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Intel Highlights Technologies for Internet Clients; First Public Demonstration of the Mobile Intel Pentium 4 Processor.

Business Editors/High-Tech Writers

INTEL DEVELOPER FORUM

SAN JOSE, Calif.--(BUSINESS WIRE)--Aug. 29, 2001

Intel Corporation today described new client-based technologies and initiatives that are designed to meet the increasingly varied needs of computer users. Addressing hardware and software developers gathered here today, Intel executives said the role of the client is evolving to meet the needs of an extended Internet and digital world, and showed how the company is facilitating collaboration among all types of devices to align desktop, mobile and wireless Internet platforms. Intel showcased new technologies in platform architectures and advances in mobile processors, and announced a new program to enable delivery of wireless devices and applications.

Architecting for Mobility

Frank Spindler, vice president, Intel Architecture Group and general manager of the Mobile Platforms Group, highlighted the company's industry-leading efforts in manufacturing and designing advanced mobile processors to deliver the highest performance and low power for the mobile market segment. Spindler conducted the first technology demonstration of the mobile Intel(R) Pentium(R) 4 processor. While incorporating all the advanced technologies of its desktop counterpart, this processor will also include mobile-specific features such as Enhanced SpeedStep(TM) technology, and Deeper Sleep for low power state and small mobile packaging for thinner, lighter mobile PCs. Additionally, Spindler discussed the potential for new features, such as wireless Internet communications, and new innovative form factors that will enable design flexibility, such as the Tablet PC, that will help drive mobile PC growth.

"We expect to see a variety of mainstream full-size and thin-and-light performance notebooks based on the mobile Pentium 4 processor in the first half of 2002," said Spindler. "These systems will combine the benefits of the world's fastest mobile PC processor and the most advanced power management technologies, to deliver great performance and long battery life for productivity applications, rich multimedia, and new usage models."

Desktop Platform Architecture for Today And Beyond

As digital technology becomes increasingly pervasive, higher speed connections between devices that are based on open standards will accelerate technology, improve computing platforms, and increase performance for all Internet clients. Louis Burns, Intel vice president and general manager, Desktop Platforms Group, outlined the evolving role of I/O architecture to meet the needs of a balanced PC platform. In his discussion, Burns released details on the preliminary third-generation I/O specification, demonstrated new Hi-Speed USB 2.0 products that improve client download speeds, and announced the release of the Serial ATA final 1.0 specification.

Third-generation I/O is a serial architecture that will connect computing subsystems and I/O peripheral components at high-bandwidth speeds. It will be a general-purpose interconnect with a low pin count interface enabling cost-effective bandwidth across all market segments, such as desktop, mobile, server, communications and embedded applications. Additionally, it will be compatible with the existing PCI software model and enable smaller form factors.

"Intel is delivering innovative I/O architecture solutions with well-managed evolutionary paths," said Burns. "We are meeting the needs of the industry with solutions that will be scalable for the next decade and offering cost-effective bandwidth for high performance platforms."

An industry work group that includes Compaq, Dell, IBM, Intel and Microsoft, along with an additional 22 newly announced developers, will work together to develop a draft 1.0 third-generation I/O specification to deliver to the PCI -SIG in the first quarter of 2002.

Burns noted that later this year, Gateway will ship an Intel Pentium 4 processor-based PC featuring Hi-Speed USB 2.0 with an Intel motherboard. Hi-Speed USB 2.0 is the evolutionary connection to PC peripherals that is 40 times faster than its predecessor. This will enhance end-user experiences with imaging, music and video applications.

During his keynote, Burns demonstrated the first Hi-Speed USB 2.0 digital video camera connected to an Intel Pentium 4 processor platform based on an Intel prototype chipset with an integrated USB 2.0 controller. Burns said the chipset would enable broad deployment of Hi-Speed USB 2.0 next year. The Hi-Speed USB 2.0 interface provides the bandwidth necessary to deliver the real-time video from Opteon's USB 2.0 camera, and will allow a single person to create TV-broadcast quality videos in real time.

Burns also highlighted the release of the final Serial ATA 1.0 specification. The technology replaces the parallel ATA physical storage interface, and was developed by the Serial ATA Working Group. The Serial ATA interface will be used to connect such internal storage devices as hard disks, DVDs and CD-R/Ws to the motherboard in desktop and mobile PCs, value servers, and network storage. Scalable performance (starting at 1.5 gigabits per second) and full software compatibility with current operating systems allows the technology to provide a storage interface that meets the needs of computers for the next decade.

Accelerating the Wireless World

Intel is also working to enable the next generation of wireless communications devices that will accelerate the delivery of wireless applications and services that take advantage of voice-and-data communications over the Internet. Ron Smith, Intel senior vice president, and general manager of the Wireless Communications and Computing Group, introduced a new program designed to help developers build and market wireless applications, services and devices based on the Intel(R) Personal Internet Client Architecture (Intel PCA). The newly formed Intel PCA Developer Network offers wireless companies development, technical and marketing support -- including access to more than 300 software design tools -- for building cell phones, personal digital assistants (PDAs) and other mobile Internet devices and applications supporting Intel PCA.

Smith also highlighted the importance of Intel's flash memory solutions in these wireless devices. Intel StrataFlash(R) memory technology has earned more than 650 design wins this year alone in cell phones, PDAs, set-top boxes and other applications. Intel StrataFlash memory offers a cost-effective, single-chip solution for code execution and data storage, using an innovative multilevel cell technology that makes it ideal for Internet phones where high density and low cost per bit are important.

"Cell phones that combine voice and data applications require significantly larger amounts of flash memory and Intel StrataFlash provides twice the density in the same space at a lower cost," said Smith. "We've shipped more than two billion megabits of Intel StrataFlash memory to date, and we expect that number to double in the next year."

Intel also introduced the Intel(R) Flash Data Integrator (FDI) version 4, the latest version of Intel's flash memory software that manages code, data and files when combined with Intel flash memory solutions. This particular version of the FDI software serves as a file manager for devices using Intel StrataFlash memory, increasing performance for data storage operations of both code and packet data.

About IDF

Intel Developer Forum is a worldwide program that gives developers the technical information and vision they need to succeed in creating innovative products for the Internet economy. The IDF Fall 2001 conference features a full slate of sessions and hands-on labs, along with numerous demonstrations of cutting-edge products and technologies. Industry participants include software and hardware developers of communications equipment, servers, PC and handheld clients. Visit http://developer.intel.com/idf for more on the IDF conferences (San Jose, Calif., Aug. 27-30; Tokyo, Sept. 26-27; Taipei, Taiwan, Oct. 22-23; Shenzhen, People's Republic of China, Oct. 25-26). For the latest information on technology developments throughout the year, visit Intel Developer Update at http://developer.intel.com/update.

Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.

Note to Editors: Other names and brands may be claimed as the property of others. Intel, Pentium, SpeedStep and Intel StrataFlash are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
COPYRIGHT 2001 Business Wire
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Copyright 2001, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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