Intel Discusses Innovations Driving Future Enterprise and Communications Infrastructure Growth.Business Editors/High-Tech Writers Intel Developer Forum Intel Developer Forum (IDF), is a twice yearly gathering of technologists to discuss Intel products and products based around Intel products. The first IDF was in 1997. There is usually a Spring IDF and a Fall IDF. 2003 SAN JOSE San Jose, city, United States San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850. , Calif.--(BUSINESS WIRE)--Feb. 20, 2003 Rapid industry innovation is speeding the rate at which new enterprise and communications infrastructure technologies become mainstream server and communications products, setting the stage for future industry growth, according to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. Intel Corporation (company) Intel Corporation - A US microelectronics manufacturer. They produced the Intel 4004, Intel 8080, Intel 8086, Intel 80186, Intel 80286, Intel 80386, Intel 486 and Pentium microprocessor families as well as many other integrated circuits and personal computer networking executives. Speaking to an audience of technology industry engineers, developers and designers, Intel Senior Vice President Mike Fister and Executive Vice President Sean Maloney explained how innovations such as WiFi, PCI Express A high-speed peripheral interconnect from Intel introduced in 2002. Note that although sometimes abbreviated "PCX," PCI Express is not the same as "PCI-X" (see PCI-SIG and PCI-X for comparison). As a result of the confusion, "PCI-E" or "PCIe" is the accepted abbreviation. (TM), Intel(R) Itanium(R) architecture, Hyper-Threading Technology and Advanced Telecommunications Computing Architecture Advanced Telecommunications Computing Architecture[1] is the largest specification effort in the history of the PCI Industrial Computer Manufacturers Group (PICMG), with more than 100 companies participating. (AdvancedTCA) are helping to quickly drive new products to market. The adoption of these technologies then sets the stage for future industry growth. "More than anything, aligning the industry around key technologies leads to innovation on a grand scale," said Fister. "Intel's building block approach is driving innovation at a pace that other models can't match, and that translates to new technologies, introduced more quickly, at lower prices. Corporations can then adopt the new technologies and use them for competitive advantage," said Fister. Intel Innovation For Enterprise Data Centers Fister showcased one of Intel's key innovations in enterprising computing with the company's first public demonstration of PCI Express technology. The early silicon, operating at 2.5 gigabits per second (Gbps), illustrates the type of technology that will help lead the industry toward new, cost-efficient enterprise products. Intel is planning top-to-bottom support for PCI Express in its enterprise chipsets beginning in 2004, and new Intel storage and communications products incorporating PCI Express are expected at the same time. New enterprise chipsets planned for 2004 with support for PCI Express technology and DDR (Double Data Rate) Refers to an SDRAM memory chip that increases performance by doubling the effective data rate of the frontside bus. For more details, see SDRAM. DDR - Double Data Rate Random Access Memory 2 memory include a four-way Intel(R) Xeon(TM) processor MP chipset and a Xeon processor chipset for two-way servers. These products help round-out Intel's enterprise chipset portfolio. PCI Express solves challenging enterprise I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output. I/O - Input/Output bandwidth issues and lowers system design costs, as it requires fewer overall chips to implement. It also provides a unified way for enterprise interconnect technologies such as InfiniBand and Ethernet to work together. Combined, these features help lower system costs and increase reliability. Intel's continued innovation in manufacturing will come to the enterprise front later this year as the company moves to Xeon processors for dual-processor servers and workstations built on Intel's 90 nanometer (nm) process technology. Intel has accelerated its Xeon processor roadmap, and new products for dual-processor server and workstations with 1MB of cache are due in the third quarter of 2003. In 2004, Intel will offer two new additions for multi-processor servers including a Xeon processor MP with 4MB of cache and a new processor built on Intel's 90-nm process technology. Itanium 2 processor plans include the introduction of a low-voltage version of the product (Deerfield) in the second half of this year. It features similar performance to today's Itanium 2 processors for dual-processor high performance computing and targeted front-end applications, but at half the power. Future products include Itanium 2 processors with 9MB of L3 cache (Level 3 cache) A memory bank built onto the motherboard or within the CPU module. The L3 cache feeds the L2 cache, and its memory is typically slower than the L2 memory, but faster than main memory. in 2004, followed by dual-core processors in 2005 (Montecito). Reducing Costs for Communications Products Maloney discussed Intel's role in providing communications building blocks used throughout the Internet infrastructure. This includes communications products for homes and offices, equipment for access and edge operations of the Internet and equipment for the Internet's optical backbone. "Intel is a leading supplier of communications building blocks, ranging from WiFi products to network processors, used throughout the Internet infrastructure," said Maloney. "By working with Intel and embracing modular communications platforms, the industry will be able to deliver communications products for homes and businesses in increasingly rapid fashion at lower costs." For homes and offices, Intel today announced three new network processors, the Intel(R) IXP (1) (Internet EXchange Processor) See IXA. (2) (Internet eXchange Point) A public junction point on the Internet that provides an on-ramp to the Internet as well as a location for carriers to exchange traffic. 420, IXP421 and IXP422. These network processors are optimized for applications such as WiFi, wireless fidelity See Wi-Fi. technology that allows wireless Internet access See how to access the Internet. . Linksys, a leader in networking for homes and small/medium businesses, today announced that it is using the IXP422 in its new generation of Linksys(a) Wireless Access Points. Additionally, broadband, security and voice-over-IP applications share a common architecture and development environment with the previously announced IXP425 network processor. To further simplify design, reduce costs, provide increased performance and improve time to market for equipment makers, Intel is focused on creating modular communications platforms. Intel's network processors and IA-based processors are designed to work within these modular communications platforms based on the AdvancedTCA specification. AdvancedTCA defines the size and shape of boards and other elements used in communications equipment and helps reduce design cycles. For the optical backbone of the Internet, Maloney disclosed new details regarding Intel's tunable laser technology. This technology promises to deliver significantly lower costs and increased flexibility in deploying dense wavelength division multiplexing See WDM. (DWDM (Dense WDM) The term given to wavelength division multiplexing (WDM) when significantly more channels were being added. Since WDM is increasingly more "dense" all the time, both terms are used synonymously. See WDM. DWDM - wavelength division multiplexing ) solutions. DWDM can allow service providers to significantly increase network bandwidth as needed as needed prn. See prn order. . About IDF (Intermediate Distribution Frame) A wiring rack located between the MDF (main distribution frame) and the intended end user devices (telephones, routers, PCs, etc.). Cables run from the outside world to the MDF and then to the IDFs. See MDF and wiring rack. The Intel Developer Forum is the technology industry's premier event for hardware and software developers. Held worldwide throughout the year, IDF brings together key industry players to discuss cutting-edge technology and products for PCs, servers, communications equipment, and handheld clients. For more information on IDF and Intel technology, visit http://developer.intel.com. Intel, the world's largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom. (a) Other names and brands may be claimed as the property of others. Intel, the Intel logo, Xeon and Itanium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. All products, dates and figures are preliminary and are subject to change without notice. |
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