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In case you missed it: components.


"Assembly and Reliability of High CTE Ceramic Land Grid Array The land grid array (LGA) is a type of surface-mount packaging used for integrated circuits. It can be electrically connected to a PCB either by the use of a socket or by soldering directly to the PCB. "

[TEXT NOT REPRODUCIBLE IN ASCII ASCII or American Standard Code for Information Interchange, a set of codes used to represent letters, numbers, a few symbols, and control characters. Originally designed for teletype operations, it has found wide application in computers. ]

Abstract: This paper outlines a high CTE ceramic LGA LGA
abbr.
large for gestational age


LGA Large for gestational age, see there
 SMT (1) (Surface Mount Technology) See surface mount.

(2) (Station ManagemenT) An FDDI network management protocol that provides direct management. Only one node requires the software.

SMT - Station Management
 assembly process and reliability study that was carried out using water soluble SnPb and no-clean Pb-free SnAgCu solder pastes. The test vehicle was a full array, 25 mm body, 360 I/O, 1.27 mm pitch flip-chip high CTE CLGA CLGA Ceramic Land Grid Array . Test vehicles were assembled to boards with four different stencil thickness and aperture diameter combinations. Solder paste volume was measured with a 3-D laser inspection tool. Assembly yields and observations for each combination will be reported. Extensive x-ray and cross-sectional analysis was carried out to characterize joint geometries and extent of voiding. The boards were placed into thermal cycling from 0[degrees] to 100[degrees]C until >50% failure, and post-cycling data and failure analysis results are also presented. (SMTAI, September 2005)

Author: Andrew Mawer, Thomas Koschmieder and David Mendez; andrew.mawer@freescale.com.

CIRCUITS ASSEMBLY provides abstracts of papers from recent industry conferences and company white papers. With the amount of information increasing, our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.
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Article Details
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Author:Mendez, David
Publication:Circuits Assembly
Date:Sep 1, 2005
Words:197
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