed our HBT strategy in a very disciplined manner in order to achieve this 500,000 HBT wafer shipment milestone," said Matt Micci, Kopin's vice president of HBT sales and marketing. "Through our dedicated efforts, we have earned a worldwide merchant market share of more than 80 percent. Now, we are introducing new solutions to address the growing volume opportunities for power amplifiers in 3G, Wi-Fi and WiMAX markets. We believe GaAs-based HBTs will be the ideal transistors for these emerging wireless standards, and we are excited about the opportunities for our HBT products."
Kopin is a leading developer and manufacturer of digital imaging and telecommunications technologies that enhance the delivery and presentation of video, voice and data. The company has combined advanced AMLCD (Active Matrix LCD) See active matrix. and integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for technology to produce its CyberDisplay(R) family of award-winning ultra-small, high-density imaging devices for camcorders, digital cameras, personal video eyewear eye·wear
1. Eyeglasses, goggles, or other objects worn over the eyes.
2. Fashionable eyeglasses. , and thermal weapon sights in consumer and military systems. Telecommunication providers are using Kopin's heterojunction bipolar transistor (HBT) wafers in cellular phones, Wi-Fi, VoIP and high-speed Internet See broadband. data transmission. For more information, please visit Kopin's Web site at www.kopin.com.
Statements in this news release about Kopin's 500,000th HBT wafer shipment that are not historical in nature may be considered "forward-looking" statements under the "Safe Harbor Safe Harbor
1. A legal provision to reduce or eliminate liability as long as good faith is demonstrated.
2. A form of shark repellent implemented by a target company acquiring a business that is so poorly regulated that the target itself is less attractive. " provisions of the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. These statements involve a number of risks and uncertainties that could materially affect future results. These risk factors include, but are not limited to: the potential for changes in demand for wireless devices and wireless handsets; the potential for competing technologies that offer superior performance or can be offered at a lower cost than GaAs HBT products; Kopin's ability to precisely control HBT wafer growth for superior circuit yield by its customer; Kopin's ability to develop and manufacture advanced HBT products; Kopin's ability to sustain its market share in HBT wafers; general economic and business conditions; changes in business conditions within the wireless component industry; availability of third-party components; and other risk factors and cautionary statements listed in Kopin's periodic reports and registration statements filed with the Securities and Exchange Commission. These filings include Kopin's Annual Report on Form 10-K Form 10-K
A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information.
See 10-K. for the year ended December 31, 2003, and Quarterly Report on Form 10-Q Form 10-Q
See 10-Q. for the quarter ended September 25, 2004.
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