In case you missed it; packaging."Flip Chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done Integration of a Large Format Array of MOEMs Devices for Space Infrared Astronomy infrared astronomy, study of celestial objects by means of the infrared radiation they emit, in the wavelength range from about 1 micrometer to about 1 millimeter. All objects, from trees and buildings on the earth to distant galaxies, emit infrared (IR) radiation. " Authors: Christine A. Allen, John Abrahams John Abrahams is a First class and List A cricketer. He was born on 21st July 1952 in Salt River, Cape Town, Cape Province, South Africa and is a left handed batsman and right arm off break bowler. His brother Peter Abrahams and father Cec Abrahams are also cricketers. , Nick Costen, Larry Hess, Mary Li, Timothy Miller
Miller received his Ph.D. , S. Harvey Moseley, James Pontius, David Puckett, Eric Schulte and Christian Zincke Abstract: A large format micro-opto-electro-mechanical systems (MOEMS) array known as the Microshutter Array (MSA (Metropolitan Service Area) An urban area with at least 50,000 people plus surrounding counties. There are 306 MSAs and 428 RSAs (rural service areas) in the U.S. MSAs and RSAs are used to allocate cellular licenses. ). The completed MSA chip has electrical connections on the top and bottom of the chip to enable 2-D addressing of the array. Electrical and mechanical connection of the MSA device chip to the substrate containing the address circuitry is accomplished through a combination of room temperature single-sided indium bump bonding and conventional wire bonding processes. Traditional eutectic ball bonding is unsuitable because of temperature constraints on the fully fabricated MSA devices. Underfilled gold stud compression bonding has been applied, but results in undesirable issues such as punch-through shorting, lower than optimal interconnect yield, and warping of components upon cool down to the operating temperature. Indium bump bonding has proven an excellent solution for establishing highly reliable electrical and mechanical interconnects without the need for underfill. This paper presents design considerations, process overview, and test results, including launch simulation vibration testing. (SMTAI, September 2006) |
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