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Industry Week brings it all together.


INDUSTRY WEEK BRINGS IT ALL TOGETHER. Several leading associations in the converting, packaging and related industries will come together for a major event, as H. A. Bruno, LLC, organizers of CPP EXPO Las Vegas, along with TAPPI TAPPI Technical Association of the Pulp and Paper Industry  and with PMMI's PACK EXPO-Las Vegas, plan Industry Week 2005 for September 26-28, 2005 in Las Vegas, Nevada, USA.

Registration for both expos, as well as TAPPI's PLACE and TAPPI's Corrugated cor·ru·gate  
v. cor·ru·gat·ed, cor·ru·gat·ing, cor·ru·gates

v.tr.
To shape into folds or parallel and alternating ridges and grooves.

v.intr.
 Packaging Conferences, is now open. Other participating associations are planning programs for their Annual Fall Meetings, while select associations' technical meetings will take place in conjunction with CPP EXPO at the Sands Expo & Convention Center.

Registrants for CPP EXPO may request details on all meetings, including: AIMCAL AIMCAL Association of Industrial Metallizers, Coaters and Laminators , CEMA CEMA Conveyor Equipment Manufacturers Association
CEMA Chef d'Etat-Major des Armees
CEMA Consumer Electronics Manufacturers Association
CEMA Canadian Egg Marketing Agency
CEMA Council for the Encouragement of Music and the Arts
, Adhesive & Sealant Council, RADTECH, AICC AICC anti-inhibitor coagulant complex.  (Regions I & II), Film and Bag Federation, Composite Can and Tube.

TAPPI's PLACE (polymers, laminations, adhesives, coatings and extrusions) Conference is expecting record attendance, while PACK EXPO-Las Vegas historically attracts more than 30,000 attendees. To register for CPP EXPO and for complete details, please visit www.cppexpo.com.
COPYRIGHT 2005 Paper Industry Management Association
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2005, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Title Annotation:MEETINGS
Publication:Solutions - for People, Processes and Paper
Date:Aug 1, 2005
Words:170
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