IXYS Introduces Advanced Technology in Isolated TO-220 Package That Increases Power Density.

Business Editors/High-Tech Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 7, 2001

IXYS Corporation (Nasdaq:SYXI), a technology leader in advanced power semiconductors for the electronic power industry, announced the introduction of an extended new family of power semiconductors in the new isolated TO-220 package. The new plastic package called ISOPLUS220, has the 'hole-less' TO-220 outline, however with a DCB ceramic leadframe, based on the IXYS ISOPLUS proprietary technology. The unique design of the package makes room for larger power semiconductor dice, which can control higher power than previously possible using the TO-220 package. The isolated DCB leadframe which can be patterned on the die side, enables a new class of devices in the ISOPLUS220, which further integrates multi-die circuits in the one package, for higher power density, reduced cost and enhanced performance.

The devices announced include new 'trench' technology Mosfets in the 55V and 75V range, with 100A to 200A ratings, and CoolMOS 600V power MOSFETs with 20A and 0.14 ohm ratings.

The package dramatically simplifies power semiconductor device assembly and may be mounted directly onto a heatsink with no isolation interface material because the isolation voltage rating of the mounting tab to the chip and its leads is 2500V(rms). The use of a DCB substrate in place of a copper lead frame has the following additional advantages:

      1. For the same chip area, the package will have the industry's
       lowest isolated thermal resistance junction-to-heatsink.

      2. The chip is soldered to DCB with a matching thermal expansion
       coefficient, thus the device will have increased temperature
       and power cycling capability.

      3. Stray junction-to-heatsink capacitance is reduced, thereby
       reducing radiated EMI in HF switching.

      4. The DCB lead frame enables additional circuits configurations,
       e.g. common anode connected FREDs, MOSFET plus Schottky diode,
       IGBT and a FRED for PFC circuits, etc.

      The first products available for sampling and prototyping are:

    Part Number         Description

    IXFC24N50           500V/24A MOSFET, RDS(on)= 0.23 ohm
    IXKC20N60C          600V CoolMOS, RDS(on)= 0.14 ohm
    IXUC100N055         55V Trench gate MOSFET, RDS(on)= 7.1 milliohm
    CS 19-12AC          1200V/19A thyristor
    DSEE 8-06CC         Two 300V/8A HiPerDYNE FREDs connected in
                        series
    DSEA/DSEC 29-06AC   Two 600V/16A HiPerFREDs connected common-anode
                        and common-cathode respectively
    DSS 20-01AC         100V/20A Schottky diode
    DSI 30-08AC         800V/30A rectifier diode

"With these innovative products we provide to our customers, higher power capability in an integrated mode in a standard small discrete package. It is an addition to our ISOPLUS product family which includes the ISOPLUS247 and the ISOPLUS I4-PAC that were introduced recently," added Dr. Nathan Zommer CEO.

The average selling prices of these devices range from $1.50 to $5.70 in 1000 piece quantities. For further information, contact your local authorized IXYS distributor or sales representative or IXYS Corporation at 408/982-0700, via fax at 408/496-0670, e-mail at [e-mail].

IXYS develops and markets primarily high performance power semiconductor devices that are used in controlling and converting electrical power efficiently in power systems for the telecommunication and internet infrastructure, motor drives, medical systems and transportation. IXYS also serves its markets with a combination of digital and analog integrated circuits.

Statements in this press release regarding IXYS' business that are not historical facts are "forward-looking statements" that involve risks and uncertainties, including, but not limited to demand for the Company's products, the ability of the company to develop, manufacture, and market new products, demand by end-users for the products produced by the Company's customers, and the other risks detailed from time to time in the Company's reports filed with the Securities and Exchange Commission. Further information on factors that could affect the Company's operations is detailed and included in the Company's Form 10-K, as filed with the Securities and Exchange Commission, which includes the IXYS Corporation audited financial statements as of March 31, 2000 and 1999. The Company undertakes no obligation to publicly release the results of any revisions to these forward-looking statements.

Additional information may be obtained by visiting IXYS' website at http://www.ixys.com, or by contacting the Company directly.

Note to Editors: In the symbol RDS(on) noted in this news release, the letters "DS(on)" are subscript. This may not appear properly in some systems.