Intel Transforms Notebook PCs With New Mobile Pentium III Processor-M; 0.13-Micron Process Technology and Other Advances Drive Higher Performance and Low Power.Business Editors/High-Tech Writers SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif.--(BUSINESS WIRE)--July 30, 2001 Intel Corporation (company) Intel Corporation - A US microelectronics manufacturer. They produced the Intel 4004, Intel 8080, Intel 8086, Intel 80186, Intel 80286, Intel 80386, Intel 486 and Pentium microprocessor families as well as many other integrated circuits and personal computer networking today announced five new processors based on Intel's advanced 0.13-micron (130 nanometer) process technology that significantly increase the capabilities of mobile PCs. The new family of Intel(R) Pentium(R) III processor-M products feature architectural enhancements to increase performance, reduce power and improve battery life. They are available in volume today at speeds up to 1.13 GHz, the industry's fastest speed for mobile processors. Intel also announced the new highly scalable, cost effective mobile Intel(R) 830 Chipset family. Together, the new chipset and mobile processor products enable PC makers to design the industry's most innovative, high-performance notebooks that are thinner, lighter and have longer battery life. "Intel is using its silicon leadership, advanced mobile processor technologies and new mobile chipset family to deliver the highest performance and low power for the mobile market segment," said Frank Spindler, vice president and general manager of Intel's Mobile Platforms Group. "Incredible performance, great battery life and wireless connectivity -- mobile PCs just made a major leap forward with Pentium III The successor to the Pentium II from Intel. Introduced in the spring of 1999 at 500 MHz, the Pentium III architecture was similar to the Pentium II with the addition of 70 new instructions optimized for multimedia (see SSE). processor-M based systems." Intel's Advanced 130-Nanometer Process Technology By incorporating its advanced 130-nanometer process technology, Intel is able to build transistors (the switches used to create the ones and zeroes of the information age) that are the fastest in the industry. This new process technology also features high speed copper interconnects that accelerate the flow of data inside the processor, further increasing performance while consuming less power. Processors built on Intel's 130-nanometer technology consume up to 40 percent less power and are up to 20 percent faster than the previous 180 (0.18-micron) nanometer process. Chips using Intel's 130-nanometer technology contain circuitry that is about 1/1000th the width of a human hair (1000 nanometers equal 1-micron). Intel Delivers Next-Generation Mobile Pentium See Pentium M. III Processor-M The mobile Pentium III processor-M is the world's most advanced mobile processor, providing almost a 50 percent performance gain over the previous mobile Intel(R) Pentium(R) III processor on data intensive applications.(2) It features several architectural advancements including: 512KB L2 cache (Level 2 cache) A memory bank built into the CPU chip, packaged within the same module or built on the motherboard. The L2 cache feeds the L1 cache, and its memory is slower than L1 memory. The L2 cache feeds the L1 cache, which feeds the processor. (twice the L2 cache size of the previous generation), the new Data Prefetcher (an L2 cache enhancement that results in improved performance) and a 133-MHz processor system bus. In addition, the processor supports Enhanced Intel SpeedStep(TM) technology that automatically switches between Maximum Performance Mode and Battery Optimized Mode based on the application demand on the processor, providing the best balance of performance and low power. The processor also uses new Intel packaging technology enabling thinner and lighter mobile PCs. The new Deeper Sleep mode provides a power reduction from previous low power sleep states to help extend battery life -- reaching power levels as low as two tenths of a watt or less -- even while running software applications. New notebook designs based on the new processor will be available from leading PC makers including: Acer America Corporation, Compaq Computer Corporation (company) Compaq Computer Corporation - The largest US manufacturer and vendor of IBM PC compatible personal computers and servers. Compaq was started in 1982 by three ex-Texas Instruments employees. Quarterly sales $2499M, profits $210M (Aug 1994). http://compaq.com/. , Dell Computer Corporation (company) Dell Computer Corporation - One of the biggest US manufacturers of IBM PC compatibles. "From notebooks to networks", their slogan says. http://us.dell.com. , Fujitsu Corporation, Gateway Inc., Hewlett-Packard Company, IBM (International Business Machines Corporation, Armonk, NY, www.ibm.com) The world's largest computer company. IBM's product lines include the S/390 mainframes (zSeries), AS/400 midrange business systems (iSeries), RS/6000 workstations and servers (pSeries), Intel-based servers (xSeries) Corporation, NEC (NEC Corporation, Tokyo, www.nec.com, www.necus.com) An electronics conglomerate known in the U.S. for its monitors. In Japan, it had the lion's share of the PC market until the late 1990s (see PC 98). NEC was founded in Tokyo in 1899 as Nippon Electric Company, Ltd. Corporation, Sony Corporation, and Toshiba America Information Systems, Inc. Initial product offerings will be focused on full-size and thin and light mobile systems. Later this year Intel will extend the Pentium III processor-M family to include low voltage Low voltage is an electrical engineering term that broadly identifies safety considerations of an electricity supply system based on the voltage used. While different definitions exist for the exact voltage range covered by "low voltage", the most commonly used ones include "mains and ultra-low voltage versions, targeted for mini- and sub-notebook market segments. New Mobile Intel(R) 830 Chipset Family The Intel(R) 830 Chipset family includes three new chipsets designed to take advantage of the mobile Pentium III processor-M performance and low power characteristics. The Intel 830MP supports external graphics and is available today. Later this year Intel will provide the Intel 830M with high-performance integrated graphics Refers to having the video display circuitry of a computer contained directly on the motherboard rather than on a separate plug-in card (the display adapter). Integrated graphics typically share memory with the CPU (see shared video memory) and provide a more economical alternative to the , while the Intel 830MG will offer integrated graphics for lower cost systems. The new chipset uses high-performance PC-133 SDRAM (Synchronous DRAM) A type of dynamic RAM (DRAM) memory chip that has been widely used since the late 1990s. SDRAM chips eliminated wait states by dividing the chip into two cell blocks and interleaving data between them. , which is 33 percent faster than memory supported in the previous Intel 440BX The Intel 440BX, also known as the i440BX, is a chipset from Intel, supporting Pentium II, Pentium III, and Celeron processors. Although the i440BX chipset is dated (mid-1998), with a "slotket" adapter and few simple hardware modifications Pentium III CPUs (Tualatin core) in single chipset. It also includes 1GB memory support for a 50 percent increase over previous generations. The Intel 830 Chipset also features a hub architecture that increases bandwidth and provides for a smoother and richer multimedia and Internet experience. The chipset improves connectivity and flexibility by accommodating a total of six USB ports, while integrated local area network (LAN (Local Area Network) A communications network that serves users within a confined geographical area. The "clients" are the user's workstations typically running Windows, although Mac and Linux clients are also used. ) capability minimizes board space and reduces cost. Like the new mobile processors, the chipset integrates the new Deeper Sleep low power mode to further conserve power and help prolong battery life. Specifications and Pricing The five new mobile processors at speeds of 1.13 GHz, 1.06 GHz, 1.0 GHz, 933 MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. , and 866 MHz are available today. In Enhanced Speed Step automatic mode, the mobile Intel Pentium III processor-M runs at up to 1.13 GHz at 1.4 volts (Maximum Performance Mode). In Battery Optimized Mode, it runs at 733 MHz and 1.15 volts, and consumes less than 2 watts of average power.(2) Intel will offer boxed versions of its mobile Pentium III processor-M to enable system integrators such as Asus and Clevo that configure build-to-order mobile PCs. In 1,000-unit quantities, with either micro-flip-chip Ball Grid Array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. or micro-flip-chip Pin Grid Array See PGA. (hardware) Pin Grid Array - (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. packaging, the mobile Pentium III processor-M at 1.13 GHz, 1.06 GHz, 1.0 GHz, 933 MHz, and 866 MHz are priced at $625, $499, $394, $278 and $247, respectively. In 1,000- unit quantities, the Intel 830MP chipset is $37.50. Other Products Based on 130-Nanometer Technology Intel is also moving forward with plans for desktop and server processors as well as flash memory components manufactured on the 130-nanometer process. The Pentium III processor at speeds of 1.2 GHz and 1.13 GHz will soon be available for small form-factor desktop PCs. In addition, a 1.13-GHz Intel Pentium III processor for single and dual-processor servers has been shipping since May. Several OEMs have already introduced systems based on this technology, with more expected in the third quarter. Intel also expects to release a 1.26-GHz version of the Pentium III processor for servers later this year. These products are used in systems targeting front-end, application servers and deliver a balance of performance and lower power without sacrificing reliability and availability. Intel will be sampling its first 130-nanometer flash products later this year. Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. (1) Third party marks and brands are the property of their respective holders. (2) For more information on Intel's mobile power measurement, visit: http://developer.intel.com/design/mobile/perfbref/ |
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