Intel Eliminates Use of Lead from Future Microprocessors.Innovative Intel 45 Nanometer High-k Metal Gate Processors Go Lead-Free; Part of Intel's Broad Commitment to Environmental Sustainability SANTA CLARA Santa Clara, city, Cuba Santa Clara (sän`tä klä`rä), city (1994 est. pop. 217,000), capital of Villa Clara prov., central Cuba. , Calif. -- Intel Corporation (company) Intel Corporation - A US microelectronics manufacturer. They produced the Intel 4004, Intel 8080, Intel 8086, Intel 80186, Intel 80286, Intel 80386, Intel 486 and Pentium microprocessor families as well as many other integrated circuits and personal computer networking today announced that its future processors, beginning with its entire family of 45 nanometer (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free. The Intel 45nm Hi-k family includes the next-generation Intel[R] Core[TM] 2 Duo, Core 2 Quad See Core 2. and Xeon[R] processors, and the company will begin 45nm Hi-k production in the second half of this year. "Intel is taking an aggressive stance toward environmental sustainability, from the elimination of lead and a focus on greater energy efficiency of our products to fewer air emissions and more water and materials recycling," said Nasser Grayeli, Intel vice president and director of assembly test technology development, Technology and Manufacturing Group. Lead is used in a variety of micro-electronic "packages" and the "bumps" that attach an Intel chip to the packages. Packages wrap around the chip and ultimately connect it to the motherboard. Different types of packages are used for processors targeted at specific market segments, including mobile, desktop and server. Package designs include pin grid array See PGA. (hardware) Pin Grid Array - (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. , ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. and land grid array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. , and all are 100 percent lead-free in Intel's 45nm Hi-k technology generation. In 2008, the company will also transition its 65nm chipset products to 100 percent lead-free technology. Intel's 45nm processors not only are lead-free, they also make use of the company's Hi-k silicon technology for reduced transistor leakage, enabling more energy-efficient, high-performance processors. The company's 45nm Hi-k silicon technology also includes third-generation strained silicon A technique that deposits silicon (Si) on top of silicon germanium (SiGe) for making transistors on a chip. In so doing, the silicon atoms are stretched ("strained") to line up with the silicon germanium atoms, which are wider apart. for improved drive current and a lower interconnect capacitance using low-k dielectrics for increased performance and lower power. Ultimately, Intel's 45nm Hi-k family of processors will enable sleeker, smaller and more energy-efficient desktop, notebook PC, mobile internet device See MID and mobile Internet. and server designs. The Road to Lead-Free For many decades lead has been used in electronics because of its electrical and mechanical properties, making the search for replacement materials that meet performance and reliability requirements a significant scientific and technical challenge. Due to lead's potential impact to the environment and public health, Intel has worked for years with its suppliers and other companies in the semiconductor and electronics industry to develop lead-free solutions as part of its long-standing commitment to environmental practices. In 2002, Intel produced its first lead-free flash memory products. In 2004, the company began shipping products with 95 percent less lead than previous microprocessor and chipset packages. To replace the remaining 5 percent (about .02 grams) of lead solder historically found in the first-level interconnect -- the solder joint that connects the silicon die to the package substrate -- in processor packages, Intel will use a tin/silver/copper alloy. It is the way in which Intel will implement these new materials to replace the tin/lead solder that is the "secret sauce" of the company's solution. Because of the complex interconnect structure of Intel's advanced silicon technologies, a great deal of engineering work was required to remove the remaining lead in Intel's processor packages and integrate a new solder alloy system. Intel engineers developed the assembly manufacturing processes involving the new solder alloys, and were able to accomplish this while still demonstrating the high level of performance, quality and reliability expected of Intel components. Environmental Sustainability -- From Transistors to Factories Intel has a long history of commitment to the environment, a philosophy that began with its founder Gordon Moore Gordon Earle Moore (b. January 3, 1929 in San Francisco, California) is the co-founder and Chairman Emeritus of Intel Corporation and the author of Moore's Law (published in an article 19 April 1965 in Electronics Magazine). . In addition to eliminating the use of lead in its products, Intel has developed a number of environmental best-practices in its factories and operations. It is also designing and building energy efficiency into everything it does, from the smallest 45nm transistors in its forthcoming lead-free processors and today's high-performance Intel Core The latest generation of the Intel x86 family of CPUs. Core supersedes the 13-year run of the Pentium, which was introduced in 1993. It essentially represents the ninth generation of the x86 architecture, the first chip appearing in the IBM PC in 1981. 2 Duo processors that consume up to 40 percent less energy to broad support for industry standards and strong public policies. Among many examples: * Earlier this year Intel transitioned its Intel[R] StrataFlash[R] Cellular Memory packages to halogen-free technology. The company is currently evaluating the use of halogen-free flame retardants in its CPU CPU in full central processing unit Principal component of a digital computer, composed of a control unit, an instruction-decoding unit, and an arithmetic-logic unit. package technologies. * In 1996, Intel led an industry-wide agreement to reduce global warming global warming, the gradual increase of the temperature of the earth's lower atmosphere as a result of the increase in greenhouse gases since the Industrial Revolution. gas emissions in semiconductor manufacturing, and today is working with the European Union European Union (EU), name given since the ratification (Nov., 1993) of the Treaty of European Union, or Maastricht Treaty, to the European Community (EU) to discuss how the technology sector can help meet the EU's target of cutting greenhouse gas greenhouse gas n. Any of the atmospheric gases that contribute to the greenhouse effect. greenhouse gas emissions by 20 percent by 2020. * Intel is focused on reducing the natural resource use and waste by products of its manufacturing process. In the past 3 years, the Years, The the seven decades of Eleanor Pargiter’s life. [Br. Lit.: Benét, 1109] See : Time company has saved more than 9 billion gallons of fresh water through conservation measures, and reduced its global warming gas emissions by the equivalent of removing 50,000 automobiles from the road. * It has reduced hazardous materials in its products and recycles more than 70 percent of its chemical and solid wastes. * Intel makes renewable energy a priority. The company is the single-largest purchaser of wind power in Oregon and the largest industrial consumer of renewable energy in New Mexico. * Through Intel's ongoing conversion from 200mm to 300mm wafers, it has been able to reduce water consumption by approximately 40 percent for each square centimeter of silicon produced. * Intel has been recognized by the U.S. Environmental Protection Agency Environmental Protection Agency (EPA), independent agency of the U.S. government, with headquarters in Washington, D.C. It was established in 1970 to reduce and control air and water pollution, noise pollution, and radiation and to ensure the safe handling and for its work on Energy Star1 and employee commuter programs. For additional information about Intel's commitment to the environment, visit www.intel.com/go/responsibility. Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and live. Additional information about Intel is available at www.intel.com/pressroom/. Intel, Intel Core, Xeon and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. 1Other names and brands may be claimed as the property of others. |
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