Innovative 3D Packaging Technologies - How It Will Impact the Semiconductor Food Chain?

LYON, France -- Allbizreport.com announces that a new market research report related to the world wide advanced packaging market is now available to its catalogue. This market research report will be available from the 10th of February.

Advanced packaging: 3D ICs - Market research

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This report highlights the market drivers for 3D packaging technologies, the status of developments, how it will impact the semiconductor food chain. It covers as well equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.

3D integration will affect the IC, MEMS and image sensors markets!

Semiconductor chips face constant pressure for increased performances while still decreasing their size and at the same time their packages must be able to accommodate new functionalities. The ever-expanding consumer electronics market is a particularly strong driver of packaging innovations such as 3D ICs. Today wire bonding is limited in density and performances so 3D stacking with micro-vias (or TSV, "through-Si vias") seems to be unavoidable in the future for miniaturization first and increased performances after.

3D integration will use technologies originally developed for MEMS technology but for different markets. In this report, we have analyzed that portable applications are a strong market driver for 3D integration. Stacking memories, stacking memories and logic, image sensors with oP and FPGAs will be the first mass market applications. In 2010, the publisher forecasts that 1 billion of Flash memories will be stacked with TSVs.

3D-ICs: the technical challenges are close to be overcome

3D is the most "integrated" approach and is an enabling technology platform applicable to digital and mixed signal electronics, wireless, electro-optical, MEMS, sensors, smart imagers, displays and other devices. There are however strong challenges. They are: thermal management, reliable co-design and simulation tools, industrial wafer-to-wafer bonding tools, low-cost through-wafer via structures and via fill processes.

List of interviewed companies:

3D-Plus, All-via, Amkor, ASE, ASM International, Dow Corning, E2V, EM Microelectronics, Fraunhofer IZM , Freescale, Fujikura, Fujitsu, Hymite, Hynix Semiconductor, IMEC, Infineon, Intel, Leti, Matsushita Electric Works, MEMSiC, Micron, MicroResist, NEC, Nokia, Philips Image Sensors, Philips Semiconductors, Rensselaer Polytechnic Institute, Samsung, Semitool, SensoNor, Silex, SPIL, STATSChipPac, STMicroelectronics, SE[pounds sterling]SS microtec, Synova, Tessera, Texas Instruments, Tezzaron, TSMC, VTI Technologies, VTT Technology, Xintec, XSil, Ziptronix, Zycube.

Why buy this report?

We are at the crossroads of numerous breakthroughs in 3D stacking! Although 3D ICs are at the R&D stage in the largest semiconductor companies today, the recent announcement of Samsung in 2006 could speed up micro-via technology especially for the memory business. By acquiring the new 3D IC report, you will have access to:

1. An overview of the different 3D packaging approaches (SoC, SiP O)

2. What are the market drivers and market forecasts for 3D ICs

3. The status of development for the different identified players (ICs, image sensors)

4. The evolution of the business models (OSAT, IDMs, wafer fabs O)

5. How the adoption of 3D stacking could significantly change the standard semiconductor process (FEOL vs. BEOL)

6. The equipment and materials market forecasts for 3D integration (for DRIE, laser, bonders and materials)

7. An analyze of the different technical solutions

* Doing the TSVs (Through Silicon Vias) -- electrically isolated interconnections through the silicon, which requires laser or deep reactive ion etching (DRIE) to create through vias.

* Filling the TSVs with different materials (copper, tungsten, polySi, conductive polymers O)

* Thin wafers handling, usually below 50 om.

* Alignment and bonding of wafer-to-wafer or chip-to-wafer or chip-to-chip.

* Bonding technologies by silicon fusion, polymer bonding, direct copper-to-copper, copper-tin eutectic bonding.

Who should buy this report?

This report targets both devices manufacturers and packaging companies as 3D will be such a breakthrough for packaging than developments are running whatever the activity of the semiconductor companies.

This report is of great interest for equipments manufacturers as well, as new investments are planned in a close future for implementing all the 3D technological steps.

So, whatever is your responsibility, R&D, production, marketing or business development, the 3D IC report will give you a deep insight for markets and technological challenges for 3D integration.

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