Inventor of the reverse interconnect process keynotes PCB East.
Fjelstad's keynote, titled "Robust Environmentally Friendly Electronics Assembly," will reveal a new electronics assembly process said to use no solder--eliminating many of the risks and reliability exposures associated with leadfree solders--and no conventional circuit boards.
The Reverse Interconnection Process embodies a new sequence of core processing technologies, and is achieved through direct copper-copper plateup onto an inverted cast-in-place component-array platform. The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant solutions for products ranging from consumer to mil-aero applications.
Founder and president of Verdant Electronics, Fjelstad has more than 35 years of experience in electronics interconnection and packaging in a variety of capacities, from chemist to process engineer and from international consultant to CEO.
The keynote is free to attend; however, registration and a badge are required for admission. To register online or find out more about the Oct. 21-26 show, visit pcbeast.com.
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|Title Annotation:||AROUND THE WORLD|
|Publication:||Printed Circuit Design & Manufacture|
|Date:||Sep 1, 2007|
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