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In case you missed it: inspection.


"Measurement Variation in the Fill of Intrusively Reflowed Lead-Free Solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i.  Joints with Different Board Finishes by X-ray Inspection"

Abstract: This paper reports the results from percentage-fill measurements of intrusively reflowed Pb-free solder joints, where the same Pb-free alloy has been applied to boards with different finishes. Design rules, hole size and other factors associated with intrusive reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text.  defect elimination are outlined and compared with the intrusive reflow requirements per IPC-A-610D. Measurements were by x-ray inspection at oblique o·blique
adj.
Situated in a slanting position; not transverse or longitudinal.



oblique

slanting; inclined.
 angle views. Variation in the fill percentage of solder joints after reflow are discussed in terms of the nature of the board finishes used and the conditions applied when optimizing the pin-in-hole intrusive reflow process. (SMTAI, September 2005)

Authors: David Bernard, Ph.D., and Bob Willis Robert ("Bob") George Dylan Willis (born in Sunderland 30 May 1949) is a former cricketer who played for Surrey, Warwickshire, Northern Transvaal and England. He adopted his second middle name "Dylan" by deed poll in honour of his idol Bob Dylan. ; d.bernard@dage-group.com.
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Author:Willis, Bob
Publication:Circuits Assembly
Date:Sep 1, 2005
Words:127
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