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Infineon Technical Presentations at IEDM 2002: Papers Reinforce Leadership in DRAM Technology, Highlight Cutting Edge Research In Biochips, Flexible Circuits and RF Design.


Business Editors/High-Tech Writers

MUNICH, Germany & SAN FRANCISCO--(BUSINESS WIRE)--Dec. 9, 2002

This edition of the Infineon Technologies News Alert service provides a synopsis of presentations by company researchers at IEDM IEDM International Electron Devices Meeting
IEDM Institute Économique de Montréal
 2002, a premier technical conference of the electronic device industry.

Infineon Technologies is well represented at the 2002 International Electron Devices Meeting The International Electron Devices Meeting is an annual conference held alternatively in San Francisco, California and Washington D.C. Established in 1954, IEDM is the world's main forum on advancement in semiconductor and electronic devices.  (IEDM), in San Francisco from December 9 - 11, with company researchers presenting nine reports on technology development and new research. The scope of presentations includes three papers on research directed at extending the design and fabrication fabrication (fab´rikā´shn),
n the construction or making of a restoration.
 of DRAM chips to chip feature size of less than 70 nanometers (about one-half of the size of today's smallest production chips). Scientists from Infineon also are presenting several additional papers: from advances in Silicon Germanium circuit fabrication and microelectronic machine (MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. ) for radio frequency applications, to printing of circuits on plastic films and completely electronic detection of DNA DNA: see nucleic acid.
DNA
 or deoxyribonucleic acid

One of two types of nucleic acid (the other is RNA); a complex organic compound found in all living cells and many viruses. It is the chemical substance of genes.
 samples using "biochip biochip

Small-scale device, analogous to an integrated circuit, constructed of or used to analyze organic molecules associated with living organisms. One type of theoretical biochip is a small device constructed of large organic molecules, such as proteins, and capable of
" circuits.

The titles, and short summaries, of each paper are listed here:

DRAM Technology Developments

The research and development programs supporting Infineon's trench capacitor DRAM products are aimed at strengthening the company's technology and production cost leadership positions for computer memory products.

Fully Depleted de·plete  
tr.v. de·plet·ed, de·plet·ing, de·pletes
To decrease the fullness of; use up or empty out.



[Latin d
 Surrounding Gate Transistor (SGT) for 70nm DRAM and Beyond (Session 10.8): Describes successful development of a novel trench capacitor memory cell for a target feature-size of less than 70 nm. The concept is to use a fully-depleted (yields excellent drive capability) vertical (yields excellent packing density) array device. This potentially enables memory chips with more than 200 percent greater capacity than today, without changing the size of the chip.

A Fully Integrated Al2O3 Trench Capacitor DRAM for Sub-100nm Technology (Session 33.6): Presents results of work to use Al2O3 as "high-k" capacitor dielectric material in the trench DRAM process as replacement for today's standard nitride-oxide . This will enable further reduction in feature size to well below 100nm without sacrificing operating characteristics and performance of the finished chips. A Feature Scale Model for Trench Capacitor Etch Rate and Profile (Session 35.5) describes two computer modeling applications that enable efficient design of high-density trench technology DRAM memory arrays.

Leading Research on the Cutting Edge

Infineon's R&D programs follow the parallel paths of support for the chip technologies of today, and the emerging markets and chip technology applications that will shape people's lives in the future.

Fully Electronic DNA Detection on a CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes.  Chip: Device and Process Issues (Session 19.2): This invited paper, presented by Infineon and industry partners, describes the integration of DNA sensor on a low-cost CMOS chip. The technology is making it possible to create new types of biochemical and medical diagnostic test technologies for scientific research and, ultimately, personal health care.

Polymer Gate Dielectric Pentacene TFTs and Circuits on Flexible Substrates (Session 22.1): Describes new advances in production of integrated circuits on flexible, low-cost polymeric materials instead of rigid silicon chips, which will open up new markets for electronic technologies, such as electronic bar codes. Infineon researchers and industry partners have developed what may be the fastest circuits ever fabricated on flexible organic (and thus low-cost) polymer materials.

Sub 5 ps SiGe Bipolar Technology (Session 31.1): Silicon Germanium is one of today's leading edge materials for the production of high-speed radio frequency chips used for mobile communications. Infineon researchers will describe new circuit designs that push the technology's performance to new levels of efficiency.

Advancement of MEMS into RF-Filter Applications (Session 36.1 ): Researches from Infineon and Nokia Mobile Phones were invited by the conference organizers to present a report on Micro-Electro-Mechanical Systems (MEMS) which are determined to revolutionize the RF section of next generation mobile phones. Bulk-Acoustic-Wave (BAW BAW Black America Web
BAW Brain Awareness Week
BAW Bulk Acoustic Wave
BAW Bells And Whistles
BAW Bicycle Alliance of Washington (Washington state, USA)
BAW Bis Auf Weiteres (German: see you later) 
) filters recently launched by Infineon beat conventional RF-filters in performance, size and costs. Extremely low losses enable to built receive-, transmit- and duplexer-filters at Gigahertz frequencies which are needed in all mobile phones. As BAW filters are manufactured on Silicon substrates using standard CMOS equipment they enable extreme miniaturization min·i·a·tur·ize  
tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es
To plan or make on a greatly reduced scale.



min
 and an advanced level of system integration.

About Infineon

Infineon Technologies AG, Munich, Germany, offers semiconductor and system solutions for the automotive and industrial sectors, for applications in the wired communications markets, secure mobile solutions as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In fiscal year 2002 (ending September), the company achieved sales of Euro 5.21 billion with about 30,400 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange Frankfurt Stock Exchange

The largest of Germany's eight securities exchanges, operated by Deutsche Borse AS.
 and on the New York Stock Exchange New York Stock Exchange (NYSE)

World's largest marketplace for securities. The exchange began as an informal meeting of 24 men in 1792 on what is now Wall Street in New York City.
 (ticker symbol Ticker Symbol

An arrangement of characters (usually letters) representing a particular security listed on an exchange or otherwise traded publicly. When a company issues securities to the public marketplace, it selects an available ticker symbol for its securities which investors
: IFX IFX - ["Type Reconstruction with First-Class Polymorphic Values", J. O'Toole et al, SIGPLAN Notices 24(7):207-217 (Jul 1989)]. ). Further information is available at www.infineon.com.

Further Information:

Infineon Technologies AG

P.O. Box 80 09 49

D-81609 Muenchen

Germany
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Geographic Code:4EUGE
Date:Dec 9, 2002
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