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"Area Array Connectors: Transition to Lead-Free"

Authors: Heather McCormick, Alex Chan, Richard Coyle and Donald Harper; hmccormi@celestica.com.

Abstract: The Metro2 test vehicle aimed to assess the reliability of some new, Pb-free area array connectors. This paper summarizes findings in three key areas: the reliability of Pb-free area array connectors as compared with SnPb area array connectors, the effect of TV design variables on the reliability of the Pb-free connectors, and finally, the impact of repeated mating and unmating on the performance of the connectors in accelerated thermal cycling. Two different Pb-free mezzanine connectors and two versions of Pb-free area array backplane connectors were included on the Metro2 TV, which was subjected to 6000 cycles of accelerated thermal cycling from 0[degrees]C to 100[degrees]C in accordance with IPC-9701A. The results for the two mezzanine connectors are compared with the results from the original Metro TV, which used SnPb versions of these same connectors. Results from the original Metro TV suggested that design parameters may impact the reliability and/or failure mode of mezzanine connectors. The Metro2 TV was designed to assess the impact of changing the total stack height of the connector from 4 to 6 mm, and also the impact of changing the thickness of the daughtercard from 0.062" to 0.093". Thermal cycling results and failure modes are discussed. In some cases, such as high I/O connectors and multiple connectors, the mating and unmating forces on connectors can be substantial. A subset of TVs were subject to 25 mating and unmating cycles on the daughtercard, and 50 mating and unmating cycles on the backplane prior to being added to the chamber for thermal cycling to determine if the connector reliability was degraded by the forces experienced by the solder joints -in- the mating and unmating processes. (SMTA Pan Pac Microelectronics Symposium, February 2009)
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Copyright 2009 Gale, Cengage Learning. All rights reserved.

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Title Annotation:Technical Abstracts
Publication:Circuits Assembly
Date:Apr 1, 2009
Words:312
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