Intel Strengthens Commitment to Applied Computing With Faster Pentium III and Celeron Processors; Five OS Vendors Join Intel Applied Computing Platform Provider Program.Business Editors/High-Tech Writers
Applied Computing Conference & Expo
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Intel Corporation (company) Intel Corporation - A US microelectronics manufacturer. They produced the Intel 4004, Intel 8080, Intel 8086, Intel 80186, Intel 80286, Intel 80386, Intel 486 and Pentium microprocessor families as well as many other integrated circuits and personal computer networking today broadened the performance and range of its Pentium(R) III and Celeron(TM) processors for applied computing applications consisting of high-performance, connected systems designed for dedicated use.
New building blocks added to Intel's extended lifecycle roadmap include higher-speed Pentium III The successor to the Pentium II from Intel. Introduced in the spring of 1999 at 500 MHz, the Pentium III architecture was similar to the Pentium II with the addition of 70 new instructions optimized for multimedia (see SSE). and Celeron processors and enhanced tools for board and system development. In addition, five new companies joined the Intel(R) Applied Computing Platform See platform. Provider (ACPP ACPP Applied Computing Platform Provider
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ACPP Access Control Point Program ) program.
Today's announcement comprises:
-- Intel Pentium III processor, 733 MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. , in FC-PGA FC-PGA - Flip Chip Pin Grid Array package, 256K
L2 cache (Level 2 cache) A memory bank built into the CPU chip, packaged within the same module or built on the motherboard. The L2 cache feeds the L1 cache, and its memory is slower than L1 memory. The L2 cache feeds the L1 cache, which feeds the processor. on die, 133 MHz processor side bus
-- Intel Pentium III processor, 700 MHz, in FC-PGA package, 256K
L2 cache on die, 100 MHz processor side bus
-- Intel Celeron processor, 566 MHz, in FC-PGA package, 128K L2
cache on die
-- Intel Pentium III processor - Low Power, 500 MHz, in BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used.
-- Intel Celeron processor - Low Power, 400 MHz, in BGA package
-- Leading operating system vendors in the Intel ACPP program
Products and Support for the Future
"Today's announcement greatly widens developers' choices by expanding the range of performance and price options available including faster Pentium III and Celeron processors," said Joe Jensen, general manager, Embedded Intel Architecture Division. "With its comprehensive offering of processor technologies and extended lifecycle solutions, Intel is boosting both its momentum and commitment of support for applied computing applications in commercial and industrial market segments."
Higher Performance, Extended Lifecycle Support
The Pentium III processor at 700 and 733 MHz with extended life cycle support brings a new level of performance to compute-intensive applied computing applications. Combined with the Intel 840 Chipset, the Pentium III processor at 733 MHz offers increased performance with a processor side bus at 133 MHz. The Intel 840 Chipset delivers high bandwidth, dual processing capability and support for up to 4 GB of high-throughput RDRAM (Rambus DRAM) Pronounced "r-d-ram." A dynamic RAM chip technology from Rambus, Inc., Los Altos, CA (www.rambus.com). Rambus licensed its memory designs to semiconductor companies, which manufactured the chips. memory. The Pentium III processor at 700 MHz is validated with both the 440BX AGPset and the Intel 810 Chipset.
The Celeron processor at 566 MHz in the FC-PGA package brings new levels of performance at an exceptional value for developers of applied computing products. Fully compatible with the PGA (1) (Professional Graphics Adapter) An early IBM PC display standard for 3D processing with 640x480x256 resolution. It was not widely used.
(2) (Programmable Gate Array) See gate array and FPGA. 370 socket specification, the FC-PGA package is Intel's latest offering for processors targeted at small form factor, cost-sensitive designs while delivering maximum performance and scalability.
The Pentium III processor -- Low Power (500 MHz) and the Celeron processor -- Low Power (400 MHz) offer new performance and value options to thermally sensitive, space-constrained applied computing applications. The 440BX AGPset supports both processors.
Scalability for Lower Cost, Faster Time to Market
The Intel Scalable Performance Board Design program enables developers to design a single board that can be populated at build time with any of the Pentium III or Celeron processors in a 370-pin PGA package without modification. The program provides price and performance options, lower total cost of ownership, and reduces the validation effort for multiple designs, resulting in faster time to market.
ACPP Program Embraces Software
The Intel Applied Computing Platform Provider program has added five industry-leading operating system companies that support, enable, or deliver solutions optimized for Intel products for applied computing market segments. New members include LynuxWorks, Inc., Microsoft Corporation, QNX A multiuser, multitasking, real time operating system for PCs from QNX Software Systems, Ltd., Ottawa, Ontario (www.qnx.com), that is noted for its low-memory requirement and rapid response. Similar to Unix, it has been in use since the early 1980s. Software Systems Ltd., VenturCom, Inc., and Wind River Systems, Inc. Now with a membership totaling 15 companies, the Intel ACPP program encompasses board and system developers as well as operating system suppliers. Intel building blocks and ACPP solutions are optimized to provide customized, validated platforms to application developers resulting in reduced time to market and new, innovative products.
Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking, and communications products. Additional information about Intel is available at www.intel.com/pressroom.
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