K&S Wins SGS-THOMSON Microelectronics Order for 25 Model 8020 Wire Bonders.WILLOW GROVE, Pa.--(BUSINESS WIRE)--Jan. 7, 1998--Kulicke & Soffa Industries Inc. (NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on : KLIC) announced that SGS-THOMSON Microelectronics (NYSE NYSE See: New York Stock Exchange : STM (Scanning Tunneling Microscope) A microscope that can image down to the atomic level. An STM uses a piezoelectric tube with a tiny sharp tip at the end that is moved within nanometers of the object being sampled. ) has ordered 25 of its new Model 8020 wire bonders for its semiconductor assembly factory in Malta. This is the first order won by K&S from SGS-THOMSON for the production of ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) packages. The bonders feature the new K&S Unibody(TM) transducer and adaptive ultrasonics ultrasonics, study and application of the energy of sound waves vibrating at frequencies greater than 20,000 cycles per second, i.e., beyond the range of human hearing. system -- essential for low-temperature bonding of BGA devices. "The majority of these bonders are going into a BGA production line that was previously populated exclusively with machines supplied by a competitor," said Michael Wolf, K&S vice president of sales. "SGS-THOMSON already is a K&S customer, but we focused on this BGA application in an attempt to increase our market share, and we won this competitive order primarily because of the 8020's best-in-class capability. "We are confident that its industry leading performance will expand our already dominant position in the worldwide wire bonding market, where we believe K&S enjoys a greater than 80 percent share of BGA assembly." SGS-THOMSON Microelectronics is a global independent semiconductor company with strong European roots listed on the New York Stock Exchange New York Stock Exchange (NYSE) World's largest marketplace for securities. The exchange began as an informal meeting of 24 men in 1792 on what is now Wall Street in New York City. (NYSE: STM) and on the Bourse de Paris. It designs, develops, manufactures and markets a broad range of semiconductor integrated circuits (ICs) and discrete devices used in a wide variety of microelectronics applications, including telecommunications systems, computer systems, consumer products and industrial automation and control systems. Further information on SGS-THOMSON can be found at www.st.com . Kulicke & Soffa is the world's largest supplier of semiconductor assembly equipment. The company serves the integrated circuit assembly market with a product offering that includes wire bonding, die bonding and wafer dicing equipment, factory automation and integration products and services, and expendable tools and materials. It has sales and service facilities worldwide. The company's web site address is www.kns.com . CONTACT: Kulicke & Soffa, Willow Grove Media: Henri Van Parys, 215/784-6818 Analysts: Jim Chiafery, 215/784-6436 |
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