Intel Silicon, Platform Innovations Speed Advances in Mobile Computing.Business Editors/High-Tech Writers Intel Developer Forum Intel Developer Forum (IDF), is a twice yearly gathering of technologists to discuss Intel products and products based around Intel products. The first IDF was in 1997. There is usually a Spring IDF and a Fall IDF. Spring 2004 SAN FRANCISCO--(BUSINESS WIRE)--Feb. 18, 2004 From new audio and video experiences to closed-lid access to email, Intel Corporation (company) Intel Corporation - A US microelectronics manufacturer. They produced the Intel 4004, Intel 8080, Intel 8086, Intel 80186, Intel 80286, Intel 80386, Intel 486 and Pentium microprocessor families as well as many other integrated circuits and personal computer networking today showed how the evolving capabilities of mobile computing Using a computing device while in transit. Mobile computing implies wireless transmission, but wireless transmission does not necessarily imply mobile computing. Fixed wireless applications use satellites, radio systems and lasers to transmit between permanent objects such as buildings are attracting new users and creating new opportunities for developers. New mobile products, platform innovations and industry enabling programs are helping to grow both the overall size of the notebook market segment and the number of notebooks sold as a percentage of total PC shipments, said Anand Chandrasekher, Intel vice president and general manager of Intel's Mobile Platforms Group. Speaking at the Intel Developer Forum, Chandrasekher outlined Intel's plans to enhance Intel(R) Centrino(TM) mobile technology and the Intel Pentium(R) M processor. He also highlighted new concept mobile PCs with features designed to reshape mobile computing for a wide variety of users. "In the last year, enterprise customers have repeatedly told us that a laptop based on Intel Centrino mobile technology is the best laptop available," said Chandrasekhar. "With compelling new mobile platform capabilities and the tremendous industry momentum around Wi-Fi and Intel Centrino mobile technology, we envision a rise in new and innovative applications for mobile computing in both the enterprise and the home." Driving Momentum Through Silicon Innovation Intel's product roadmap for 2004 will further advance the mobile computing experience with even higher performance and more wireless connectivity choices, and by enabling longer battery life in thin and light designs. In the second quarter of 2004, Intel plans to introduce a higher-performing Intel Pentium M A family of CPUs from Intel that are part of its Centrino brand for mobile computing. Introduced in 2003 at speeds up to 1.6 GHz, it was formerly code named "Banias." Introduced in 2004, the second-generation Pentium M (code named "Dothan") uses the same chip package but is built with 90 processor (code-named "Dothan"), and in the second half of 2004 Intel plans to update all the elements of Intel Centrino mobile technology with the "Sonoma" platform introduction. Sonoma includes a new Intel Pentium M processor with a faster, 533 MHz (MegaHertZ) One million cycles per second. It is used to measure the transmission speed of electronic devices, including channels, buses and the computer's internal clock. A one-megahertz clock (1 MHz) means some number of bits (16, 32, 64, etc. front-side bus; a new Wi-Fi component that supports the 802.11a, 802.11b and 802.11g wireless networking See wireless network. standards; and a new chipset code-named "Alviso." The chipset will support third-generation graphics and enable support for devices and standards such as Direct Media Interface with improved bandwidth, TV-out, high definition audio, eight USB ports, four-port PCI Express A high-speed peripheral interconnect from Intel introduced in 2002. Note that although sometimes abbreviated "PCX," PCI Express is not the same as "PCI-X" (see PCI-SIG and PCI-X for comparison). As a result of the confusion, "PCI-E" or "PCIe" is the accepted abbreviation. , and up to 2GB of DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory 2 memory. Alviso will also support Intel High Definition Audio Intel High Definition Audio (IHD or "Azalia") refers to the specification released by Intel in 2004 for delivering high-definition audio that is capable of playing back more channels at higher quality than previous integrated audio codecs like AC97. with low power capabilities to reduce power consumption by allowing the processor to remain in a sleep state while audio activity is happening. Mobile PC sales are growing dramatically, with consumer laptop sales representing the fastest-growing sub-segment, according to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. analyst firm IDC.** "With the performance enhancements and new capabilities of Dothan and Sonoma and the growth of retail system availability, Intel Centrino mobile technology-based mobile PCs will become the dream consumer notebook," said Chandrasekher. Reshaping Mobile PCs to Reach New Users In addition to delivering innovative silicon building blocks, Intel works closely with its customers and other developers to help accelerate the development of new and innovative mobile PCs. The Mobile Platform Vision Guide (MPVG) provides a framework for developing future notebooks based on Intel Centrino mobile technology, and Intel's concept mobile PCs serve as early demonstrations of the MPVG, highlighting innovation opportunities for the PC industry. The 2004 MPVG featured Intel's first example of Extended Mobile Access (EMA (1) (Enterprise Management Architecture) An earlier strategic plan from Digital for integrating network, system and application management. It provided the operating environment for managing a multi-vendor network. ), which enables closed-lid instant access to email and other information through a secondary display on the lid of notebook PCs based on Intel Centrino mobile technology. PC manufacturer Lenovo (Legend) demonstrated a model of its EMA-capable "Vela vela plural of velum. " laptop, and Insyde Software announced software that enables EMA functions, including allowing the laptop to enter a low-power mode when the lid is closed, while remaining connected to a wireless enterprise network. To demonstrate 2005 mobile platform concepts, Intel has developed three concept mobile PCs, code-named "Florence." The 12-inch model features EMA functionality and converts from a laptop to a tablet PC, allowing maximum flexibility to balance office and mobile demands. The 15.4-inch model is designed to enhance worker productivity with fingerprint and smartcard security, built-in array microphones and camera for collaboration, and EMA functionality. The 17-inch Mobile Entertainment PC allows users to communicate and be entertained around the home with a wide-screen display in a sleek, portable design; a wireless Bluetooth* keyboard; built-in voice-over-IP handset and remote control; integrated array microphones and camera; and Intel High Definition Audio for high-quality sound. Galvanizing galvanizing, process of coating a metal, usually iron or steel, with a protective covering of zinc. Galvanized iron is prepared either by dipping iron, from which rust has been removed by the action of sulfuric acid, into molten zinc so that a thin layer of the zinc the Mobile Industry and Ecosystem Along with silicon innovation and visionary reshaping of the mobile PC, Intel also works with the industry to develop new and better computing specifications and enhance the mobile ecosystem. Intel and other members of the Standards Panel Working Group (SPWG SPWG Security Policy Working Group SPWG Service Provider Working Group (WiMAX Forum) SPWG Static Pressure Water Gauge SPWG Strategic Parts Working Group SPWG Sea Publication Working Group ) today announced the release of the SPWG 3.0 specification, designed to help improve the notebook PC display interchangeability and time to market. Additionally, Toshiba Matsushita Display Technology Co. announced the development of the world's first 2.38-watt, 14.1-inch XGA (EXtended Graphics Array) A screen resolution of 1,024x768 pixels. The term stems from IBM's XGA display standard introduced in 1990, which extended VGA to 132-column text and interlaced 1,024x768x256 resolution. XGA-2 later added non-interlaced 1,024x768x64K. and 2.7-watt, 14.1-inch SXGA (Super XGA) A screen resolution of 1280x1024 pixels. SXGA is commonly used on standard monitors, but provides a 1.25:1 aspect ratio, compared to the more common 1.33:1 (4:3) ratio. SXGA+ has a 1400x1050 resolution, which is an exact 1.33:1 ratio. See PC display modes. + display for mobile PCs, helping to further reduce laptop power consumption and enable longer battery life. In support of Intel Centrino mobile technology, Intel is working with independent software developers to help optimize applications to run well in both connected and unconnected environments. Intel has also developed a new "runs great on Intel Centrino mobile technology" logo to help users identify software designed specifically for mobility. To participate, software must have online and offline capabilities and meet certain power management, performance or connectivity criteria. To further enhance the end user's wireless experience, Intel has also expanded its Wireless Verification Program (WVP WVP Waste Volume Projections WVP Women Ventures Project WVP Willamette Valley Project (Oregon) WVP Waste Vitrification Projects ) to include support for the 802.11g wireless standard. The WVP now includes more than 30,000 verified hotspots worldwide. About IDF (Intermediate Distribution Frame) A wiring rack located between the MDF (main distribution frame) and the intended end user devices (telephones, routers, PCs, etc.). Cables run from the outside world to the MDF and then to the IDFs. See MDF and wiring rack. The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com. Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. * Other names and brands may be claimed as the property of others. Intel, Centrino and Pentium are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. **Source: IDC Worldwide Quarterly PC Tracker, Dec. 2003. Note: Wireless connectivity and some features may require you to purchase additional software, services or external hardware. Availability of public wireless LAN access points limited. System performance measured by MobileMark* 2002. System performance, battery life, wireless performance and functionality will vary depending on your specific hardware and software configurations. See http://www.intel.com/products/centrino/more_info for more information. |
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