Printer Friendly

Inventor of the reverse interconnect process keynotes PCB East.

ATLANTA -- UP Media Group Inc., parent company of Printed Circuit Design & Manufacture, announced Joseph Fjelstad, founder and president of Verdant Enterprises, will deliver the keynote address at PCB Design Conference East 2007 in Durham, NC, on Oct. 23, at 11 a.m. in the Durham Marriott at the Civic Center.

Fjelstad's keynote, titled "Robust Environmentally Friendly Electronics Assembly," will reveal a new electronics assembly process said to use no solder--eliminating many of the risks and reliability exposures associated with leadfree solders--and no conventional circuit boards.

The Reverse Interconnection Process embodies a new sequence of core processing technologies, and is achieved through direct copper-copper plateup onto an inverted cast-in-place component-array platform. The process has demonstrated the conceptual potential for the manufacture of high-density, high-performance, high-reliability and environmentally (i.e., RoHS) compliant solutions for products ranging from consumer to mil-aero applications.

Founder and president of Verdant Electronics, Fjelstad has more than 35 years of experience in electronics interconnection and packaging in a variety of capacities, from chemist to process engineer and from international consultant to CEO.

The keynote is free to attend; however, registration and a badge are required for admission. To register online or find out more about the Oct. 21-26 show, visit
COPYRIGHT 2007 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2007, Gale Group. All rights reserved.

Article Details
Printer friendly Cite/link Email Feedback
Title Annotation:AROUND THE WORLD
Author:Nargi-Toth, Kathy
Publication:Printed Circuit Design & Manufacture
Date:Sep 1, 2007
Previous Article:Laboratory expansion.
Next Article:Valor Computerized Systems.

Related Articles
Coming to a campus near you: focus the nation joins schools in climate change collaboration.
Joint Venture Formed for Wireless Broadband Business Based on Mobile Wimax Technology.
The mother of invention.
Japan PCB production up.
Building and maintaining CAD libraries: choose library tools that store component and land pattern data in a generic format that can be used with any...
BGA/PCB interconnect design guidelines: a successful BGA design is the right combination of pad diameter, drill diameter, anti-pad and aspect ratio...
Optoelectronic substrates--will it happen? The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to...
A familiar picture: Ibiden reigned (again) as the top PCB fabricator in 2006.
Award winning designs: an interview with Peter Dill, 2007 winner of the Mentor Graphics PCB Technology Leadership Award.

Terms of use | Copyright © 2016 Farlex, Inc. | Feedback | For webmasters