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Increasing Use of Electronics in Automobiles Spurs the Demand for ASIC, ASSP, and FPGAs.


DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c50122) announces the addition of Frost & Sullivan's new report World Automobile ASIC (Application Specific Integrated Circuit) Pronounced "a-sick." A chip that is custom designed for a specific application rather than a general-purpose chip such as a microprocessor.  ASSP (Application Specific Standard Part) An ASIC chip that is designed as a generic device for a particular market. Whereas an ASIC is typically used only by its creator, ASSPs are used by many different companies in the design of their products. See ASIC.  and FPGA (Field Programmable Gate Array) A type of gate array that is programmed in the field rather than in a semiconductor fab. Containing up to hundreds of thousands of gates, there are a variety of FPGA architectures on the market.  Markets to their offering.

This Frost & Sullivan research service titled World Automobile ASIC, ASSP, and FPGA markets provides forecast by geographic regions and analysis of the drivers and restraints for the market and challenges faced by the industry. In this research, Frost & Sullivan's expert analysts thoroughly examine the following markets: ASIC, ASSP, and FPGA, and also cover the main end-user segments such as body and chassis, central command, telematics, power train, engine control, safety and security, and driver information.

Increasing Use of Electronics in Automobiles Spurs the Demand for ASIC, ASSP, and FPGAs

The automobile application specific integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for  (ASIC), application specific standard products (ASSPs) and field programmable gate arrays (FPGAs) markets have witnessed significant increase owing to owing to
prep.
Because of; on account of: I couldn't attend, owing to illness.

owing to prepdebido a, por causa de 
 the growth of end-user markets and expanding applications of integrated circuits Integrated circuits

Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1.
 (ICs) in automobiles. Government pollution norms, safety and security regulations, and oil crisis have aided in the proliferation of electronic content in automobiles thereby, eliminating human errors.

Luxury features have also increased in automobiles requiring highly efficient solutions. Hence, there has been a direct impact on the ASIC, ASSP, and FPGA markets. Moreover, the hike in fuel prices in the world market has spurred the demand for electric and hybrid vehicles thereby boosting the growth of electronics in automobiles.

Mandatory Regulations and Integrated Solutions Propel the Adoption Rates of ASIC, ASSP, and FPGAs

Due to mandatory government regulations such as the electronic stability program (ESP (1) (Enhanced Service Provider) An organization that adds value to basic telephone service by offering such features as call-forwarding, call-detailing and protocol conversion. ), antilock an·ti·lock  
adj.
Of or being a motor vehicle braking system that electronically monitors and adjusts individual wheel speeds during braking to prevent the wheels from locking.
 braking system (ABS), and electronically controlled independent suspension, the European region is likely to generate substantial revenues. The Asian region is one of the fastest growing segments in the world with increasing sales of automobiles. "Sales of ASICs, ASSPs, and FPGAs have also improved due to integrated solutions, which have enabled automobile manufacturers to lower costs by reducing the number of microcontrollers in automobiles," observes the analyst of this research service.

However, there is high competition in the market especially among well-established segments such as ASIC and ASSP. Hence, there is a probability of the larger participants acquiring smaller design companies. "In addition, there is an increasing need to have an extensive portfolio of core designs, to develop world-class electronic design automation (EDA (1) (Electronic Design Automation) Using the computer to design, lay out, verify and simulate the performance of electronic circuits on a chip or printed circuit board. ) software tools, and to be proactively engaged with OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and  customers in accelerating the push toward higher market share for programmable logic devices (PLDs)," observes the analyst. "These capabilities can enable chipmakers to resist competition in the future." The automobile ASIC, ASSP, and FPGA markets are poised for significant growth as safety, security, engine control features, telematics, and driver information applications are likely to advance in the future.

Key Topics:

* Executive Summary

* Total Market for ASIC ASSP and FPGA in Automobiles

* World ASIC Market in Automobiles

* World ASSP Market in Automobile

* World FPGA Market In Automobile

* Appendix

For more information visit http://www.researchandmarkets.com/reports/c50122
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Publication:Business Wire
Date:Feb 9, 2007
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