Infineon to Show Recently Announced Products At OFC Conference.

Business Editors/High-Tech Writers

OFC 2003

MUNICH, Germany--(BUSINESS WIRE)--March 17, 2003

Infineon Technologies AG (FSE:IFX)(NYSE:IFX) will feature a number of recently announced products among the live demonstrations in its booth (#3229) at the Optical Fiber Communications (OFC) Conference, in Atlanta Ga., March 25 - March 27. The demonstrations will include:

-- Interoperability of 850 nm XFP- and XPAK-compliant TRX (transceiver) modules and an Infineon TenGiPHY(TM) 10-Gigabit Ethernet (10GE) XAUI-to-serial transceiver.

-- A 1310 nm XPAK-compliant TRX module.

-- A BIDI(R) (Bi-Directional) TRX module with a 1.25 Gbps data rate.

-- A combined live and static demonstration of a complete 40 Gbps line card solution.

In addition to the live demonstrations, the Infineon booth will also be showing:

-- A family of new iSFP TRX modules with data rates of up to 2.5

Gbps.

-- A PAROLI(R) 2 (second-generation Parallel Optical Link) device

with a data rate of up to 3.125 Gbps.

-- Sun Microsystems and Alcatel switches that use Infineon PAROLI

devices.

-- Devices from OpTun, Inc., an Infineon partner in developing

cutting-edge optical communications technology and products.

The original announcement can be found at http://www.infineon.com/news/press/303_051e.htm