Intel Introduces a New Multi-Standard DSL Modem Module That Supports G.SHDSL, HDSL2, ETSI SDSL.
Business Editors, High-Tech Writers
ATLANTA--(BUSINESS WIRE)--June 6, 2000
Designed for DSLAMs, WAN Access and
Full Rate and Fractional T1/E1 Transport
Intel Corporation today announced sampling of a new, highly integrated multi-standard DSL modem module.
Intel's LXT776 module is the only product that incorporates the complete analog front-end with integrated drivers. The LXT776 provides true multi-standard support, while including all required passive components to enable a very high port density design. The module is aimed at providing high speed Internet, voice and data solutions for a variety of different sized business enterprises and the small office/home office See SOHO. (SOHO Soho (sōhō`, sə–), district of Westminster, London, England, known for its continental restaurants. Once a fashionable quarter, it became popular among writers and artists in the 19th cent. ) market.
The module integrates in one package all of the elements required for building symmetric high-speed digital modems, high-density line cards for Digital Subscriber Line Access Multiplexers (DSLAMs) for internet access, or T1/E1 transport systems. The module also can be used to provide wide area network access for local area network switches and routers. The LXT776 module solution is protocol independent and can transport cell or packet-based applications such as Voice over DSL (VoDSL) or Voice over IP (VoIP). Designers can select from any of the leading DSL standards, all of which meet the guaranteed requirements of e-Business.
"Intel is dedicated to providing efficient, highly integrated communications technology that provides telecommunications equipment designers with the most flexible and versatile options available," said Taufique Ahmed, product marketing manager of Intel's DSL Access Operation. "The support we provide in this modem for all of the leading DSL standards ensures the guaranteed delivery that business and corporate customers require."
The module is designed to simplify multi-port system design and support the three leading industry standards for symmetrical digital subscriber line See DSL.
(communications, protocol) Digital Subscriber Line - (DSL, or Digital Subscriber Loop, xDSL - see below) A family of digital telecommunications protocols designed to allow high speed data communication over the existing copper telephone lines between end-users and services -- International Telecommunication Union's (ITU) G.SHDSL A DSL technology from the ITU (G.991.2) that provides symmetric transmission from 192 Kbps to 2.3 Mbps using a single copper pair, depending on distance from the central office (from 20,000 ft. to 6,500 ft.). With two wire pairs, 384 Kbps to 4.6 Mbps can be achieved. G. , American National Standards Institute's (ANSI (American National Standards Institute, New York, www.ansi.org) A membership organization founded in 1918 that coordinates the development of U.S. voluntary national standards in both the private and public sectors. It is the U.S. member body to ISO and IEC. ) HDSL See DSL.
HDSL - High bit-rate Digital Subscriber Line 2, and the European Telecommunications Standard Institute's (ETSI (European Telecommunications Standards Institute, Sophia Antipolis technical park, Nice, France, www.etsi.org) A non-profit membership organization founded in 1988, dedicated to standardizing information and communication technologies (ICT) throughout Europe. ) SDSL See DSL.
SDSL - Single-line Digital Subscriber Line .
HDSL2 was pioneered by the Intel subsidiary Level One Communications in 1997, along with other industry leaders. Last year, the ETSI's SDSL standard emerged. In the spring of 1998, industry leaders working through the ITU created G.SHDSL, which uses the same data encoding and signal modulation techniques as HDSL2 to achieve high data rates above 784 kilobits/second without interfering with ADSL. By supporting various line rates from 192 kilobits/second up to 2320 kilobits/second and payload configurations, G.SHDSL allows various service applications to be tailored for large, medium or small businesses, home users, or telecommuters. With a latency of less than 1.2 milliseconds, it is an excellent technology for digital transport of voice and real-time video conferencing. Both G.SHDSL and ETSI standards will be completed in 2000.
About the Intel LXT776 Modem Module
The LXT776 integrates two flexible, high-performance components in a single module. The LXT776 has a programmable digital signal processor A digital signal processor (DSP) is a specialized microprocessor designed specifically for digital signal processing, generally in real-time computing. Characteristics of typical Digital Signal Processors
E.g. Ethernet can carry 10 Mbps. .
The LXT776 also incorporates a Time Division Multiplex (TDM (Time Division Multiplexing) A technology that transmits multiple signals simultaneously over a single transmission path. Each lower-speed signal is time sliced into one high-speed transmission. ) bus interface that operates at up to 8,192 kilobits/second, allowing the transceiver to perform with commonly used T1 and E1 framers. An integrated line driver can deliver more than 17 dBm of power to a 135-ohm line, and an internal hybrid network provides more than 6 dB of echo cancellation. This enables an implementation that can be software configured to operate in G.SHDSL, HDSL2 or ETSI SDSL without any hardware changes required. The analog front-end also incorporates all required passive components, enabling users to build boards with multiple ports in a very small area.
Also included is an 8-bit microprocessor interface to enable quick setup, acquisition and status monitoring. A programmable activation controller reduces total load on the system processor, providing optimum efficiency in either central office or remote applications. The LXT776's synchronous data interface allows its use with common T1 or E1 framers. The LXT776 has a Time Slot Assignment (TSA TSA
See tax-sheltered annuity (TSA). ) function that can be programmed to select and map individual channels of the Time Divisional Multiplexing (TDM) bus to/from the DSL payload. The LXT776 module comes with a complete datasheet, API, documentation, evaluation board, and design layout guidelines for ease of use by hardware and software design engineers.
Pricing and Availability
Samples of the LXT776 will be available in the third quarter of 2000 in 17 mm(squared) 256-pin and 23mm(squared) 208-pin ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation).
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA) packages. Pricing will start at $40.61 each with sampling set to begin in the third quarter of 2000. Further details about the product are available at www.intel.com/IXA.
Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.
(a) Third party marks or brands are property of their respective holders.