It's been one of those (good) times ... IPC has stayed busy, releasing 21 standards and documents in the past three months.In 2003, I reported on 15 new document releases by IPC (1) (InterProcess Communication) The exchange of data between one program and another either within the same computer or over a network. It implies a protocol that guarantees a response to a request. . However, we have released nine standards and 12 test methods in the three months since my last report. Committee involvement by your industry peers is increasing, a positive sign for this industry. Most committee meetings for document development are open meetings, and anyone can participate. Effective communication requires that the communicators use defined terms. IPC-T-50G, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, provides that support. Revision G nearly doubles the listings, with greatly expanded coverage of assembly terms. IPC is working with the International Electrotechnical Commission See IEC. (standard, body) International Electrotechnical Commission - (IEC) A standardisation body at the same level as ISO. (IEC (International Electrotechnical Commission, Geneva, Switzerland, www.iec.ch) An organization that sets international electrical and electronics standards founded in 1906. It is made up of national committees from over 60 countries. IEC - International Electrotechnical Commission ) to establish this as an international standard, replacing or supplementing the current IEC dictionary. Two recently released design/support documents are the guide: IPC-CM-770E, Requirements for Component Mounting, which adds discussion of new assembly technologies and is completely reformatted, and IPC-2251, Design Guide for the Packaging of High Speed Electronic Circuits. Three other PCB-related documents are also available. IPC-4411A, Specification and Characterization Methods for Nonwoven non·wo·ven adj. Made by a process not involving weaving. Used of textiles. n. Material or a fabric made by a process not involving weaving. Para-Aramid Reinforcement, is a PCB PCB: see polychlorinated biphenyl. PCB in full polychlorinated biphenyl Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound. fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. materials standard. IPC-6013A, Qualification and Performance Specification for Flexible Printed Boards was updated, as was IPC-D-326A, Information Requirements The information needed to support a business or other activity. Systems analysts turn information requirements (the what and when) into functional specifications (the how) of an information system. for Manufacturing Printed Circuit Boards. One standard in use by the interconnect and electronics manufacturing This article presents a typical manufacturing process of an electronic assembly. Component manufacturing Components such as resistors, capacitors and integrated circuits are generally made by specialized contractors. service industries is J-STD-004A, Requirements for Soldering Fluxes. The standards effort has included updating 11 IPC-TM-650 Test Methods and developing one new test method:
2.6.3.6 Surface Insulation Resistance-Fluxes-Telecommunications
2.3.13A Determination of Acid Value of Liquid Solder Flux--
Potentiometric and Visual Titration Methods
2.3.28.1 Halide Content of Soldering Fluxes and Pastes
2.3.32D Flux Induced Corrosion (Copper Mirror Method)
2.3.33D Presence of Halides in Flux, Silver Chromate Method
2.3.34C Solids Content, Flux
2.3.35C Halide Content, Quantitative (Chloride & Bromide)
2.3.35.1D Fluorides By Spot Test, Fluxes-Qualitative
2.3.35.2A Fluoride Concentration, Fluxes-Quantitative
2.4.14.2A Liquid Flux Activity, Wetting Balance Method
2.4.46A Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted
from Solder Paste, Cored Wires or Preforms
2.6.15C Corrosion, Flux
IPC-7912A, Calculation of DPMO DPMO Defects Per Million Opportunities (Six Sigma) DPMO Deployment Process Modernization Office DPMO Defense Prisoner of War (POW)/Missing Personnel (MP) Office and Manufacturing Indices for Printed Board Assemblies, adds lands on boards that are to be unpopulated as opportunities for defects and establishes that components placed on the lands would then be defects. The standard can be used by companies that use a common assembly with different component configurations, each with a unique part number. Finally, publication of J-STD-001CS, Space Applications Electronic Hardware Addendun to J-STD-001C, was coordinated by NASA NASA: see National Aeronautics and Space Administration. NASA in full National Aeronautics and Space Administration Independent U.S. representatives and supported by suppliers to the European Space Agency European Space Agency (ESA), multinational agency dedicated to the promotion, for exclusively peaceful purposes, of cooperation among European states in space research and technology. . The exception document will enable NASA to cancel some federal standards. IPC committees have seven more documents in ballot, including: * IPC-7095A, Design and Assembly Process Implementation for Ball Grid Arrays (BGAs) (2nd Ballot) * IPC-A-600G, Acceptability of Printed Boards * IPC-6012B, Qualification and Performance Specification for Rigid Printed Boards * IPC-HDBK-005, Soldering Pastes Handbook * J-STD-020C, Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface-Mount Devices * IPC-2546, Amendment 2, Sectional Requirements for Specific PCB Assembly Equipment-Amendment 2: Final Assembly and Packaging * IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. Readers can download any draft document for review at www.ipc.org/status. Jack Crawford is director of certification and assembly technology with IPC, Northbrook, IL; (847) 790-5393; email: Jack Crawford@ipc.org. [ILLUSTRATION OMITTED] |
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