ITRI Selects SUSS MicroTec Bonder Package To Expand Its MEMS and Nanotechnology Program.

Business Editors/High-Tech Writers

MUNICH, Germany--(BUSINESS WIRE)--March 17, 2004

SUSS MicroTec AG (FWB:SMH) ITRI, the leading Taiwanese Industrial Technology Research Institute, has selected SUSS MicroTec wafer and direct bonding equipment for expanding its MEMS and nanoscale activities. The multi tool order includes a combined cleaner and aligned direct bonder, a nanoPREP low temperature plasma activation unit and an 8" wafer bonder. In pre-acceptance tests all three SUSS tools demonstrated outstanding results. 200 ITRI wafers that were direct bonded on SUSS equipment at Max Planck Institute in Halle/Germany achieved a yield of 100 percent.

Wafer and direct bonding are enabling technologies for nanotechnology. They are used to create new substrate materials such as SOI (silicon on insulator), for wafer level 3D packaging and encapsulation of MEMS, RF MEMS and MOEMS.

"We are honored that the primary R&D Center for the industry in Taiwan has decided to develop parts of its strategic important nanotechnology program on SUSS equipment" explains Jeff Dumas, International Product Manager for Substrate Bonders at SUSS MicroTec. "ITRI has selected SUSS equipment because it is capable to perfectly support its MEMS and Nanotechnology Roadmap which ties close linkages to the strongest sets of Taiwan industries. All processes, developed on a semi automated SUSS tool are exactly transferable to one of our fully automated cluster configurations. This capability is essential for finding commercial uses for our novel technologies."

The SUSS bonder products portfolio including Wafer Bonders, Device Bonders, and Direct Bonders positions SUSS MicroTec as the most comprehensive bonder supplier in the semiconductor process equipment market. The SUSS CL200 direct bonder is unique in that it processes two substrates simultaneously, while its closed chamber atmosphere produces high yield and high throughput without post-clean contamination. When coupling the CL200 with nanoPREP, a novel method of surface conditioning under atmospheric pressure, bond energy and yield are further increased at annealing temperatures as low as 200(degree)C. The SUSS SB8 wafer bonder is capable to facilitate high device yields by providing superior process control, maintaining 1.5 percent uniformity of temperature setpoint across the wafer, which is twice the rate of uniformity provided by competitive tools.

About ITRI

The Industrial Technology Research Institute - ITRI - is a non-profit R&D organization engaging in applied research and technical service. It was founded in 1973 by the Ministry of Economic Affairs (MOEA) to attend to the technological needs of Taiwan's industrial development. ITRI has played a vital role in the transformation of the economy from an agriculture-based model to an industrial one. By year 2001 it has grown to a 6000 people operation, and serves as the technical center for industry and an unofficial arm of the government's industrial policies in Taiwan. Backed by its broad research scope and close industrial ties, ITRI is becoming an increasingly active member in the global industrial R&D community. www.itri.org.tw

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange. www.suss.com

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.