Intel Introduces a New Multi-Standard DSL Modem Module That Supports G.SHDSL, HDSL2, ETSI SDSL.

Business Editors, High-Tech Writers

ATLANTA--(BUSINESS WIRE)--June 6, 2000

Designed for DSLAMs, WAN Access and

Full Rate and Fractional T1/E1 Transport

Intel Corporation today announced sampling of a new, highly integrated multi-standard DSL modem module.

Intel's LXT776 module is the only product that incorporates the complete analog front-end with integrated drivers. The LXT776 provides true multi-standard support, while including all required passive components to enable a very high port density design. The module is aimed at providing high speed Internet, voice and data solutions for a variety of different sized business enterprises and the small office/home office (SOHO) market.

The module integrates in one package all of the elements required for building symmetric high-speed digital modems, high-density line cards for Digital Subscriber Line Access Multiplexers (DSLAMs) for internet access, or T1/E1 transport systems. The module also can be used to provide wide area network access for local area network switches and routers. The LXT776 module solution is protocol independent and can transport cell or packet-based applications such as Voice over DSL (VoDSL) or Voice over IP (VoIP). Designers can select from any of the leading DSL standards, all of which meet the guaranteed requirements of e-Business.

"Intel is dedicated to providing efficient, highly integrated communications technology that provides telecommunications equipment designers with the most flexible and versatile options available," said Taufique Ahmed, product marketing manager of Intel's DSL Access Operation. "The support we provide in this modem for all of the leading DSL standards ensures the guaranteed delivery that business and corporate customers require."

The module is designed to simplify multi-port system design and support the three leading industry standards for symmetrical digital subscriber line services -- International Telecommunication Union's (ITU) G.SHDSL, American National Standards Institute's (ANSI) HDSL2, and the European Telecommunications Standard Institute's (ETSI) SDSL.

HDSL2 was pioneered by the Intel subsidiary Level One Communications in 1997, along with other industry leaders. Last year, the ETSI's SDSL standard emerged. In the spring of 1998, industry leaders working through the ITU created G.SHDSL, which uses the same data encoding and signal modulation techniques as HDSL2 to achieve high data rates above 784 kilobits/second without interfering with ADSL. By supporting various line rates from 192 kilobits/second up to 2320 kilobits/second and payload configurations, G.SHDSL allows various service applications to be tailored for large, medium or small businesses, home users, or telecommuters. With a latency of less than 1.2 milliseconds, it is an excellent technology for digital transport of voice and real-time video conferencing. Both G.SHDSL and ETSI standards will be completed in 2000.

About the Intel LXT776 Modem Module

The LXT776 integrates two flexible, high-performance components in a single module. The LXT776 has a programmable digital signal processor (DSP) core flexible enough to meet changes in the ITU G.SHDSL and ETSI SDSL standards. It combines a flexible frame mapper with a Trellis Coded Pulse Amplitude Modulation (TC-PAM) transceiver and an analog front end, which is equipped with an integrated line driver that supports line rates up to 2.3 megabits per second.

The LXT776 also incorporates a Time Division Multiplex (TDM) bus interface that operates at up to 8,192 kilobits/second, allowing the transceiver to perform with commonly used T1 and E1 framers. An integrated line driver can deliver more than 17 dBm of power to a 135-ohm line, and an internal hybrid network provides more than 6 dB of echo cancellation. This enables an implementation that can be software configured to operate in G.SHDSL, HDSL2 or ETSI SDSL without any hardware changes required. The analog front-end also incorporates all required passive components, enabling users to build boards with multiple ports in a very small area.

Also included is an 8-bit microprocessor interface to enable quick setup, acquisition and status monitoring. A programmable activation controller reduces total load on the system processor, providing optimum efficiency in either central office or remote applications. The LXT776's synchronous data interface allows its use with common T1 or E1 framers. The LXT776 has a Time Slot Assignment (TSA) function that can be programmed to select and map individual channels of the Time Divisional Multiplexing (TDM) bus to/from the DSL payload. The LXT776 module comes with a complete datasheet, API, documentation, evaluation board, and design layout guidelines for ease of use by hardware and software design engineers.

Pricing and Availability

Samples of the LXT776 will be available in the third quarter of 2000 in 17 mm(squared) 256-pin and 23mm(squared) 208-pin ball grid array (BGA) packages. Pricing will start at $40.61 each with sampling set to begin in the third quarter of 2000. Further details about the product are available at www.intel.com/IXA.

Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.

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